Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Acceptance Testing of Low-Ag Reflow Solder Alloys
Since the implementation of the European Union RoHS directive in 2006,the electronics industry has seen an expansion of available low-silver lead (Pb)-free alloys for wave soldering,miniwave re
.. weiterlesen
Reliability Study of Low Silver Alloy Solder Pastes
Sn3.0Ag0.5Cu (SAC305) is currently the most popular near eutectic lead-free alloy used in the manufacturing processes. Over the last several years,the price of silver has dramatically increased
.. weiterlesen
Investigation of Low Temperature Solders to Reduce Reflow Temperature,Improve SMT Yields,and Realize Energy Savings
The miniaturization of electronic devices demands the continued shrinking of system z-height. A significant consequence of these ultra-thin systems is yield loss due to high temperature warpage
.. weiterlesen
Streamlining PCB Assembly and Test NPI with Shared Component Libraries
PCB assembly designs become more complex year-on-year,yet early-stage form/fit compliance verification of all designed-in components to the intended manufacturing processes remains a challenge.
.. weiterlesen
Flexibility Testing of Printed and Wearable Electronics
•Introduction to printed and wearable electronics
•Flexibility testing challenges
•Proposals for flexibility testing
•Validation case studies
•Future work
.. weiterlesen
Sustainable Product Design and Supplier Material Disclosure
Sustainable product design and the task of bringing new,earth friendly products to market is a top priority for corporate leaders in the manufacturing industry. By not reaching their compliance
.. weiterlesen
Rigid-Flex PCB Right the First Time - Without Paper Dolls
The biggest problem with designing rigid-flex hybrid PCBs is making sure everything will fold in the right way,while maintaining good flex-circuit stability and lifespan. The next big problem t
.. weiterlesen
Selective Reflow Rework Process
In the rework environment,most equipment and procedures are designed for low volume repair/rework process. When a high volume rework is needed,the challenges begin. For example,a long cycle tim
.. weiterlesen
Effectiveness of Different Materials as Heat Shields during Reflow/Rework
As device density continues to maximize the PCB real estate the reflowing of neighboring components or damaging of heat-sensitive components in the rework process continues to cause problems. D
.. weiterlesen
Investigation into Challenges of using .BSDL Files: iNEMI Survey Results and Conclusions
The number one issue identified by the 2009 International Electronics Manufacturing Initiative (iNEMI) Boundary-Scan survey was problems with obtaining correct and compliant boundary-scan descr
.. weiterlesen
Causes and Costs of No Fault Found Events
No-Fault-Found (NFF) events occur when a system level test,such as built-in test (BIT),indicates a failure but no such failure is found during repair. With more electronics continuously monitor
.. weiterlesen
3D Assembly Processes a Look at Today and Tomorrow
The world of electronics continues to increase functional densities on products. One of the ways to increase density of a product is to utilize more of the 3 dimensional spaces available. Tradi
.. weiterlesen
New Approaches to Develop a Scalable 3D IC Assembly Method
The challenge for 3D IC assembly is how to manage warpage and thin wafer handling in order to achieve a high assembly yield and to ensure that the final structure can pass the specified reliabi
.. weiterlesen
Control of the Underfill of Surface Mount Assemblies by Non-Destructive Techniques
Underfilling is a long-standing process issued from the micro-electronics that can enhance the robustness and the reliability of first or second-level interconnects for a variety of electronic
.. weiterlesen
A Lower Temperature Solder Joint Encapsulant for Sn/Bi Applications
The electronic industry is currently very interested in low temperature soldering processes such as using Sn/Bi alloy to improve process yield,eliminate the head-in-pillow effect,and enhance re
.. weiterlesen
Re-Shoring or Near-Shoring Concepts Should be Strongly Considered when the OEM's Goal is to Deliver Optimum Balance Between Landed Cost...
The old tactic of outsourcing to a low cost geography simply to deliver lowest cost direct and indirect labor was never a panacea supply chain solution. In fact,when evaluating solutions for lo
.. weiterlesen
How Reshoring Drives Profitability
For many years,manufacturing has sought to increase competitiveness by moving off-shore to countries with lower labour costs. Electronic manufacturing services (EMS) companies provided an essen
.. weiterlesen
Influence of Salt Residues on BGA Head in Pillow
The oxide layers are known as wetting inhibitors in component and PCB metallizations. The oxide acts as barrier that prevent the tin diffusion from happening. Besides,in corrosion studies,the r
.. weiterlesen
Refining Stencil Design to Counter HiP Defects
Head-In-Pillow (HIP) defects,in which the BGA solder balls and paste deposit come in contact but do not coalesce,have proven to be a major problem since transitioning to RoHS soldering. Compone
.. weiterlesen
Testing Printed Circuit Boards for Creep Corrosion in Flowers of Sulfur Chamber: Phase 2A
The iNEMI technical subcommittee on creep corrosion is developing a flowers-of-sulfur (FOS) based qualification test for creep corrosion on printed-circuit boards (PCBs). In phase 1 of the proj
.. weiterlesen
How Clean is Clean Enough - At What Level Does Each of the Individual Contaminants Cause Leakage and Corrosion...
