Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Reliability Assessment of No-clean and Water-soluble Solder Pastes Part II
Looking back twenty-five years ago,the solder pastes residues had to be cleaned after reflow due to their corrosive nature; two ways of cleaning were possible,either with solvent or by using wa
.. weiterlesen
Reliability Assessment of No-clean and Water-soluble Solder Pastes Part II
Looking back twenty-five years ago,the solder pastes residues had to be cleaned after reflow due to their corrosive nature; two ways of cleaning were possible,either with solvent or by using wa
.. weiterlesen
The Effect of Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues
An estimated 80% of all SMT assembly in the world is performed with a no-clean soldering process,largely due to the
predominance of consumer-type electronics. The continuing trend of increasing
.. weiterlesen
Low Cost High Reliability Assembly of POP with Novel Epoxy Flux on Solder Paste
A novel epoxy flux was developed with good compatibility with no-clean solder pastes,which imparts high reliability for BGA assembly at a low cost. This compatibility with solder pastes is achi
.. weiterlesen
An Investigation into Printing Miniaturised Devices for the Automotive and Industrial Manufacturing Sectors
The electronics market is divided into many segments each having its own challenges; but one theme that connects the electronics community together is a need for higher yield with lower costs.
.. weiterlesen
Enclosed Media Printing as an Alternative to Metal Blades
Fine pitch/fine feature solder paste printing in PCB assembly has become increasingly difficult as board geometries have become ever more compact. The printing process itself,traditionally the
.. weiterlesen
Cost Comparison of Complex PCB fabrication Using Traditional Sequential Lamination Methods versus Interconnect with Conductive Paste
As feature sizes are driven to be smaller,the cost of PCB fabrication is driven higher. In particular,sequential lamination of complex circuit boards is a time consuming and expensive process.
.. weiterlesen
Effect of Microwave Plasma Surface Treatement for Improved Adhesion Strength of Direct Copper Plating on Polterafluoroethylene (PTFE)
The purpose of this study is to investigate the effect of plasma surface modification to improve adhesion strength between polytetrafluoroethylene (PTFE) and directly plated electroless copper.
.. weiterlesen
Harnessing Technology for the Warfighter
Mr. Craig Herndon & Mr. Roger Smith will be discussing the Navy’s assignment as the DoD Executive Agent for Printed Circuit Board (PrCB) Technology and its role in ensuring that viable military
.. weiterlesen
From Off-Shoring to On-Shoring to Regional Strategy
Since the late 1990s,the globalization of the electronics industry has put North American and European manufacturers in competition with manufacturers in China and other low-labor-cost areas.
.. weiterlesen
The Return to Regionalization for Electronics Manufacturing
One of the more notable trends in the data on electronics manufacturing over the past several years has been a return to regionalization. Defined as building in region for region,this trend is
.. weiterlesen
Position Accuracy Machines for Selective Soldering Fine Pitch Components
The drive towards fine pitch technology also affects the soldering processes. Selective soldering is a reliable soldering process for THT (through hole) connectors and offers a wide process win
.. weiterlesen
Study of Various PCBA Surface Finishes
In this study various printed circuit board surface finishes were evaluated,including: organic solderability preservative (OSP),plasma finish (PF),immersion silver (IAg),electroless nickel / im
.. weiterlesen
Reliability Screening of Lower Melting Point Pb-Free Alloys Containing Bi
This paper is the second of two papers discussing the companies Lower Melt Alloy program. The first paper was presented at IPC APEX2013. The program explores the manufacturability and reliabili
.. weiterlesen
Voiding and Drop Test Performance of Lead-Free Low Melting and Medium Melting Mixed Alloy BGA Assembly
Low melting 57Bi42Sn1Ag (BiSnAg) was explored for replacing SAC solders as a low-cost solution. In this study,BGAs with SAC105,SAC305,and BiSnAg balls were assembled with SAC105,SAC305 or 57Bi4
.. weiterlesen
HALT Testing of Backward Soldered BGAs on a Military Product
The move to lead free (Pb-free) electronics by the commercial industry has resulted in an increasing number of ball grid array components (BGAs) which are only available with Pb-free solder bal
.. weiterlesen
Sample Preparation for Mitigating Tin Whiskers in Alternative Lead-Free Alloys
As lead-free alloys shift into high reliability electronics,the issue of tin whisker growth remains a primary concern among those in the industry. Current research shows that there is no perfec
.. weiterlesen
Gold Stud Bump Flip Chip Bonding on Molded Interconnect Devices
A molded interconnect device (MID) is an injection molded thermoplastic substrate which incorporates a conductive circuit pattern and integrates both mechanical and electrical functions. The th
.. weiterlesen
Packaging Technology and Design Challenge for Fine Pitch Micro-Bump Cu-Pillar and BOT (Direct Bond on Substrate-Trace) Using TCNCP (Thermal Compression...
