Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Anzeige
Lead Free Die Attach Technology for High Power Applications
TLPS materials are an attractive alternative to PbSn for IC power device packaging. They provide a low VOC composition,lead free die attach solution that meets the RoHS guidelines. TLPS materia
.. weiterlesen
Capillary IC – A New Platform for High Throughput or High Resolution Separations of Ionic Compounds
There has been increasing interest in the development of capillary ion chromatography (IC) systems and methods for determination of ionic species. The practice of ion chromatography in capillar
.. weiterlesen
Moisture Diffusion in Electronic Packaging Materials
Moisture poses a significant threat to the reliability of microelectronic assemblies,especially for scientific research products that are designed for marine environment and can be attributed a
.. weiterlesen
Is the ENIG Process Evil,or is it Maybe QA,Engineer or Sales Guy?
The case of processing issues with Electroless Nickel/Immersion Gold (ENIG) is well documented,even as it endures as a very popular surface finish. Certainly the market says that quality ENIG h
.. weiterlesen
Jetting Solder Paste Opens Up New Possibilities in Your SMT Production
Jetting of liquids is becoming the standard in our industry. MYDATA has developed a unique tool to jet solder paste. This non-contact method of applying solder paste has a large number of advan
.. weiterlesen
NPI Step Stencils- A New Approach
There are a variety of stencil approaches in which the new product process engineer can deal with the assembly of both high solder paste and low solder paste volume in an SMT assembly environme
.. weiterlesen
Dual Solvent Electronic Assembly Cleaning
Electronic Assemblies are cleaned in order to remove contaminations that may affect yields,service life and reliability. Highly dense interconnects entrap flux residues under the Z-axis. Volati
.. weiterlesen
Reflow Soldering Equals Wave Soldering Plus One
Lead-free solder is more than a swap for SnPb and more than simply an alternative alloy. Five years after implementation discussion remains regarding which alloy is the best for which applicati
.. weiterlesen
The Effect of Powder Surface Area and Oxidation on the Voiding Performance of PoP Solder Pastes
With the miniaturization of components in the semiconductor industry,the need for specialized solder pastes with finer powder mesh sizes for package-on-package (PoP) assemblies has become imper
.. weiterlesen
New Developments in PCB Laminates
Executive Summary
There are many issues to consider when developing a new circuit material for the PCB industry. It is a given assumption that the new material must be compatible to standard PC
.. weiterlesen
Environmental Compliance Reporting – Mastering a Moving Target
Companies that have initiated internal resources to obtain compliance data have realized that collecting,and more importantly,maintaining the currency of that data requires more resources than
.. weiterlesen
Scaling LCA with IPC-175x
- Live Cycle Assessment
- Early Product Analysis / “DFX” Challenge
- Keys to Scaling #1: Processes and Systems
- Systems can Extend “Traditional” LCA
- Keys to Scaling #2: Data Exchange Standar
.. weiterlesen
An Investigation of Whisker Growth on Tin Coated Wire and Braid
Pure tin is a common finish for copper hook up wire,coaxial cable,ground braid and harness assemblies used on electronic assemblies. Historically there have been fewer reports of whisker growth
.. weiterlesen
Elemental Compositions of Over Two Dozen Cell Phones
Twenty-nine different cells phones have been disassembled,ground up,dissolved and analyzed for elemental content,mainly for information about the metals present in the phones,but also for some
.. weiterlesen
Growth Mechanisms of Tin Whiskers at Press-in Technology
Compliant press-fit zones apply external mechanical stress to copper and tin surfaces of plated through holes at printed circuit boards during and after performing the press-in process. This ex
.. weiterlesen
Effects of Tin and Copper Nanotexturization on Tin Whisker Formation
The physical mechanisms behind tin whisker formation in pure tin (Sn) films continue to elude the microelectronics industry. Despite modest advances in whisker mitigation techniques (i.e.,barri
.. weiterlesen
Integrated Electrical Test within the Production Line
Many companies use “one stop testing” as a solution to the test issues in a manufacturing environment rather than discrete
“islands of test”. Low volume,high mix electronic manufactures are con
.. weiterlesen
Effective Test-Probe Assignment on PCB Electrical Testing
Test point optimization for the PCB electrical test domain brings the test speed faster for the flying probe tester (FPT),
and the fixture cost lower for the fixture type tester. The importance
.. weiterlesen
Novel Probing Concepts for Mass-Production Tests: Design and Challenges
The world of spring-loaded test probes and special probes for in-circuit and functional tests have grown tremendously over the past few years. Ever increasing demands for electro mobility appli
.. weiterlesen
Reduction of Voids in Solder Joints an Alternative to Vacuum Soldering
Voids in solder joints are representing one of the main problems especially for power electronics. A low and homogeneous
thermal resistance of solder joints is demanded for a quick and uniform
.. weiterlesen
Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints
Prior to committing production boards to vapor phase soldering,we performed an evaluation to assess reliability and evaluate the vacuum soldering option. The reliability of vapor phase processe
.. weiterlesen
Before & After Reflow Characterization of FCBGA Voiding Utilizing High Resolution CT Scan,X-ray (2D & 3D) Imaging,and Cross Section with...
