Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Influence of Via Stub Length and Antipad Size on the Insertion Loss Profile
The growing transmission speed and volume of digital content increases the pressure on reduction of overall insertion loss of printed circuit boards permanently.
In today’s circuit boards,it is
.. weiterlesen
Embedded System Access - a Paradigm Shift in Electrical Test
Throughout a product’s life cycle it may need to be tested various times. New product designs need to be validated during the prototyping phase,manufacturing defects need to be detected and dia
.. weiterlesen
Why Signal Always Be Loss in a High Speed Frequency Transmission Line
The high speed transmission applications in the electronic product become inevitable developing trend. The signal integrity becomes the most important issue in the electronic industry. The mate
.. weiterlesen
Advanced Second Level Assembly Analysis Techniques - Troubleshooting Head-In-Pillow,Opens,and Shorts with Dual Full-Field 3D Surface Warpage Data Sets
SMT assembly planning and failure analysis of surface mount assembly defects often include component warpage evaluation. Coplanarity values of Integrated Circuit packages have traditionally bee
.. weiterlesen
Head in Pillow X-ray Inspection at Flextronics
Manufacturing technology faces challenges with new packages/process when confronting the need for high yields. Identifying product defects associated with the manufacturing process is a critica
.. weiterlesen
Online Databse of Materials for Printed Electronics
Materials Registry for Printed Electronics
- WMU’s CAPE received an award from FlexTech Alliance to create an online database for accessing technical information on functional materials used in
.. weiterlesen
Improving Yields and Quality: Two Case Studies: Graping and the Head-on-Pillow defect
HoP Mitigation is addressed with respect to solder paste,components,inspection,process and the environment.
Graping minimization recommendations are given with data driven suggestions.
.. weiterlesen
Gravure Printing of ITO Transparent Electrodes for Applications in Printed Electronics
ITO nanoparticles were successfully printed on glass with the AccuPress Gravure System
•A wide range of sheet resistivity values was achieved with different engraving resolutions of the gravure
.. weiterlesen
Printed & Flexible Electronics – Surf’s Up
Printed & Flexible Electronics
• Development Waves – 1st,2nd,and 3rd
• Essentials
• Products and Applications
• Technology and Infrastructure Development
• Printed & Flexible Electronics Pipeli
.. weiterlesen
Mixed Metals Impact on Reliability
With the adoption of RoHS and implementation of Lead Free solders a major concern is how this will impact reliability. Both commercial and military hardware are impacted by this change even tho
.. weiterlesen
Testing Intermetallic Fragility on Enig upon Addition of Limitless Cu
As reliability requirements increase,especially for defense and aerospace applications,the need to characterize components used in electronic assembly also increases. OEM and EMS companies look
.. weiterlesen
Assessment of Reterminated RoHS Components for SnPb Applications
The banning of Pb in electronic component termination finishes has flushed through the supply chain making it impossible in some cases for hi-reliability users to purchase Pb containing interco
.. weiterlesen
The Coming of The MultiChip Module
MultiChip Module Status
•It isn’t a new idea since back in the 1980’s everyone was trying to combine different components into a single package
•It started with Hybrids then different forms of
.. weiterlesen
BVA: Molded Cu Wire Contact Solution for Very High Density Package-on- Package (PoP) Applications
Stacking heterogeneous semiconductor die (memory and logic) within the same package outline can be considered for less complex applications but combining the memory and processor functions in a
.. weiterlesen
Printed Circuit Structures,the Evolution of Printed Circuit Boards
The Printed Circuit Board (PCB) is the backbone of electronics and a large number of consumer devices. The challenge to put more function in a smaller space requires more components utilizing s
.. weiterlesen
Cost effective 3D Glass Microfabrication for Advanced Electronic Packages
Interposer technologies are gathering more importance in IC packaging as the industry continues miniaturization trends in microfabrication nodes and IC packaging to meet design and utility need
.. weiterlesen
TOF SIMS Analysis for SnxOy Determination on Lead-Free HASL PCB’s
During the production of Lead-Free Hot Air Solder Leveling (LF HASL),non-wetting issues in several components were found including BGA pad. The common visual aspect of the suspicious pads was t
.. weiterlesen
Improving Density in Microwave Multilayer Printed Circuit Boards for Space Applications
The need in complexity for microwave space products such as active BFNs (Beam Forming Networks) is increasing,with a significantly growing number of amplitude / phase control points (number of
.. weiterlesen
Behavior of Materials in the Manufacturing Environment
This study was conducted to understand seven materials reliability,behavior of Dielectric constant and Dissipation factor over medium to high frequencies. A modified version of HDPUG design was
.. weiterlesen
Nanomaterials Performance Advantages in Printed Electronics Addressing Implementation Issues
Nanotechnology is a key enabling technology for printed electronics. Low temperature reactivity,reaction speeds,flexibility and fine pitch considerations dictate that nanomaterials should be gi
.. weiterlesen
Phototonic Curing: Broad Implications in Printed Electronics
•Photonic curing uses high-intensity flash lamps to selectively heat target materials.