In this investigation a test matrix was completed utilizing 900 electrodes (small circuit board with parallel copper traces on FR-4 with LPI soldermask at 6,10 and 50 mil spacing): 12 ionic con
.. weiterlesen
IPC-CC-830B Versus the 'Real World': Part 2
Conformal Coatings are often used to increase the reliability of electronic assemblies operating in harsh or corrosive environments where the product would otherwise fail prematurely. Conformal
.. weiterlesen
Ultrathin Fluoropolymer Coatings to Mitigate Damage of Printed Circuit Boards Due to Environmental Exposure
As consumers become more reliant on their handheld electronic devices and take them into new environments,devices are increasingly exposed to situations that can cause failure. In response,the
.. weiterlesen
Influence of Plating Quality on Reliability of Microvias
Advances in miniaturized electronic devices have led to the evolution of microvias in high density interconnect (HDI) circuit boards from single-level to stacked structures that intersect multi
.. weiterlesen
Long term Thermal Reliability of Printed Circuit Board Materials
This paper describes the purpose,methodology,and results to date of thermal endurance testing performed at the company. The intent of this thermal aging testing is to establish long term reliab
.. weiterlesen
Review of Interconnect Stress Testing Protocols and Their Effectiveness in Screening Microvias
The use of microvias in Printed Circuit Boards (PCBs) for military hardware is increasing as technology drives us toward smaller pitches and denser circuitry. Along with the changes in technolo
.. weiterlesen
Flexible Circuit Materials for High Temperature Applications
Many opportunities exist for flexible circuits in high temperature applications (Automotive,Military,Aerospace,Oil and Gas). Flex circuits in these applications have been hindered by a lack of
.. weiterlesen
Analysis of Laminate Properties for Correlation to Pad Cratering
Pad cratering failure has emerged due to the transition from traditional SnPb to SnAgCu alloys in soldering of printed circuit assemblies. Pb-free-compatible laminate materials in the printed c
.. weiterlesen
Thermally,Electrically Conductive Adhesive Manages to Control Heat in PCBs
Thermal management is a critical element in the design and manufacturing of printed circuit boards (PCBs) for a wide range of applications. Quite simply,heat can be destructive. The more effect
.. weiterlesen
Acceptance Testing of Low-Ag Reflow Solder Alloys
Since the implementation of the European Union RoHS directive in 2006,the electronics industry has seen an expansion of available low-silver lead (Pb)-free alloys for wave soldering,miniwave re
.. weiterlesen
Reliability Study of Low Silver Alloy Solder Pastes
Sn3.0Ag0.5Cu (SAC305) is currently the most popular near eutectic lead-free alloy used in the manufacturing processes. Over the last several years,the price of silver has dramatically increased
.. weiterlesen
Investigation of Low Temperature Solders to Reduce Reflow Temperature,Improve SMT Yields,and Realize Energy Savings
The miniaturization of electronic devices demands the continued shrinking of system z-height. A significant consequence of these ultra-thin systems is yield loss due to high temperature warpage
.. weiterlesen
Streamlining PCB Assembly and Test NPI with Shared Component Libraries
PCB assembly designs become more complex year-on-year,yet early-stage form/fit compliance verification of all designed-in components to the intended manufacturing processes remains a challenge.
.. weiterlesen
Flexibility Testing of Printed and Wearable Electronics
•Introduction to printed and wearable electronics
•Flexibility testing challenges
•Proposals for flexibility testing
•Validation case studies
•Future work
.. weiterlesen
Sustainable Product Design and Supplier Material Disclosure
Sustainable product design and the task of bringing new,earth friendly products to market is a top priority for corporate leaders in the manufacturing industry. By not reaching their compliance
.. weiterlesen
Rigid-Flex PCB Right the First Time - Without Paper Dolls
The biggest problem with designing rigid-flex hybrid PCBs is making sure everything will fold in the right way,while maintaining good flex-circuit stability and lifespan. The next big problem t
.. weiterlesen
Selective Reflow Rework Process
In the rework environment,most equipment and procedures are designed for low volume repair/rework process. When a high volume rework is needed,the challenges begin. For example,a long cycle tim
.. weiterlesen
Effectiveness of Different Materials as Heat Shields during Reflow/Rework
As device density continues to maximize the PCB real estate the reflowing of neighboring components or damaging of heat-sensitive components in the rework process continues to cause problems. D
.. weiterlesen
Investigation into Challenges of using .BSDL Files: iNEMI Survey Results and Conclusions
The number one issue identified by the 2009 International Electronics Manufacturing Initiative (iNEMI) Boundary-Scan survey was problems with obtaining correct and compliant boundary-scan descr
.. weiterlesen
Causes and Costs of No Fault Found Events
No-Fault-Found (NFF) events occur when a system level test,such as built-in test (BIT),indicates a failure but no such failure is found during repair. With more electronics continuously monitor
.. weiterlesen
3D Assembly Processes a Look at Today and Tomorrow
The world of electronics continues to increase functional densities on products. One of the ways to increase density of a product is to utilize more of the 3 dimensional spaces available. Tradi
.. weiterlesen
New Approaches to Develop a Scalable 3D IC Assembly Method
The challenge for 3D IC assembly is how to manage warpage and thin wafer handling in order to achieve a high assembly yield and to ensure that the final structure can pass the specified reliabi
.. weiterlesen
Control of the Underfill of Surface Mount Assemblies by Non-Destructive Techniques
Underfilling is a long-standing process issued from the micro-electronics that can enhance the robustness and the reliability of first or second-level interconnects for a variety of electronic
.. weiterlesen
A Lower Temperature Solder Joint Encapsulant for Sn/Bi Applications
The electronic industry is currently very interested in low temperature soldering processes such as using Sn/Bi alloy to improve process yield,eliminate the head-in-pillow effect,and enhance re
.. weiterlesen
Re-Shoring or Near-Shoring Concepts Should be Strongly Considered when the OEM's Goal is to Deliver Optimum Balance Between Landed Cost...