A joint project between Flextronics Inc. and North Star Imaging Inc. is being conducted to correlate current x-ray imaging and cross-section analysis of BGA voiding with state of the art high r
.. weiterlesen
A Time Dependent Analytical Analysis of Heat Transfer in A PCB during A Thermal Excursion
A great deal of work has already been done to determine the equilibrium temperature of a PCB when exposed to a heat source such as the thermal environment of reflow soldering. This study will g
.. weiterlesen
A New Paradigm for Design through Manufacture
Working through the New Product Introduction (NPI) flow between the product design and manufacturing is usually a challenging process,with both parties being experts in their own fields and ine
.. weiterlesen
Design and Construction Affects on PWB Reliability
The reliability,as tested by thermal cycling,of printed wire boards (PWB) are established by three variables; copper quality,material robustness and design. The copper quality was most influent
.. weiterlesen
Stencil Printing of Small Apertures
Many of the latest SMT assemblies for hand held devices like cell phones present a challenge to process and manufacturing engineers with the introduction of miniature components such as .3 mm C
.. weiterlesen
Solder Paste Deposits and the Precision of Aperture Sizes
Many articles have been published indicating that 60 to 75% of all board assembly problems stem from solder paste printing. The important outcome from the printing process is to get the correct
.. weiterlesen
Stencil Printing Process Tools for Miniaturisation and High Yield Processing
The SMT print process is now very mature and well understood. However as consumers continually push for new electronic
products,with increased functionality and smaller form factor,the boundari
.. weiterlesen
PCB Trace Impedance: Impact of Localized PCB Copper Density
Trace impedances are specified and controlled on PCBs as their nominal impedance value and variations are key factors in establishing
system I/O bus performance. PCB trace impedances are evalua
.. weiterlesen
A Study of PCB Insertion Loss Variation in Manufacturing Using a New Low Cost Metrology
Signal integrity analysis has shown that printed circuit board (PCB) insertion loss is a key factor affecting high
speed channel performance. Determining and controlling PCB insertion loss have
.. weiterlesen
Lead Free Die Attach Technology for High Power Applications
TLPS materials are an attractive alternative to PbSn for IC power device packaging. They provide a low VOC composition,lead free die attach solution that meets the RoHS guidelines. TLPS materia
.. weiterlesen
Capillary IC – A New Platform for High Throughput or High Resolution Separations of Ionic Compounds
There has been increasing interest in the development of capillary ion chromatography (IC) systems and methods for determination of ionic species. The practice of ion chromatography in capillar
.. weiterlesen
Moisture Diffusion in Electronic Packaging Materials
Moisture poses a significant threat to the reliability of microelectronic assemblies,especially for scientific research products that are designed for marine environment and can be attributed a
.. weiterlesen
Is the ENIG Process Evil,or is it Maybe QA,Engineer or Sales Guy?
The case of processing issues with Electroless Nickel/Immersion Gold (ENIG) is well documented,even as it endures as a very popular surface finish. Certainly the market says that quality ENIG h
.. weiterlesen
Jetting Solder Paste Opens Up New Possibilities in Your SMT Production
Jetting of liquids is becoming the standard in our industry. MYDATA has developed a unique tool to jet solder paste. This non-contact method of applying solder paste has a large number of advan
.. weiterlesen
NPI Step Stencils- A New Approach
There are a variety of stencil approaches in which the new product process engineer can deal with the assembly of both high solder paste and low solder paste volume in an SMT assembly environme
.. weiterlesen
Dual Solvent Electronic Assembly Cleaning
Electronic Assemblies are cleaned in order to remove contaminations that may affect yields,service life and reliability. Highly dense interconnects entrap flux residues under the Z-axis. Volati
.. weiterlesen
Reflow Soldering Equals Wave Soldering Plus One
Lead-free solder is more than a swap for SnPb and more than simply an alternative alloy. Five years after implementation discussion remains regarding which alloy is the best for which applicati
.. weiterlesen
The Effect of Powder Surface Area and Oxidation on the Voiding Performance of PoP Solder Pastes
With the miniaturization of components in the semiconductor industry,the need for specialized solder pastes with finer powder mesh sizes for package-on-package (PoP) assemblies has become imper
.. weiterlesen
New Developments in PCB Laminates
Executive Summary
There are many issues to consider when developing a new circuit material for the PCB industry. It is a given assumption that the new material must be compatible to standard PC
.. weiterlesen
Environmental Compliance Reporting – Mastering a Moving Target
Companies that have initiated internal resources to obtain compliance data have realized that collecting,and more importantly,maintaining the currency of that data requires more resources than
