Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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iNEMI HFR-Free Signal Integrity Project: An Investigation to Identify Degradation of Electrical Signals in HFR-Free PCB Materials
Recent environmental concerns over the safety of the halogenated flame retardants (HFR) used in commonplace FR4 printed
circuit boards (PCB) have prompted market demand for HFR-free computer sy
.. weiterlesen
iNEMI HFR-Free PCB Materials Team Project: An Investigation to Identify Technology Limitations Involved in Transitioning to HFR-Free PCB Materials
In response to a growing concern within the Electronic Industry to the transition to Halogen-Free laminates (HFR-Free)
within the Client Market space (Desktop and Notebook computers) iNEMI init
.. weiterlesen
Choosing a Low-Cost Alternative to Sac Alloys for PCB Assembly
Developing low-cost alternatives to near-eutectic SAC alloys for Pb-free assembly is crucial to continue producing affordable electronics products. Metals prices,especially silver,have been on
.. weiterlesen
Drop Test Performance of Bga Assembly Using Sac105ti Solder Spheres
Board-level drop test performance was evaluated and compared for the following four different solder combinations in
BGA/CSP assembly: 1) SnPb paste with SnPb balls,2) SnPb paste with SAC105Ti
.. weiterlesen
Low Cycle Fatigue Behaviour of Multi-joint Sample in Mechanical Testing
This paper explores the behaviour of a copper test vehicle with multiple reflowed solder joints,which has direct relevance to ball grid arrays (BGA) and high density interconnect structures. Th
.. weiterlesen
An Evaluation of the Insulation Resistance and Surface Contamination of Printed Circuit Board Assemblies
The overall effectiveness of 20 circuit board assembly processes,made up of 4 solder/flux combinations and 6 cleaning processes was investigated by using in-situ surface insulation resistance m
.. weiterlesen
Correlation of Sir,Halide/Halogen,and Copper Mirror Tests
With the advent of RoHS and WEEE and the concern of some companies to eliminate halogen-containing compounds from their products,it is vital to have an understanding of halogen compounds and ho
.. weiterlesen
Effect of Silicone Conformal Coating on Surface Insulation Resistance (SIR) For Printed Circuit Board Assemblies.
Conformal coatings are considered a method of providing corrosion protection to electrical assemblies used in high-humidity or harsh environments. They are applied to PCBs for various reasons:
.. weiterlesen
Testing – Understanding the Proper Testing Processes and Requirements for Electronics,Electronic Components and Printed Circuit Boards
As the need for electronics,electronic components and printed circuit boards becomes more important; the testing of products for these industries becomes a critical component. New materials,new
.. weiterlesen
Overcoming Logistic,Economic and Technical Challenges to Implementing Functional Test in High Mix / High Volume Production Environments
Functional circuit test (FCT) of circuit boards and end products in a high volume (>1000 units per day) production environment presents challenging technical,logistic and cost obstacles that ar
.. weiterlesen
IPC 9252A Electrical Test Considerations & Military Specifications versus Electrical Test (Know Your Specifications,Revisions and Amendments)
The PCB industry has advanced significantly in the recent millennium. OEM specifications and requirements have also advanced due to the maturing technologies. With this the requirements of Elec
.. weiterlesen
Newest ED-Copper Foils for Low Loss / High Speed PCBs and for IC-Packaging
The latest status of new ED copper foil developments is presented: ultra-flat profile for high speed digital boards and ultra-thin foil for finest pitch applications.
Copper surface roughness h
.. weiterlesen
Determination of Copper Foil Surface Roughness from Micro-section Photographs
Specification and control of surface roughness of copper conductors within printed circuit boards (PCBs) are increasingly desirable in multi-GHz designs as a part of signal-integrity failure an
.. weiterlesen
A Designed Experiment for the Influence of Copper Foils on Impedance,DC Line Resistance and Insertion Loss
For the last couple of years,the main concerns regarding the electrical performance of blank PCB boards were impedance and ohmic resistance. Just recently,the need to reduce insertion loss came
.. weiterlesen
Effect of Silicone Contamination on Assembly Processes
Silicone contamination is known to have a negative impact on assembly processes such as soldering,adhesive bonding,coating,and wire bonding. In particular,silicone is known to cause de-wetting
.. weiterlesen
Impact of Dust on Printed Circuit Assembly Reliability
Atmospheric dust consists of solids suspended in air. Dust is well known for its complex nature. It normally includes inorganic mineral materials,water soluble salts,organic materials,and a sma
.. weiterlesen
Coating Thickness Measurement of Thin Gold and Palladium Coatings on Printed Circuit Boards using X-Ray Fluorescence
- DD Detector is State of the Art
- Software: Addressing all measurement challenges; Measurement Results for Au,Pd and Ni(P),independent of substrate material
- Traceability and Reproducibility
.. weiterlesen