The companies writing this paper have jointly developed Copper (Cu) Pillar micro-bump and TCNCP(Thermal Compression with Non-Conductive Paste) technology over the last two+ years. The Cu Pillar
.. weiterlesen
Study on Solder Joint Reliability of Fine Pitch CSP
Nowadays,consumer electronic product is characterized with miniature,portable,light and high performance,especially for 3G mobile products. More and more fine pitch CSPs (0.4mm) come forth as t
.. weiterlesen
Stereo Vision Based Automated Solder Ball Height Detection
Solder ball height inspection is essential to the detection of potential connectivity issues in semi-conductor units. Current ball height inspection tools such as laser profiling,fringe project
.. weiterlesen
Implementing Robust Bead Probe Test Processes into Standard Pb-Free Assembly
Increasing system integration and component densities continue to significantly reduce the opportunity to access nets using standard test points. Over time the size of test points has been dras
.. weiterlesen
Boundary-Scan Project Phase 3:Investigation into Challenges of using .BSDL Files
The number one issue identified by the 2009 iNEMI Boundary-Scan survey was problems with obtaining correct and compliant boundary-scan description language (.bsdl) files from the semiconductor
.. weiterlesen
Boundary-Scan Project Phase 3: Investigation into Challenges of using .BSDL Files
The number one issue identified by the 2009 iNEMI Boundary-Scan survey was problems with obtaining correct and compliant boundary-scan description language (.bsdl) files from the semiconductor
.. weiterlesen
Board-Assist Built-In Self-Test (BA-BIST),Short-Term and Long-Term Strategies for Use Case Standardization
This iNEMI program's focus is on a “Chip” Built-in Self-Test (BIST) study and its promotion for board and system-level applications. In this case,This study has 2 strategic focus areas – short
.. weiterlesen
Good Product Quality Comes From Good Design for Test Strategies
Product quality can be improved through proper application of design for test (DFT) strategies. With today’s shrinking product sizes and increasing functionality,it is difficult to get good tes
.. weiterlesen
Advanced Printing for Microelectronic Packaging
Using micro-dispensing with exceptional volume control it is possible to print in 3D space a wide variety of materials and including solders,epoxies,conductive adhesives and ceramic filled poly
.. weiterlesen
Substrates: Polyester Film for the Flexible Electronics Industry
Polyester film substrates have been widely used in making flexible / printed electronic devices for over 30 years. However the early 2000’s brought about an explosion of interest in “additive”
.. weiterlesen
Digitally Printed Battery: Transitioning from a Traditional Coated Battery Design to a Digitally Printed Battery; Advantages,Challenges and Successes
The company is a producer of thin film batteries of less than 0.45mm in thickness. Battery operated devices have grown
smaller and smaller while energy demands have increased as the need for in
.. weiterlesen
Reliability Assessment of No-clean and Water-soluble Solder Pastes Part II
Looking back twenty-five years ago,the solder pastes residues had to be cleaned after reflow due to their corrosive nature; two ways of cleaning were possible,either with solvent or by using wa
.. weiterlesen
Reliability Assessment of No-clean and Water-soluble Solder Pastes Part II
Looking back twenty-five years ago,the solder pastes residues had to be cleaned after reflow due to their corrosive nature; two ways of cleaning were possible,either with solvent or by using wa
.. weiterlesen
The Effect of Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues
An estimated 80% of all SMT assembly in the world is performed with a no-clean soldering process,largely due to the
predominance of consumer-type electronics. The continuing trend of increasing
.. weiterlesen
Low Cost High Reliability Assembly of POP with Novel Epoxy Flux on Solder Paste
A novel epoxy flux was developed with good compatibility with no-clean solder pastes,which imparts high reliability for BGA assembly at a low cost. This compatibility with solder pastes is achi
.. weiterlesen
An Investigation into Printing Miniaturised Devices for the Automotive and Industrial Manufacturing Sectors
The electronics market is divided into many segments each having its own challenges; but one theme that connects the electronics community together is a need for higher yield with lower costs.
.. weiterlesen
Enclosed Media Printing as an Alternative to Metal Blades
Fine pitch/fine feature solder paste printing in PCB assembly has become increasingly difficult as board geometries have become ever more compact. The printing process itself,traditionally the
.. weiterlesen
Cost Comparison of Complex PCB fabrication Using Traditional Sequential Lamination Methods versus Interconnect with Conductive Paste
As feature sizes are driven to be smaller,the cost of PCB fabrication is driven higher. In particular,sequential lamination of complex circuit boards is a time consuming and expensive process.
.. weiterlesen
Effect of Microwave Plasma Surface Treatement for Improved Adhesion Strength of Direct Copper Plating on Polterafluoroethylene (PTFE)
The purpose of this study is to investigate the effect of plasma surface modification to improve adhesion strength between polytetrafluoroethylene (PTFE) and directly plated electroless copper.
.. weiterlesen
Harnessing Technology for the Warfighter
Mr. Craig Herndon & Mr. Roger Smith will be discussing the Navy’s assignment as the DoD Executive Agent for Printed Circuit Board (PrCB) Technology and its role in ensuring that viable military
.. weiterlesen
From Off-Shoring to On-Shoring to Regional Strategy
Since the late 1990s,the globalization of the electronics industry has put North American and European manufacturers in competition with manufacturers in China and other low-labor-cost areas.
