Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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BUILDING ELECTRONICS BETTER: A PLAN TO ADDRESS THE WORKFORCE CHALLENGES FACING THE ELECTRONICS MANUFACTURING INDUSTRY
Electronics manufacturers globally report that their growth is constrained by an inability to recruit, onboard, retain, and upskill workers. This white paper presents a holistic view of the
.. weiterlesen
BETTER ELECTRONICS BY DESIGN: NEXT GENERATION DESIGN NEEDS
In an ever-more automated, digitized, and connected world, electronic system design has evolved from a former novel concept to an absolute necessity; it now encompasses several highly skille
.. weiterlesen
Complex Integrated Systems - The Future of Electronics Manufacturing
Complex integrated systems (CIS) combine different types of functions—e.g., digital, analog, optical, micro-mechanical, power-related, structural—in a single system to ensure the best soluti
.. weiterlesen
OUTLOOK FOR DATA ANALYTICS IN THE ELECTRONICS MANUFACTURING INDUSTRY
The electronics manufacturing industry finds itself today in a moment of change driven by the convergence of multiple independent factors that all conspire to greatly challenge the status qu
.. weiterlesen
ELECTRONIC DESIGN AND MANUFACTURING SUSTAINABILITY
Environmental sustainability is a driving force for both consumers and businesses across many industries; the electronic sector is no exception. Sustainability reporting standards are being
.. weiterlesen
MAXIMIZING RETURNS: THE ROI OF TRAINING IN ELECTRONICS MANUFACTURING
The whitepaper Maximizing Returns: The ROI of Training in Electronics Manufacturing aims to provide a comprehensive analysis of how evaluating the return on investment (ROI) of training prog
.. weiterlesen
Workforce Whitepaper
Electronics manufacturers globally report that their growth is constrained by an inability to recruit, onboard, retain, and upskill workers. This white paper presents a holistic view of the
.. weiterlesen
Private Wireless Networks for Digital Transformation of Manufacturing
To drive digital transformation and leverage the power of data through analytics, machine learning, and artificial intelligence, enterprises need secure networks that provide mobility, real
.. weiterlesen
Raising the Level of Supply Chain Trust for the Future Factory
Recently, there has been an increase in production stoppages due to cyber-attacks on suppliers. Criminals attack the weakest point of your supply chain. However, little progress has been mad
.. weiterlesen
A New Approach to Conformal Coating Demonstrates Significantly Improved Ruggedization Performance
IPC-TR-587 technical report, ‘Conformal Coating Material and Application ‘‘State of the Industry’’ Assessment’ [1] outlines an IPC study of major conformal coating types, coating application
.. weiterlesen
An Efficient and Innovative Cleaning Solution with Low Environmental Impact
Contamination of electronic assemblies can occur at any process steps and can be of different natures such as oxides, organic residues, or dusts. Those contaminations could reduce the reliab
.. weiterlesen
New Resin Systems used to Solve Circuit Board Fabrication Issues
As new materials have been developed over the last few years, including the increasing use of thinner dielectrics and spread glass to help improve electrical performance, new issues have bee
.. weiterlesen
Contributing Factors to the Reliability of Buried Vias in High-Density Interconnect PCBs
In recent years, most research on high-density interconnect (HDI) PCBs focused on microvias. Based on previous test results in the frame of the ongoing research project on HDI PCBs for space
.. weiterlesen
Prediction of Drop Impact Reliability for Electronics Using Finite Element Analyses
This paper presents some of the recent in-situ studies of drop impact reliability for electronic equipment using Finite Element Analyses. The work covers simulation methods, verification wit
.. weiterlesen
Risk Prediction of Electrochemical Migration on Electronic Control Units - A Practical Approach
Reliability testing applying surface insulation resistance (SIR) measurements to materials that are used for electronic devices is a fundamental task in the automotive industry. SIR measurem
.. weiterlesen
Failure Analysis of High-Speed Cables Due to Molecular Degradation of Wire Insulation
Server hardware is often interconnected with high-speed, insulated copper cables to transfer data several meters or more between other servers, network hardware, and storage devices within d
.. weiterlesen
CPH – The Hidden Loss
The surface mount technology (SMT) process is well known and mostly measured in terms of efficiency, cycle time (CT) and first time quality (FTQ). Once the Customer’s needs are fulfilled (de
.. weiterlesen
Synchronizing the Stencil Printing Process for Successful Central Database Recipe Control
This paper will focus on the requirements needed to implement a central database for printer recipes and minimize setup time required to begin production. The SMT process works best the more
.. weiterlesen
Line Controller as Collaborative Agent to Orchestrate Processes and Taking Automation to the Next Level
SMT and electronics manufacturing industry experts are unanimously moving forward to have line controlling and automation in their digital transformation journey. Typical A typical SMT line
.. weiterlesen
Investigation of the Electrochemical Reliability of Conformal Coatings Under High Voltage
The surface insulation resistance (SIR) of conformal coatings was investigated using increased stress by high voltage bias up to 1000V. Test boards had been prepared according to IPC-9202, u