•The PulseForge tools are based on the patented use of photonic curing and are designed for use in develop
.. weiterlesen
Development of Printed Flex Circuits
•Developments of Printed FPCs
- PE resist for long FPCs
- Flexible Touch Sensor Panel(TSP) application
- Single-sided Printed FPCs
- Double-sided Printed FPCs
- Smart Printed FPCs
.. weiterlesen
The Effects of Human-Induced Contamination on PCB Assembly Electrical Reliability
With the ever-present pressure toward miniaturization in electronic devices,smaller distances between traces and component terminations are likely to increase the devices’ sensitivity to contam
.. weiterlesen
Capillary IC – A New Platform for High Throughput or High Resolution Separations of Ionic Compounds
High pressure capillary IC allows you to:
Lower operational costs – water,waste,consumables
“Always Ready”
Improved system and analytical performance
Convenience
Rush samples
Enables high-resol
.. weiterlesen
Cleanliness Assessment for Class III Lead-Free No-Clean Assemblies
For mission critical electronics or Class III products,such as those used within the military,aerospace and medical industries,highest electronic reliability is a requirement as failure is not
.. weiterlesen
CO2 Clean Manufacturing Technology for Electronic Device Fabrication
CO2 technology offers electronic device manufacturers a robust platform for a variety of precision cleaning and machining
applications. Surface and substrate contamination such as flux residues
.. weiterlesen
Electrical Test Conditions & Considerations
When testing PCBs it can be quite confusing as to what method to use,parameters are necessary for the Performance Class and what cost to associate in the build to way against the long term reli
.. weiterlesen
Hi Pot Dielectric Breakdown Automated Verification How-To
The Printed Circuit Board (PCB) builds get ever more complex. With this the layer counts climb but the overall thickness remains the same. From this the cores of the build are reduced and the d
.. weiterlesen
Two Print Stencils Systems
The Two print stencils process has been a very useful tool in SMT Assembly and Package Assembly. It is also useful in Assemblies that require mixed technologies; including SMT / Through Hole,SM
.. weiterlesen
Profiled Squeegee Blade: Rewrites the Rules for Angle of Attack
For centuries,the squeegee blade has been used throughout many applications for depositing viscous materials through screens and stencils to transfer images on to substrates,from cloth material
.. weiterlesen
Influence of Via Stub Length and Antipad Size on the Insertion Loss Profile
The growing transmission speed and volume of digital content increases the pressure on reduction of overall insertion loss of printed circuit boards permanently.
In today’s circuit boards,it is
.. weiterlesen
Embedded System Access - a Paradigm Shift in Electrical Test
Throughout a product’s life cycle it may need to be tested various times. New product designs need to be validated during the prototyping phase,manufacturing defects need to be detected and dia
.. weiterlesen
Why Signal Always Be Loss in a High Speed Frequency Transmission Line
The high speed transmission applications in the electronic product become inevitable developing trend. The signal integrity becomes the most important issue in the electronic industry. The mate
.. weiterlesen
Advanced Second Level Assembly Analysis Techniques - Troubleshooting Head-In-Pillow,Opens,and Shorts with Dual Full-Field 3D Surface Warpage Data Sets
SMT assembly planning and failure analysis of surface mount assembly defects often include component warpage evaluation. Coplanarity values of Integrated Circuit packages have traditionally bee
.. weiterlesen
Head in Pillow X-ray Inspection at Flextronics
Manufacturing technology faces challenges with new packages/process when confronting the need for high yields. Identifying product defects associated with the manufacturing process is a critica
.. weiterlesen
Online Databse of Materials for Printed Electronics
Materials Registry for Printed Electronics
- WMU’s CAPE received an award from FlexTech Alliance to create an online database for accessing technical information on functional materials used in
.. weiterlesen
Improving Yields and Quality: Two Case Studies: Graping and the Head-on-Pillow defect
HoP Mitigation is addressed with respect to solder paste,components,inspection,process and the environment.
Graping minimization recommendations are given with data driven suggestions.