.. weiterlesen
The Return to Regionalization for Electronics Manufacturing
One of the more notable trends in the data on electronics manufacturing over the past several years has been a return to regionalization. Defined as building in region for region,this trend is
.. weiterlesen
Position Accuracy Machines for Selective Soldering Fine Pitch Components
The drive towards fine pitch technology also affects the soldering processes. Selective soldering is a reliable soldering process for THT (through hole) connectors and offers a wide process win
.. weiterlesen
Study of Various PCBA Surface Finishes
In this study various printed circuit board surface finishes were evaluated,including: organic solderability preservative (OSP),plasma finish (PF),immersion silver (IAg),electroless nickel / im
.. weiterlesen
Reliability Screening of Lower Melting Point Pb-Free Alloys Containing Bi
This paper is the second of two papers discussing the companies Lower Melt Alloy program. The first paper was presented at IPC APEX2013. The program explores the manufacturability and reliabili
.. weiterlesen
Voiding and Drop Test Performance of Lead-Free Low Melting and Medium Melting Mixed Alloy BGA Assembly
Low melting 57Bi42Sn1Ag (BiSnAg) was explored for replacing SAC solders as a low-cost solution. In this study,BGAs with SAC105,SAC305,and BiSnAg balls were assembled with SAC105,SAC305 or 57Bi4
.. weiterlesen
HALT Testing of Backward Soldered BGAs on a Military Product
The move to lead free (Pb-free) electronics by the commercial industry has resulted in an increasing number of ball grid array components (BGAs) which are only available with Pb-free solder bal
.. weiterlesen
Sample Preparation for Mitigating Tin Whiskers in Alternative Lead-Free Alloys
As lead-free alloys shift into high reliability electronics,the issue of tin whisker growth remains a primary concern among those in the industry. Current research shows that there is no perfec
.. weiterlesen
Gold Stud Bump Flip Chip Bonding on Molded Interconnect Devices
A molded interconnect device (MID) is an injection molded thermoplastic substrate which incorporates a conductive circuit pattern and integrates both mechanical and electrical functions. The th
.. weiterlesen
Packaging Technology and Design Challenge for Fine Pitch Micro-Bump Cu-Pillar and BOT (Direct Bond on Substrate-Trace) Using TCNCP (Thermal Compression...
The companies writing this paper have jointly developed Copper (Cu) Pillar micro-bump and TCNCP(Thermal Compression with Non-Conductive Paste) technology over the last two+ years. The Cu Pillar
.. weiterlesen
Study on Solder Joint Reliability of Fine Pitch CSP
Nowadays,consumer electronic product is characterized with miniature,portable,light and high performance,especially for 3G mobile products. More and more fine pitch CSPs (0.4mm) come forth as t
.. weiterlesen
Stereo Vision Based Automated Solder Ball Height Detection
Solder ball height inspection is essential to the detection of potential connectivity issues in semi-conductor units. Current ball height inspection tools such as laser profiling,fringe project
.. weiterlesen
Implementing Robust Bead Probe Test Processes into Standard Pb-Free Assembly
Increasing system integration and component densities continue to significantly reduce the opportunity to access nets using standard test points. Over time the size of test points has been dras
.. weiterlesen
Boundary-Scan Project Phase 3:Investigation into Challenges of using .BSDL Files
The number one issue identified by the 2009 iNEMI Boundary-Scan survey was problems with obtaining correct and compliant boundary-scan description language (.bsdl) files from the semiconductor
.. weiterlesen
Boundary-Scan Project Phase 3: Investigation into Challenges of using .BSDL Files
The number one issue identified by the 2009 iNEMI Boundary-Scan survey was problems with obtaining correct and compliant boundary-scan description language (.bsdl) files from the semiconductor
.. weiterlesen
Board-Assist Built-In Self-Test (BA-BIST),Short-Term and Long-Term Strategies for Use Case Standardization
This iNEMI program's focus is on a “Chip” Built-in Self-Test (BIST) study and its promotion for board and system-level applications. In this case,This study has 2 strategic focus areas – short
.. weiterlesen
Good Product Quality Comes From Good Design for Test Strategies
Product quality can be improved through proper application of design for test (DFT) strategies. With today’s shrinking product sizes and increasing functionality,it is difficult to get good tes
.. weiterlesen
Advanced Printing for Microelectronic Packaging
Using micro-dispensing with exceptional volume control it is possible to print in 3D space a wide variety of materials and including solders,epoxies,conductive adhesives and ceramic filled poly
.. weiterlesen
Substrates: Polyester Film for the Flexible Electronics Industry
Polyester film substrates have been widely used in making flexible / printed electronic devices for over 30 years. However the early 2000’s brought about an explosion of interest in “additive”
.. weiterlesen
Digitally Printed Battery: Transitioning from a Traditional Coated Battery Design to a Digitally Printed Battery; Advantages,Challenges and Successes
The company is a producer of thin film batteries of less than 0.45mm in thickness. Battery operated devices have grown
smaller and smaller while energy demands have increased as the need for in
.. weiterlesen