Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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TDI Imaging: An Efficient AOI and AXI Tool
As a result of heightened requirements for quality,integrity and reliability of electronic products,the role of wafer auditing
and nondestructive testing of printed circuit boards and electroni
.. weiterlesen
Analysis of Optical Inspection from AOI and AVI machines
In PCB industry,Optical Inspection has been grown rapidly in past decades. It is now playing an important role in manufacturing process. Most manufacturers are now using AOI machines to report
.. weiterlesen
Component Misplacement Prevention on the ICOS Tape & Reel process using TRIZ & Lean
The paper discusses on the problems faced by the Assembly,Test Manufacturing (ATM) plants of Intel Corporation for a certain Tape and Reel Process. The problem is generic across the other siste
.. weiterlesen
Minimizing Voiding In QFN Packages Using Solder Preforms
According to Prismark Partners,the use of QFNs is growing faster than any package type except for flip-chip CSPs. Prismark
projects that by 2013,32.6 billion QFNs will be assembled worldwide,wh
.. weiterlesen
Inclusion Voiding in Gull Wing Solder Joints
Solder voiding in ball grid array (BGA) solder joints has been well characterized and documented in IPC-A-610 and IPC-
7095 which define industry recommended BGA solder workmanship criteria and
.. weiterlesen
Void Detection in Large Solder Joints of Integrated Power Electronics
• Inspection of integrated power electronics = sophisticated test task
• X-ray inspection based on 2D / 2.5D principles not utilisable
• Full 3D inspection with adapted image capturing and reco
.. weiterlesen
Evaluation of Laminates in Pb-free HASL Process and Pb-free Assembly Environment
An evaluation of four FR4 laminates in commonly used stack-ups was done to determine their survivability for the Pb-free HASL process followed by a worst case Pb-free manufacturing environment
.. weiterlesen
A Novel Material for High Layer Count and High Reliability Printed Circuit Boards
Over the past few years a new family of laminate systems has been developed to face the increasing physical demands of
withstanding Pb-free soldering processes used in the assembly of RoHS comp
.. weiterlesen
Polyphenylene Ether Macromonomers. XI. Use in Non-Epoxy Printed Wiring Boards
The continuous progression toward portable,high frequency microelectronic systems has placed high demands on material
performance,notably low dielectric constants (Dk),low loss tangent (Df),low
.. weiterlesen
The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish
In this paper,we report on a comprehensive study regarding the morphology evolution and voiding of SnAgCu solder joints
on the central pad of two different packages – QFN and an Agilent package
.. weiterlesen
Effect of Cooling Rate on the Intermetallic Layer in Solder Joints
While it has long been known that the Cu6Sn5 intermetallic that plays a critical role in the reliability of solder joints made with tin-containing alloys on copper substrates exists in two diff
.. weiterlesen
No-Clean Flux Residue and Underfill Compatibility Effects on Electrical Reliability
No-clean soldering processes dominate the commercial electronics manufacturing world. With the explosion of growth in handheld electronics devices,manufacturers have been forced to look for way
.. weiterlesen
VOC-free Flux Study Not All WOA (Weak Organic Acids) Are the Same
In an effort to reduce volatile organic compound (VOC) emissions within our environment,policymakers
have encouraged and/or mandated that electronics manufacturers change from alcohol-based VOC
.. weiterlesen
Application Of Build-in Self Test In Functional Test Of DSL
1. What is BIST
2. What is DSL
3. DSL test items
4. Digital & Analog DSL test
5. BIST on DSL
6. Comparison & Benefits
.. weiterlesen
Boundary Scan Advanced Diagnostic Methods
Boundary-scan (1149.1) technology was originally developed to provide a far easier method to perform digital DC testing to detect intra-IC interconnect assembly faults,such as solder shorts and
.. weiterlesen
Cleaning in an HDI World
For many years there has been a huge disconnect between the engineers that design the assembly and the chemists responsible for developing the assembly materials. In short,engineers and chemist
.. weiterlesen
Precision Cleaning in 21st Century: New Solvent with Low Global Warming Potential