.. weiterlesen
Low Outgassing and Ionic Content, High-Performance Light and Moisture Dual Curable Conformal Coating
Polymeric conformal coatings are used to improve and extend the reliability of printed circuit boards against environmental conditions. There is high interest in using light-curable conforma
.. weiterlesen
Improvement of Via Connection Reliability by Thinning Electroless Copper Plating
In the latest IC substrate PCBs, via holes have downsized and these diameters have minimized below 10μm, which have led to the issues of connection reliability. In a conventional process, ad
.. weiterlesen
Requirements for Soldering Fluxes Research Using the B-53 Test Board
IPC J-STD-004B standard prescribes general requirements for the classification and testing of soldering flux for high qualify interconnections. This standard defines the classification of so
.. weiterlesen
Analysis of Pull Force Test Results for Crimped Connections
Crimped electrical contact reliability is controlled through strict manufacturing processes and verifications, including pull force testing. Cable and wire harness assemblies’ standards prov
.. weiterlesen
The Brave New World of PCB Design Validation – Cloud-Based DFM and Collaboration
Today’s electronics industry is grappling with increasing demand for more customized products, shorter development cycles, supply chain disruptions, and tighter margins. In the PCB manufactu
.. weiterlesen
AI-Based Design for Manufacturing in Selective Wave Soldering
The soldering of THT components through solder waves is a thermal process. However, current design rules, guidelines and guideline catalogs do not map the soldering heat requirement of a sol
.. weiterlesen
A Lower-Temperature Lead-Free Solder Paste for Wafer-Level Package Application that Outperforms SAC305
An In-containing mid-temperature solder paste (MTS) has been developed and successfully used in mobile phone board-stack soldering with a 200°C peak temperature profile [1]. It is now being
.. weiterlesen
Energy Consumption Reduction Using Low-Temperature Solder Alloys
There has been increased interest in reducing energy consumption during SMT assembly over the past few years. Increasingly, the environmental, financial, and regulatory effects have been dem
.. weiterlesen
Using Low CTE Materials to Manufacture Reliable Stacked Microvia Structures
In the last few years there have been concerns in the industry especially in the products requiring high reliability when using microvia structures. As a result many fabricators have been ma
.. weiterlesen
High Density PCB Technology for High Reliability Applications Using Low CTE Material
The space- and other high reliability markets are continuously driven towards an increased use of deeply integrated electronics. The increasing demand for complexity and functionality result
.. weiterlesen
BUILDING ELECTRONICS BETTER: A PLAN TO ADDRESS THE WORKFORCE CHALLENGES FACING THE ELECTRONICS MANUFACTURING INDUSTRY
Electronics manufacturers globally report that their growth is constrained by an inability to recruit, onboard, retain, and upskill workers. This white paper presents a holistic view of the
.. weiterlesen
BETTER ELECTRONICS BY DESIGN: NEXT GENERATION DESIGN NEEDS
In an ever-more automated, digitized, and connected world, electronic system design has evolved from a former novel concept to an absolute necessity; it now encompasses several highly skille
.. weiterlesen
Complex Integrated Systems - The Future of Electronics Manufacturing
Complex integrated systems (CIS) combine different types of functions—e.g., digital, analog, optical, micro-mechanical, power-related, structural—in a single system to ensure the best soluti
.. weiterlesen
OUTLOOK FOR DATA ANALYTICS IN THE ELECTRONICS MANUFACTURING INDUSTRY
The electronics manufacturing industry finds itself today in a moment of change driven by the convergence of multiple independent factors that all conspire to greatly challenge the status qu
.. weiterlesen
ELECTRONIC DESIGN AND MANUFACTURING SUSTAINABILITY
Environmental sustainability is a driving force for both consumers and businesses across many industries; the electronic sector is no exception. Sustainability reporting standards are being
.. weiterlesen
MAXIMIZING RETURNS: THE ROI OF TRAINING IN ELECTRONICS MANUFACTURING
The whitepaper Maximizing Returns: The ROI of Training in Electronics Manufacturing aims to provide a comprehensive analysis of how evaluating the return on investment (ROI) of training prog
.. weiterlesen
Workforce Whitepaper
Electronics manufacturers globally report that their growth is constrained by an inability to recruit, onboard, retain, and upskill workers. This white paper presents a holistic view of the
.. weiterlesen
Private Wireless Networks for Digital Transformation of Manufacturing
To drive digital transformation and leverage the power of data through analytics, machine learning, and artificial intelligence, enterprises need secure networks that provide mobility, real
.. weiterlesen
Raising the Level of Supply Chain Trust for the Future Factory
Recently, there has been an increase in production stoppages due to cyber-attacks on suppliers. Criminals attack the weakest point of your supply chain. However, little progress has been mad
.. weiterlesen
A New Approach to Conformal Coating Demonstrates Significantly Improved Ruggedization Performance
IPC-TR-587 technical report, ‘Conformal Coating Material and Application ‘‘State of the Industry’’ Assessment’ [1] outlines an IPC study of major conformal coating types, coating application
.. weiterlesen