Direct Digital SM Printing Using Inkjet Technology
•What is Digital Printing
•Ink Jet Technology
•Printing SM using Ink Jet
- Highlights
- Zero clearance technology
- Product improvements
- PCB shops,end users and designers
.. weiterlesen
Application of the Advanced Activator Technology on Halogen-Free Lead-Free Solder Paste Development
The Surface Mount Technology (SMT) industry has been faced with several challenges in the past decades. Two of the most recent ones are RoHS compliant lead-free assembly and the adoption of fin
.. weiterlesen
The Effect of Powder Surface Area and Oxidation on the Voiding Performance of PoP Solder Pastes
With the miniaturization of components in the semiconductor industry,the need for specialized solder pastes with finer
powder mesh sizes for package-on-package (PoP) assemblies has become imper
.. weiterlesen
SMT Manufacturability and Reliability in PCB Cavities
Considering technological advances in multi-depth cavities in the PCB manufacturing industry,various subtopics have materialized regarding the processing and application of such features in dev
.. weiterlesen
Challenges for Step Stencils with Design Guidelines for Solder Paste Printing
The stencil printing process is one of the most critical processes in the electronic production. Due to the requirement: “faster and smaller” it is necessary to place components with different
.. weiterlesen
Virtual Access Technique Augments Test Coverage on Limited Access PCB Assemblies
Increased pressures to reduce time to market and time to volume have forced many manufacturers of populated printed circuit boards to rely on capacitively coupled,un-powered,vectorless in-circu
.. weiterlesen
Testing DDR Memory
Testing DDR memories on Printed Circuit Boards has steadily gotten more difficult. Most such memories do not have any on-chip Design-for-Test features. Adequate test access is a disappearing lu
.. weiterlesen
Corrosion Resistance of Different PCB Surface Finishes in Harsh Environments
Corrosion resistance is becoming one of the most important topics in the electronics industry. Corrosion results in field
failures and huge losses,which annually total several billion U.S. doll
.. weiterlesen
The Surface Finish Effect on the Creep Corrosion in PCB
Creep corrosion normally happens in the end system,PCB,connectors and components are widely noted due to the exposure of
high sulfur environments under elevated humidity. In this study,the majo
.. weiterlesen
Detailed Analysis of Impedance and Loss versus Frequency for Transmission Lines Made From Flexible Circuit Materials
With the emergence of high speed,controlled impedance circuits requiring increasingly tight tolerances,there is a realization among designers and fabricators that more precise data is needed th
.. weiterlesen
Thermal Characteristics of PCB Laminates used in High Frequency Applications
As technology advances,understanding thermal management issues of high frequency PCB’s increases. There are many different aspects to consider for PCB thermal management. This paper will invest
.. weiterlesen
iNEMI HFR-Free Signal Integrity Project: An Investigation to Identify Degradation of Electrical Signals in HFR-Free PCB Materials
Recent environmental concerns over the safety of the halogenated flame retardants (HFR) used in commonplace FR4 printed
circuit boards (PCB) have prompted market demand for HFR-free computer sy
.. weiterlesen
iNEMI HFR-Free PCB Materials Team Project: An Investigation to Identify Technology Limitations Involved in Transitioning to HFR-Free PCB Materials
In response to a growing concern within the Electronic Industry to the transition to Halogen-Free laminates (HFR-Free)
within the Client Market space (Desktop and Notebook computers) iNEMI init
.. weiterlesen
Choosing a Low-Cost Alternative to Sac Alloys for PCB Assembly
Developing low-cost alternatives to near-eutectic SAC alloys for Pb-free assembly is crucial to continue producing affordable electronics products. Metals prices,especially silver,have been on
.. weiterlesen
Drop Test Performance of Bga Assembly Using Sac105ti Solder Spheres
Board-level drop test performance was evaluated and compared for the following four different solder combinations in
BGA/CSP assembly: 1) SnPb paste with SnPb balls,2) SnPb paste with SAC105Ti
.. weiterlesen
Low Cycle Fatigue Behaviour of Multi-joint Sample in Mechanical Testing
This paper explores the behaviour of a copper test vehicle with multiple reflowed solder joints,which has direct relevance to ball grid arrays (BGA) and high density interconnect structures. Th
.. weiterlesen
An Evaluation of the Insulation Resistance and Surface Contamination of Printed Circuit Board Assemblies
The overall effectiveness of 20 circuit board assembly processes,made up of 4 solder/flux combinations and 6 cleaning processes was investigated by using in-situ surface insulation resistance m
.. weiterlesen
Correlation of Sir,Halide/Halogen,and Copper Mirror Tests
With the advent of RoHS and WEEE and the concern of some companies to eliminate halogen-containing compounds from their products,it is vital to have an understanding of halogen compounds and ho
.. weiterlesen
Effect of Silicone Conformal Coating on Surface Insulation Resistance (SIR) For Printed Circuit Board Assemblies.