As we progress in the 21st century,electronics manufacturing will need more and more precision. Parts will get more complex since more components have to be assembled in smaller spaces. Circuit
.. weiterlesen
PWB Stress Testing Correlation: Accelerated vs. Application – “The Round Robin Begins”
Round Robin Reliability Evaluation “Revival” Proposal
1.TR-579
2.IST( IPC-9151/TM 2.6.26) 3.HATS (IPC-9151)
4.CITC(EIT) 5.TS(TM650-2.6.7.2B,MIL31032/1C) 6. Application(Odometer )
.. weiterlesen
Revolutionary Technique for Preparing Microvia Microsections of Printed Circuit Boards
We describe the design of a novel test structure,to which we have given the name “HD”,that will facilitate the evaluation of blind and buried microvias in printed circuit boards,in comparison w
.. weiterlesen
Must Defluxers Follow SCAQMD Rules Throughout the U.S.? Productive Progress
What We Achieved: Current Proposed OTC Model Rule Modifications
• Vapor degreasing exempted from 25 g/L limit
– NESHAP-like equipment & controls
• 150 g/L VOC maximum for electronics assemblies
.. weiterlesen
High Melting Lead-Free Mixed Biagx Solder Paste System
Although lead-free soldering has been main stream in the industry since 2006,with the replacement of eutectic SnPb system by the Sn/Ag/Cu system,the development of drop-in lead-free alternative
.. weiterlesen
An Investigation into Low Temperature Tin-Bismuth and Tin-Bismuth-Silver Lead-Free Alloy Solder Pastes for Electronics Manufacturing Applications
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive component
.. weiterlesen
Assembly Challenges of Bottom Terminated Components
Bottom terminated component (BTC) assembly has rapidly increased in recent years. This type of package is attractive due to its low cost and good functional performance (improved signal speeds
.. weiterlesen
Pb-Free Selective Wave Solder Guidelines for Thermally Challenging PCBs
As the use of lead-free alloys has increased in electronic assemblies,much work has been done to develop Design for Manufacturability (DFM) guidelines for the new materials. However,there are s
.. weiterlesen
Hot nitrogen for wave soldering
- Hot nitrogen technology for local inerting system of wave
soldering machines has proved to give significant advantages with Tin Lead or Lead free solders:
- Better heat transfer on the PCBs,e
.. weiterlesen
Step Stress Testing of Solid Tantalum Capacitors
Solid tantalum capacitors were introduced to the market more than five decades ago and continue to be widely used. Reliability issues arise when tantalum capacitors are exposed to excessive the
.. weiterlesen
Flip Chip Package Qualification of RF-IC Packages
Quad Flat Pack No Leads (QFNs) are thermally enhanced plastic packages that use conventional copper leadframe with wire bonded interconnects. . These leadless components provide an advanced pac
.. weiterlesen
Effect of Chemical and Processing Parameters on Hole Filling Characteristics of Copper Electroplating
Miniaturization and increased functionality demands of electronics have substantially decreased the sizes of electronic features that need to be plated. The circuit density of printed circuit d
.. weiterlesen
New Challenges for Higher Aspect Ratio: Filling Through holes and Blind Micro Vias with Copper by Reverse Pulse Plating
This paper presents systematic investigations on complete Through Hole filling for cores by a Cu electroplating process as an alternative to the common paste plugging process. This electro plat
.. weiterlesen
PTH Core-to-Core Interconnect Using Sintered Conductive Pastes
The market for high-layer-count printed circuit boards (PCB) containing blind and buried vias was once relatively small,and
focused on specialized applications in the military and high end comp
.. weiterlesen
TDI Imaging: An Efficient AOI and AXI Tool
As a result of heightened requirements for quality,integrity and reliability of electronic products,the role of wafer auditing
and nondestructive testing of printed circuit boards and electroni
.. weiterlesen
Analysis of Optical Inspection from AOI and AVI machines
In PCB industry,Optical Inspection has been grown rapidly in past decades. It is now playing an important role in manufacturing process. Most manufacturers are now using AOI machines to report
.. weiterlesen
Component Misplacement Prevention on the ICOS Tape & Reel process using TRIZ & Lean
The paper discusses on the problems faced by the Assembly,Test Manufacturing (ATM) plants of Intel Corporation for a certain Tape and Reel Process. The problem is generic across the other siste