The old tactic of outsourcing to a low cost geography simply to deliver lowest cost direct and indirect labor was never a panacea supply chain solution. In fact,when evaluating solutions for lo
.. weiterlesen
How Reshoring Drives Profitability
For many years,manufacturing has sought to increase competitiveness by moving off-shore to countries with lower labour costs. Electronic manufacturing services (EMS) companies provided an essen
.. weiterlesen
Influence of Salt Residues on BGA Head in Pillow
The oxide layers are known as wetting inhibitors in component and PCB metallizations. The oxide acts as barrier that prevent the tin diffusion from happening. Besides,in corrosion studies,the r
.. weiterlesen
Refining Stencil Design to Counter HiP Defects
Head-In-Pillow (HIP) defects,in which the BGA solder balls and paste deposit come in contact but do not coalesce,have proven to be a major problem since transitioning to RoHS soldering. Compone
.. weiterlesen
Testing Printed Circuit Boards for Creep Corrosion in Flowers of Sulfur Chamber: Phase 2A
The iNEMI technical subcommittee on creep corrosion is developing a flowers-of-sulfur (FOS) based qualification test for creep corrosion on printed-circuit boards (PCBs). In phase 1 of the proj
.. weiterlesen
How Clean is Clean Enough - At What Level Does Each of the Individual Contaminants Cause Leakage and Corrosion...
In this investigation a test matrix was completed utilizing 900 electrodes (small circuit board with parallel copper traces on FR-4 with LPI soldermask at 6,10 and 50 mil spacing): 12 ionic con
.. weiterlesen
IPC-CC-830B Versus the 'Real World': Part 2
Conformal Coatings are often used to increase the reliability of electronic assemblies operating in harsh or corrosive environments where the product would otherwise fail prematurely. Conformal
.. weiterlesen
Ultrathin Fluoropolymer Coatings to Mitigate Damage of Printed Circuit Boards Due to Environmental Exposure
As consumers become more reliant on their handheld electronic devices and take them into new environments,devices are increasingly exposed to situations that can cause failure. In response,the
.. weiterlesen
Influence of Plating Quality on Reliability of Microvias
Advances in miniaturized electronic devices have led to the evolution of microvias in high density interconnect (HDI) circuit boards from single-level to stacked structures that intersect multi
.. weiterlesen
Long term Thermal Reliability of Printed Circuit Board Materials
This paper describes the purpose,methodology,and results to date of thermal endurance testing performed at the company. The intent of this thermal aging testing is to establish long term reliab
.. weiterlesen
Review of Interconnect Stress Testing Protocols and Their Effectiveness in Screening Microvias
The use of microvias in Printed Circuit Boards (PCBs) for military hardware is increasing as technology drives us toward smaller pitches and denser circuitry. Along with the changes in technolo
.. weiterlesen
Flexible Circuit Materials for High Temperature Applications
Many opportunities exist for flexible circuits in high temperature applications (Automotive,Military,Aerospace,Oil and Gas). Flex circuits in these applications have been hindered by a lack of
.. weiterlesen
Analysis of Laminate Properties for Correlation to Pad Cratering
Pad cratering failure has emerged due to the transition from traditional SnPb to SnAgCu alloys in soldering of printed circuit assemblies. Pb-free-compatible laminate materials in the printed c
.. weiterlesen
Thermally,Electrically Conductive Adhesive Manages to Control Heat in PCBs
Thermal management is a critical element in the design and manufacturing of printed circuit boards (PCBs) for a wide range of applications. Quite simply,heat can be destructive. The more effect
.. weiterlesen