Conformal coatings are considered a method of providing corrosion protection to electrical assemblies used in high-humidity or harsh environments. They are applied to PCBs for various reasons:
.. weiterlesen
Testing – Understanding the Proper Testing Processes and Requirements for Electronics,Electronic Components and Printed Circuit Boards
As the need for electronics,electronic components and printed circuit boards becomes more important; the testing of products for these industries becomes a critical component. New materials,new
.. weiterlesen
Overcoming Logistic,Economic and Technical Challenges to Implementing Functional Test in High Mix / High Volume Production Environments
Functional circuit test (FCT) of circuit boards and end products in a high volume (>1000 units per day) production environment presents challenging technical,logistic and cost obstacles that ar
.. weiterlesen
IPC 9252A Electrical Test Considerations & Military Specifications versus Electrical Test (Know Your Specifications,Revisions and Amendments)
The PCB industry has advanced significantly in the recent millennium. OEM specifications and requirements have also advanced due to the maturing technologies. With this the requirements of Elec
.. weiterlesen
Newest ED-Copper Foils for Low Loss / High Speed PCBs and for IC-Packaging
The latest status of new ED copper foil developments is presented: ultra-flat profile for high speed digital boards and ultra-thin foil for finest pitch applications.
Copper surface roughness h
.. weiterlesen
Determination of Copper Foil Surface Roughness from Micro-section Photographs
Specification and control of surface roughness of copper conductors within printed circuit boards (PCBs) are increasingly desirable in multi-GHz designs as a part of signal-integrity failure an
.. weiterlesen
A Designed Experiment for the Influence of Copper Foils on Impedance,DC Line Resistance and Insertion Loss
For the last couple of years,the main concerns regarding the electrical performance of blank PCB boards were impedance and ohmic resistance. Just recently,the need to reduce insertion loss came
.. weiterlesen
Effect of Silicone Contamination on Assembly Processes
Silicone contamination is known to have a negative impact on assembly processes such as soldering,adhesive bonding,coating,and wire bonding. In particular,silicone is known to cause de-wetting
.. weiterlesen
Impact of Dust on Printed Circuit Assembly Reliability
Atmospheric dust consists of solids suspended in air. Dust is well known for its complex nature. It normally includes inorganic mineral materials,water soluble salts,organic materials,and a sma
.. weiterlesen
Coating Thickness Measurement of Thin Gold and Palladium Coatings on Printed Circuit Boards using X-Ray Fluorescence
- DD Detector is State of the Art
- Software: Addressing all measurement challenges; Measurement Results for Au,Pd and Ni(P),independent of substrate material
- Traceability and Reproducibility
.. weiterlesen
Direct Digital SM Printing Using Inkjet Technology
•What is Digital Printing
•Ink Jet Technology
•Printing SM using Ink Jet
- Highlights
- Zero clearance technology
- Product improvements
- PCB shops,end users and designers
.. weiterlesen
Application of the Advanced Activator Technology on Halogen-Free Lead-Free Solder Paste Development
The Surface Mount Technology (SMT) industry has been faced with several challenges in the past decades. Two of the most recent ones are RoHS compliant lead-free assembly and the adoption of fin
.. weiterlesen
The Effect of Powder Surface Area and Oxidation on the Voiding Performance of PoP Solder Pastes
With the miniaturization of components in the semiconductor industry,the need for specialized solder pastes with finer
powder mesh sizes for package-on-package (PoP) assemblies has become imper
.. weiterlesen
SMT Manufacturability and Reliability in PCB Cavities
Considering technological advances in multi-depth cavities in the PCB manufacturing industry,various subtopics have materialized regarding the processing and application of such features in dev
.. weiterlesen
Challenges for Step Stencils with Design Guidelines for Solder Paste Printing
The stencil printing process is one of the most critical processes in the electronic production. Due to the requirement: “faster and smaller” it is necessary to place components with different
.. weiterlesen
Virtual Access Technique Augments Test Coverage on Limited Access PCB Assemblies
Increased pressures to reduce time to market and time to volume have forced many manufacturers of populated printed circuit boards to rely on capacitively coupled,un-powered,vectorless in-circu
.. weiterlesen
Testing DDR Memory
Testing DDR memories on Printed Circuit Boards has steadily gotten more difficult. Most such memories do not have any on-chip Design-for-Test features. Adequate test access is a disappearing lu
.. weiterlesen
Corrosion Resistance of Different PCB Surface Finishes in Harsh Environments
Corrosion resistance is becoming one of the most important topics in the electronics industry. Corrosion results in field
failures and huge losses,which annually total several billion U.S. doll
.. weiterlesen
The Surface Finish Effect on the Creep Corrosion in PCB
Creep corrosion normally happens in the end system,PCB,connectors and components are widely noted due to the exposure of
high sulfur environments under elevated humidity. In this study,the majo
.. weiterlesen
Detailed Analysis of Impedance and Loss versus Frequency for Transmission Lines Made From Flexible Circuit Materials
With the emergence of high speed,controlled impedance circuits requiring increasingly tight tolerances,there is a realization among designers and fabricators that more precise data is needed th
.. weiterlesen
Thermal Characteristics of PCB Laminates used in High Frequency Applications
As technology advances,understanding thermal management issues of high frequency PCB’s increases. There are many different aspects to consider for PCB thermal management. This paper will invest
.. weiterlesen