An Efficient and Innovative Cleaning Solution with Low Environmental Impact
Contamination of electronic assemblies can occur at any process steps and can be of different natures such as oxides, organic residues, or dusts. Those contaminations could reduce the reliab
.. weiterlesen
New Resin Systems used to Solve Circuit Board Fabrication Issues
As new materials have been developed over the last few years, including the increasing use of thinner dielectrics and spread glass to help improve electrical performance, new issues have bee
.. weiterlesen
Contributing Factors to the Reliability of Buried Vias in High-Density Interconnect PCBs
In recent years, most research on high-density interconnect (HDI) PCBs focused on microvias. Based on previous test results in the frame of the ongoing research project on HDI PCBs for space
.. weiterlesen
Prediction of Drop Impact Reliability for Electronics Using Finite Element Analyses
This paper presents some of the recent in-situ studies of drop impact reliability for electronic equipment using Finite Element Analyses. The work covers simulation methods, verification wit
.. weiterlesen
Risk Prediction of Electrochemical Migration on Electronic Control Units - A Practical Approach
Reliability testing applying surface insulation resistance (SIR) measurements to materials that are used for electronic devices is a fundamental task in the automotive industry. SIR measurem
.. weiterlesen
Failure Analysis of High-Speed Cables Due to Molecular Degradation of Wire Insulation
Server hardware is often interconnected with high-speed, insulated copper cables to transfer data several meters or more between other servers, network hardware, and storage devices within d
.. weiterlesen
CPH – The Hidden Loss
The surface mount technology (SMT) process is well known and mostly measured in terms of efficiency, cycle time (CT) and first time quality (FTQ). Once the Customer’s needs are fulfilled (de
.. weiterlesen
Synchronizing the Stencil Printing Process for Successful Central Database Recipe Control
This paper will focus on the requirements needed to implement a central database for printer recipes and minimize setup time required to begin production. The SMT process works best the more
.. weiterlesen
Line Controller as Collaborative Agent to Orchestrate Processes and Taking Automation to the Next Level
SMT and electronics manufacturing industry experts are unanimously moving forward to have line controlling and automation in their digital transformation journey. Typical A typical SMT line
.. weiterlesen
Investigation of the Electrochemical Reliability of Conformal Coatings Under High Voltage
The surface insulation resistance (SIR) of conformal coatings was investigated using increased stress by high voltage bias up to 1000V. Test boards had been prepared according to IPC-9202, u
.. weiterlesen
Low Outgassing and Ionic Content, High-Performance Light and Moisture Dual Curable Conformal Coating
Polymeric conformal coatings are used to improve and extend the reliability of printed circuit boards against environmental conditions. There is high interest in using light-curable conforma
.. weiterlesen
Improvement of Via Connection Reliability by Thinning Electroless Copper Plating
In the latest IC substrate PCBs, via holes have downsized and these diameters have minimized below 10μm, which have led to the issues of connection reliability. In a conventional process, ad
.. weiterlesen
Requirements for Soldering Fluxes Research Using the B-53 Test Board
IPC J-STD-004B standard prescribes general requirements for the classification and testing of soldering flux for high qualify interconnections. This standard defines the classification of so
.. weiterlesen
Analysis of Pull Force Test Results for Crimped Connections
Crimped electrical contact reliability is controlled through strict manufacturing processes and verifications, including pull force testing. Cable and wire harness assemblies’ standards prov
.. weiterlesen
The Brave New World of PCB Design Validation – Cloud-Based DFM and Collaboration
Today’s electronics industry is grappling with increasing demand for more customized products, shorter development cycles, supply chain disruptions, and tighter margins. In the PCB manufactu
.. weiterlesen
AI-Based Design for Manufacturing in Selective Wave Soldering
The soldering of THT components through solder waves is a thermal process. However, current design rules, guidelines and guideline catalogs do not map the soldering heat requirement of a sol
.. weiterlesen
A Lower-Temperature Lead-Free Solder Paste for Wafer-Level Package Application that Outperforms SAC305
An In-containing mid-temperature solder paste (MTS) has been developed and successfully used in mobile phone board-stack soldering with a 200°C peak temperature profile [1]. It is now being
.. weiterlesen
Energy Consumption Reduction Using Low-Temperature Solder Alloys
There has been increased interest in reducing energy consumption during SMT assembly over the past few years. Increasingly, the environmental, financial, and regulatory effects have been dem
.. weiterlesen
Using Low CTE Materials to Manufacture Reliable Stacked Microvia Structures
In the last few years there have been concerns in the industry especially in the products requiring high reliability when using microvia structures. As a result many fabricators have been ma
.. weiterlesen
High Density PCB Technology for High Reliability Applications Using Low CTE Material
The space- and other high reliability markets are continuously driven towards an increased use of deeply integrated electronics. The increasing demand for complexity and functionality result
.. weiterlesen