.. weiterlesen
Scaling LCA with IPC-175x
- Live Cycle Assessment
- Early Product Analysis / “DFX” Challenge
- Keys to Scaling #1: Processes and Systems
- Systems can Extend “Traditional” LCA
- Keys to Scaling #2: Data Exchange Standar
.. weiterlesen
An Investigation of Whisker Growth on Tin Coated Wire and Braid
Pure tin is a common finish for copper hook up wire,coaxial cable,ground braid and harness assemblies used on electronic assemblies. Historically there have been fewer reports of whisker growth
.. weiterlesen
Elemental Compositions of Over Two Dozen Cell Phones
Twenty-nine different cells phones have been disassembled,ground up,dissolved and analyzed for elemental content,mainly for information about the metals present in the phones,but also for some
.. weiterlesen
Growth Mechanisms of Tin Whiskers at Press-in Technology
Compliant press-fit zones apply external mechanical stress to copper and tin surfaces of plated through holes at printed circuit boards during and after performing the press-in process. This ex
.. weiterlesen
Effects of Tin and Copper Nanotexturization on Tin Whisker Formation
The physical mechanisms behind tin whisker formation in pure tin (Sn) films continue to elude the microelectronics industry. Despite modest advances in whisker mitigation techniques (i.e.,barri
.. weiterlesen
Integrated Electrical Test within the Production Line
Many companies use “one stop testing” as a solution to the test issues in a manufacturing environment rather than discrete
“islands of test”. Low volume,high mix electronic manufactures are con
.. weiterlesen
Effective Test-Probe Assignment on PCB Electrical Testing
Test point optimization for the PCB electrical test domain brings the test speed faster for the flying probe tester (FPT),
and the fixture cost lower for the fixture type tester. The importance
.. weiterlesen
Novel Probing Concepts for Mass-Production Tests: Design and Challenges
The world of spring-loaded test probes and special probes for in-circuit and functional tests have grown tremendously over the past few years. Ever increasing demands for electro mobility appli
.. weiterlesen
Reduction of Voids in Solder Joints an Alternative to Vacuum Soldering
Voids in solder joints are representing one of the main problems especially for power electronics. A low and homogeneous
thermal resistance of solder joints is demanded for a quick and uniform
.. weiterlesen
Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints
Prior to committing production boards to vapor phase soldering,we performed an evaluation to assess reliability and evaluate the vacuum soldering option. The reliability of vapor phase processe
.. weiterlesen
Before & After Reflow Characterization of FCBGA Voiding Utilizing High Resolution CT Scan,X-ray (2D & 3D) Imaging,and Cross Section with...
A joint project between Flextronics Inc. and North Star Imaging Inc. is being conducted to correlate current x-ray imaging and cross-section analysis of BGA voiding with state of the art high r
.. weiterlesen
A Time Dependent Analytical Analysis of Heat Transfer in A PCB during A Thermal Excursion
A great deal of work has already been done to determine the equilibrium temperature of a PCB when exposed to a heat source such as the thermal environment of reflow soldering. This study will g
.. weiterlesen
A New Paradigm for Design through Manufacture
Working through the New Product Introduction (NPI) flow between the product design and manufacturing is usually a challenging process,with both parties being experts in their own fields and ine
.. weiterlesen
Design and Construction Affects on PWB Reliability
The reliability,as tested by thermal cycling,of printed wire boards (PWB) are established by three variables; copper quality,material robustness and design. The copper quality was most influent
.. weiterlesen
Stencil Printing of Small Apertures
Many of the latest SMT assemblies for hand held devices like cell phones present a challenge to process and manufacturing engineers with the introduction of miniature components such as .3 mm C
.. weiterlesen
Solder Paste Deposits and the Precision of Aperture Sizes
Many articles have been published indicating that 60 to 75% of all board assembly problems stem from solder paste printing. The important outcome from the printing process is to get the correct
.. weiterlesen
Stencil Printing Process Tools for Miniaturisation and High Yield Processing
The SMT print process is now very mature and well understood. However as consumers continually push for new electronic
products,with increased functionality and smaller form factor,the boundari
.. weiterlesen
PCB Trace Impedance: Impact of Localized PCB Copper Density
Trace impedances are specified and controlled on PCBs as their nominal impedance value and variations are key factors in establishing
system I/O bus performance. PCB trace impedances are evalua
.. weiterlesen
A Study of PCB Insertion Loss Variation in Manufacturing Using a New Low Cost Metrology
Signal integrity analysis has shown that printed circuit board (PCB) insertion loss is a key factor affecting high
speed channel performance. Determining and controlling PCB insertion loss have
.. weiterlesen