Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Anzeige
Rework Challenges for Smart Phones and Tablets
Smart phones are complex,costly devices and therefore need to be reworked correctly the first time.
In order to meet the ever-growing demand for performance,the complexity of mobile devices has
.. weiterlesen
Semi Quantitative Method for Assessing the Reworkability of Different Underfills
The choice and optimisation of underfills to maximise process productivity and end product performance has been widely studied,and generated numerous performance criteria,flow time cure schedul
.. weiterlesen
Effects of Dielectric Material,Aspect Ratio and Copper Plating on Microvia Reliability
This paper documents test data on the effects of materials and processes on microvia structures. Thirteen sets of experiments were carried out to evaluate the effects of dielectric material,asp
.. weiterlesen
Simulation of the Influence of Manufacturing Quality on Thermomechanical Stress of Microvias
The advancement of area-array packages,such as flip chips and chip scale packages,has driven the adoption of high density interconnects (HDIs) that allow for an increased number of I/Os with a
.. weiterlesen
“Reliability of Stacked Microvia”
Reliability of Microvia has been a concern since microvias were introduced to our industry. This study was designed to understand the reliability of Type 1,Type 2,and Type 3 Microvias. Reliabil
.. weiterlesen
Predicting Fatigue of Solder Joints Subjected to High Number of Power Cycles
Solder joint reliability of SMT components connected to printed circuit boards is well documented. However,much of the
testing and data is related to high-strain energy thermal cycling experime
.. weiterlesen
Design for Reliability: Improving Reliability of Plastic Encapsulated Ocean Technology Products by Understanding Moisture Ingress through FEA Simulation
Remote sensing products designed for ocean environments sustain the harshness of cold oceans. The reliability of these telemetry devices needs to be very high to measure,collect and transmit da
.. weiterlesen
A Control-Chart Based Method for Solder Joint Crack Detection
Many researchers have used different failure criteria in the published solder joint reliability studies. Since the reported timeto-
failure would be different if different failure criteria were
.. weiterlesen
What is Kelvin Test?
The PCB industry is ever changing and adapting to new technologies. OEM specifications and requirements have also advanced due to these technologies. In some cases the OEMs are asking for a low
.. weiterlesen
Electrical Testing of Passive Components
Substrates have become more critical with regard to pitch and density in today’s designs with challenges for passive components in terms of surface placement. This negates the opportunity for h
.. weiterlesen
Preparing for Increased Electrostatic Discharge Device Sensitivity
With the push for ever improving performance on semiconductor component I/O interfaces,semiconductor components are being driven into a realm which makes them more sensitive to electrostatic di
.. weiterlesen
Electrostatic Discharge (ESD),Factory Issues,Measurement Methods and Product Quality – Roadmaps and Solutions for 2025 to 2030
The number of failures caused by electrostatic discharges (ESD) has been increasing for some time now. So,it is necessary for everyone,who handles electrostatic sensitive devices (ESDS),to know
.. weiterlesen
Specialized Materials for Printed Electronics
In the area of Printed Electronics,there are a number of functional materials that can include conductors,Semi-conductors,dielectrics,barriers,and adhesives. There are also a smaller subset of
.. weiterlesen
The Total Environmental Solution For Any-Layer HDI Production
Copper Via-Fill application in acid copper plating of PWB is experiencing a significant growth due to the booming of smartphone and tablet PC. With this growth,the PC board demand of HDI comple
.. weiterlesen
The Perfect Copper Surface
In order to provide the functionality in today’s electronics,printed circuit boards are approaching the complexity of semiconductors. For flexible circuits with 1 mil lines and spaces,this mean
.. weiterlesen
Final Finish Specifications Review IPC Plating Sub-committee 4-14
An IPC specification is a consensus document that specifies attributes relevant to the plated surface. Plating specifications are designed to be applicable to a wide range of products types. A
.. weiterlesen
Signal Transmission Loss due to Copper Surface Roughness in
Higher-speed signal transmission is increasingly required on a printed circuit board to handle massive data in electronic systems. So,signal transmission loss of copper wiring on a printed circ
.. weiterlesen
Beyond 0402M Placement: Process Considerations for 03015M Microchip Mounting
The printed circuit board assembly industry has long embraced the “Smaller,Lighter,Faster” mantra for electronic devices,especially in our ubiquitous mobile devices. As manufacturers increase s
.. weiterlesen
Miniaturization with Help of Reduced Component to Component Spacing
Miniaturization and the integration of a growing number of functions in portable electronic devices require an extremely high packaging density for the active and passive components. There are
.. weiterlesen
Challenges of Manufacturing with Printed Circuit Board Cavities
Cavity technology in a Printed Circuit Board (PCB) has existed for many years. The methodology to create the cavity in the PCB has evolved over time as technologies have advanced and the manufa
.. weiterlesen
Alternative Concepts for High Speed,High Frequency and Signal Integration into the PCB
Transmission of data is a major driver in the electronics industry. Higher data volumes,high speed data transfer and short time signal transmission have to be realized to meet these requirement
.. weiterlesen
Printing of Solder Paste – A Quality Assurance Methodology
Solder paste printing is known to be one of the most difficult processes to quality assure in electronic manufacturing. The challenge increases as the technology development moves toward a mix
.. weiterlesen
Jetting Strategies for mBGAs a question of give and take...