.. weiterlesen
Gravure Printing of ITO Transparent Electrodes for Applications in Printed Electronics
ITO nanoparticles were successfully printed on glass with the AccuPress Gravure System
•A wide range of sheet resistivity values was achieved with different engraving resolutions of the gravure
.. weiterlesen
Printed & Flexible Electronics – Surf’s Up
Printed & Flexible Electronics
• Development Waves – 1st,2nd,and 3rd
• Essentials
• Products and Applications
• Technology and Infrastructure Development
• Printed & Flexible Electronics Pipeli
.. weiterlesen
Mixed Metals Impact on Reliability
With the adoption of RoHS and implementation of Lead Free solders a major concern is how this will impact reliability. Both commercial and military hardware are impacted by this change even tho
.. weiterlesen
Testing Intermetallic Fragility on Enig upon Addition of Limitless Cu
As reliability requirements increase,especially for defense and aerospace applications,the need to characterize components used in electronic assembly also increases. OEM and EMS companies look
.. weiterlesen
Assessment of Reterminated RoHS Components for SnPb Applications
The banning of Pb in electronic component termination finishes has flushed through the supply chain making it impossible in some cases for hi-reliability users to purchase Pb containing interco
.. weiterlesen
The Coming of The MultiChip Module
MultiChip Module Status
•It isn’t a new idea since back in the 1980’s everyone was trying to combine different components into a single package
•It started with Hybrids then different forms of
.. weiterlesen
BVA: Molded Cu Wire Contact Solution for Very High Density Package-on- Package (PoP) Applications
Stacking heterogeneous semiconductor die (memory and logic) within the same package outline can be considered for less complex applications but combining the memory and processor functions in a
.. weiterlesen
Printed Circuit Structures,the Evolution of Printed Circuit Boards
The Printed Circuit Board (PCB) is the backbone of electronics and a large number of consumer devices. The challenge to put more function in a smaller space requires more components utilizing s
.. weiterlesen
Cost effective 3D Glass Microfabrication for Advanced Electronic Packages
Interposer technologies are gathering more importance in IC packaging as the industry continues miniaturization trends in microfabrication nodes and IC packaging to meet design and utility need
.. weiterlesen
TOF SIMS Analysis for SnxOy Determination on Lead-Free HASL PCB’s
During the production of Lead-Free Hot Air Solder Leveling (LF HASL),non-wetting issues in several components were found including BGA pad. The common visual aspect of the suspicious pads was t
.. weiterlesen
Improving Density in Microwave Multilayer Printed Circuit Boards for Space Applications
The need in complexity for microwave space products such as active BFNs (Beam Forming Networks) is increasing,with a significantly growing number of amplitude / phase control points (number of
.. weiterlesen
Behavior of Materials in the Manufacturing Environment
This study was conducted to understand seven materials reliability,behavior of Dielectric constant and Dissipation factor over medium to high frequencies. A modified version of HDPUG design was
.. weiterlesen
Nanomaterials Performance Advantages in Printed Electronics Addressing Implementation Issues
Nanotechnology is a key enabling technology for printed electronics. Low temperature reactivity,reaction speeds,flexibility and fine pitch considerations dictate that nanomaterials should be gi
.. weiterlesen
Phototonic Curing: Broad Implications in Printed Electronics
•Photonic curing uses high-intensity flash lamps to selectively heat target materials.
•The PulseForge tools are based on the patented use of photonic curing and are designed for use in develop
.. weiterlesen
Development of Printed Flex Circuits
•Developments of Printed FPCs
- PE resist for long FPCs
- Flexible Touch Sensor Panel(TSP) application
- Single-sided Printed FPCs
- Double-sided Printed FPCs
- Smart Printed FPCs
.. weiterlesen
The Effects of Human-Induced Contamination on PCB Assembly Electrical Reliability
With the ever-present pressure toward miniaturization in electronic devices,smaller distances between traces and component terminations are likely to increase the devices’ sensitivity to contam
.. weiterlesen
Capillary IC – A New Platform for High Throughput or High Resolution Separations of Ionic Compounds
High pressure capillary IC allows you to:
Lower operational costs – water,waste,consumables
“Always Ready”
Improved system and analytical performance
Convenience
Rush samples
Enables high-resol
.. weiterlesen
Cleanliness Assessment for Class III Lead-Free No-Clean Assemblies
For mission critical electronics or Class III products,such as those used within the military,aerospace and medical industries,highest electronic reliability is a requirement as failure is not
.. weiterlesen
CO2 Clean Manufacturing Technology for Electronic Device Fabrication
CO2 technology offers electronic device manufacturers a robust platform for a variety of precision cleaning and machining
applications. Surface and substrate contamination such as flux residues
.. weiterlesen
Electrical Test Conditions & Considerations
When testing PCBs it can be quite confusing as to what method to use,parameters are necessary for the Performance Class and what cost to associate in the build to way against the long term reli
.. weiterlesen
Hi Pot Dielectric Breakdown Automated Verification How-To
The Printed Circuit Board (PCB) builds get ever more complex. With this the layer counts climb but the overall thickness remains the same. From this the cores of the build are reduced and the d
.. weiterlesen
Two Print Stencils Systems
The Two print stencils process has been a very useful tool in SMT Assembly and Package Assembly. It is also useful in Assemblies that require mixed technologies; including SMT / Through Hole,SM
.. weiterlesen
Profiled Squeegee Blade: Rewrites the Rules for Angle of Attack
For centuries,the squeegee blade has been used throughout many applications for depositing viscous materials through screens and stencils to transfer images on to substrates,from cloth material
.. weiterlesen