The demands on volume delivery and positioning accuracy for solder paste deposits are increasing as the size and complexity of circuits continue to develop in the electronics industry. Accordin
.. weiterlesen
Implementing Embedded Component from Concept-To-Manufacturing
The utilization of embedded components has increased across many applications in various industries,and with rapid emergence of technologies and the need to secure IP,new methodologies are bein
.. weiterlesen
Embedded Components: A Comparative Analysis of Reliability Part II
In light of new process and product technologies in the field of embedded components,questions arise with respect to advantages and potential disadvantages to standard SMT component placement w
.. weiterlesen
Reliability of Embedded Planar Capacitors: A Review
Embedded capacitors offer board designers the ability to address the demands of high switching speeds and high I/O count packages while stemming the proliferation of minute decoupling capacitor
.. weiterlesen
Tin Whisker Risk Management by Conformal Coating
The objective of this study is to evaluate conformal coatings for mitigation of tin whisker growth. The conformal coatings chosen for the experiment are acrylic,polyurethane and parylene. The c
.. weiterlesen
Rework Challenges for Smart Phones and Tablets
Smart phones are complex,costly devices and therefore need to be reworked correctly the first time.
In order to meet the ever-growing demand for performance,the complexity of mobile devices has
.. weiterlesen
Semi Quantitative Method for Assessing the Reworkability of Different Underfills
The choice and optimisation of underfills to maximise process productivity and end product performance has been widely studied,and generated numerous performance criteria,flow time cure schedul
.. weiterlesen
Effects of Dielectric Material,Aspect Ratio and Copper Plating on Microvia Reliability
This paper documents test data on the effects of materials and processes on microvia structures. Thirteen sets of experiments were carried out to evaluate the effects of dielectric material,asp
.. weiterlesen
Simulation of the Influence of Manufacturing Quality on Thermomechanical Stress of Microvias
The advancement of area-array packages,such as flip chips and chip scale packages,has driven the adoption of high density interconnects (HDIs) that allow for an increased number of I/Os with a
.. weiterlesen
“Reliability of Stacked Microvia”
Reliability of Microvia has been a concern since microvias were introduced to our industry. This study was designed to understand the reliability of Type 1,Type 2,and Type 3 Microvias. Reliabil
.. weiterlesen
Predicting Fatigue of Solder Joints Subjected to High Number of Power Cycles
Solder joint reliability of SMT components connected to printed circuit boards is well documented. However,much of the
testing and data is related to high-strain energy thermal cycling experime
.. weiterlesen
Design for Reliability: Improving Reliability of Plastic Encapsulated Ocean Technology Products by Understanding Moisture Ingress through FEA Simulation
Remote sensing products designed for ocean environments sustain the harshness of cold oceans. The reliability of these telemetry devices needs to be very high to measure,collect and transmit da
.. weiterlesen
A Control-Chart Based Method for Solder Joint Crack Detection
Many researchers have used different failure criteria in the published solder joint reliability studies. Since the reported timeto-
failure would be different if different failure criteria were
.. weiterlesen
What is Kelvin Test?
The PCB industry is ever changing and adapting to new technologies. OEM specifications and requirements have also advanced due to these technologies. In some cases the OEMs are asking for a low
.. weiterlesen
Electrical Testing of Passive Components
Substrates have become more critical with regard to pitch and density in today’s designs with challenges for passive components in terms of surface placement. This negates the opportunity for h
.. weiterlesen
Preparing for Increased Electrostatic Discharge Device Sensitivity
With the push for ever improving performance on semiconductor component I/O interfaces,semiconductor components are being driven into a realm which makes them more sensitive to electrostatic di
.. weiterlesen
Electrostatic Discharge (ESD),Factory Issues,Measurement Methods and Product Quality – Roadmaps and Solutions for 2025 to 2030
The number of failures caused by electrostatic discharges (ESD) has been increasing for some time now. So,it is necessary for everyone,who handles electrostatic sensitive devices (ESDS),to know
.. weiterlesen
Specialized Materials for Printed Electronics
In the area of Printed Electronics,there are a number of functional materials that can include conductors,Semi-conductors,dielectrics,barriers,and adhesives. There are also a smaller subset of
.. weiterlesen
The Total Environmental Solution For Any-Layer HDI Production
Copper Via-Fill application in acid copper plating of PWB is experiencing a significant growth due to the booming of smartphone and tablet PC. With this growth,the PC board demand of HDI comple
.. weiterlesen
The Perfect Copper Surface
In order to provide the functionality in today’s electronics,printed circuit boards are approaching the complexity of semiconductors. For flexible circuits with 1 mil lines and spaces,this mean
.. weiterlesen
Final Finish Specifications Review IPC Plating Sub-committee 4-14
An IPC specification is a consensus document that specifies attributes relevant to the plated surface. Plating specifications are designed to be applicable to a wide range of products types. A
.. weiterlesen
Signal Transmission Loss due to Copper Surface Roughness in
Higher-speed signal transmission is increasingly required on a printed circuit board to handle massive data in electronic systems. So,signal transmission loss of copper wiring on a printed circ
.. weiterlesen
Beyond 0402M Placement: Process Considerations for 03015M Microchip Mounting
The printed circuit board assembly industry has long embraced the “Smaller,Lighter,Faster” mantra for electronic devices,especially in our ubiquitous mobile devices. As manufacturers increase s
.. weiterlesen
Miniaturization with Help of Reduced Component to Component Spacing
Miniaturization and the integration of a growing number of functions in portable electronic devices require an extremely high packaging density for the active and passive components. There are
.. weiterlesen
Challenges of Manufacturing with Printed Circuit Board Cavities
Cavity technology in a Printed Circuit Board (PCB) has existed for many years. The methodology to create the cavity in the PCB has evolved over time as technologies have advanced and the manufa
.. weiterlesen
Alternative Concepts for High Speed,High Frequency and Signal Integration into the PCB
Transmission of data is a major driver in the electronics industry. Higher data volumes,high speed data transfer and short time signal transmission have to be realized to meet these requirement
.. weiterlesen
Printing of Solder Paste – A Quality Assurance Methodology
Solder paste printing is known to be one of the most difficult processes to quality assure in electronic manufacturing. The challenge increases as the technology development moves toward a mix
.. weiterlesen
Jetting Strategies for mBGAs a question of give and take...
The demands on volume delivery and positioning accuracy for solder paste deposits are increasing as the size and complexity of circuits continue to develop in the electronics industry. Accordin
.. weiterlesen
Implementing Embedded Component from Concept-To-Manufacturing
The utilization of embedded components has increased across many applications in various industries,and with rapid emergence of technologies and the need to secure IP,new methodologies are bein
.. weiterlesen
Embedded Components: A Comparative Analysis of Reliability Part II
In light of new process and product technologies in the field of embedded components,questions arise with respect to advantages and potential disadvantages to standard SMT component placement w
.. weiterlesen
Reliability of Embedded Planar Capacitors: A Review
Embedded capacitors offer board designers the ability to address the demands of high switching speeds and high I/O count packages while stemming the proliferation of minute decoupling capacitor
.. weiterlesen
Tin Whisker Risk Management by Conformal Coating
The objective of this study is to evaluate conformal coatings for mitigation of tin whisker growth. The conformal coatings chosen for the experiment are acrylic,polyurethane and parylene. The c
.. weiterlesen