.. weiterlesen
Minimizing Voiding In QFN Packages Using Solder Preforms
According to Prismark Partners,the use of QFNs is growing faster than any package type except for flip-chip CSPs. Prismark
projects that by 2013,32.6 billion QFNs will be assembled worldwide,wh
.. weiterlesen
Inclusion Voiding in Gull Wing Solder Joints
Solder voiding in ball grid array (BGA) solder joints has been well characterized and documented in IPC-A-610 and IPC-
7095 which define industry recommended BGA solder workmanship criteria and
.. weiterlesen
Void Detection in Large Solder Joints of Integrated Power Electronics
• Inspection of integrated power electronics = sophisticated test task
• X-ray inspection based on 2D / 2.5D principles not utilisable
• Full 3D inspection with adapted image capturing and reco
.. weiterlesen
Evaluation of Laminates in Pb-free HASL Process and Pb-free Assembly Environment
An evaluation of four FR4 laminates in commonly used stack-ups was done to determine their survivability for the Pb-free HASL process followed by a worst case Pb-free manufacturing environment
.. weiterlesen
A Novel Material for High Layer Count and High Reliability Printed Circuit Boards
Over the past few years a new family of laminate systems has been developed to face the increasing physical demands of
withstanding Pb-free soldering processes used in the assembly of RoHS comp
.. weiterlesen
Polyphenylene Ether Macromonomers. XI. Use in Non-Epoxy Printed Wiring Boards
The continuous progression toward portable,high frequency microelectronic systems has placed high demands on material
performance,notably low dielectric constants (Dk),low loss tangent (Df),low
.. weiterlesen
The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish
In this paper,we report on a comprehensive study regarding the morphology evolution and voiding of SnAgCu solder joints
on the central pad of two different packages – QFN and an Agilent package
.. weiterlesen
Effect of Cooling Rate on the Intermetallic Layer in Solder Joints
While it has long been known that the Cu6Sn5 intermetallic that plays a critical role in the reliability of solder joints made with tin-containing alloys on copper substrates exists in two diff
.. weiterlesen
No-Clean Flux Residue and Underfill Compatibility Effects on Electrical Reliability
No-clean soldering processes dominate the commercial electronics manufacturing world. With the explosion of growth in handheld electronics devices,manufacturers have been forced to look for way
.. weiterlesen
VOC-free Flux Study Not All WOA (Weak Organic Acids) Are the Same
In an effort to reduce volatile organic compound (VOC) emissions within our environment,policymakers
have encouraged and/or mandated that electronics manufacturers change from alcohol-based VOC
.. weiterlesen
Application Of Build-in Self Test In Functional Test Of DSL
1. What is BIST
2. What is DSL
3. DSL test items
4. Digital & Analog DSL test
5. BIST on DSL
6. Comparison & Benefits
.. weiterlesen
Boundary Scan Advanced Diagnostic Methods
Boundary-scan (1149.1) technology was originally developed to provide a far easier method to perform digital DC testing to detect intra-IC interconnect assembly faults,such as solder shorts and
.. weiterlesen
Cleaning in an HDI World
For many years there has been a huge disconnect between the engineers that design the assembly and the chemists responsible for developing the assembly materials. In short,engineers and chemist
.. weiterlesen
Precision Cleaning in 21st Century: New Solvent with Low Global Warming Potential
As we progress in the 21st century,electronics manufacturing will need more and more precision. Parts will get more complex since more components have to be assembled in smaller spaces. Circuit
.. weiterlesen
PWB Stress Testing Correlation: Accelerated vs. Application – “The Round Robin Begins”
Round Robin Reliability Evaluation “Revival” Proposal
1.TR-579
2.IST( IPC-9151/TM 2.6.26) 3.HATS (IPC-9151)
4.CITC(EIT) 5.TS(TM650-2.6.7.2B,MIL31032/1C) 6. Application(Odometer )
.. weiterlesen
Revolutionary Technique for Preparing Microvia Microsections of Printed Circuit Boards
We describe the design of a novel test structure,to which we have given the name “HD”,that will facilitate the evaluation of blind and buried microvias in printed circuit boards,in comparison w
.. weiterlesen
Must Defluxers Follow SCAQMD Rules Throughout the U.S.? Productive Progress
What We Achieved: Current Proposed OTC Model Rule Modifications
• Vapor degreasing exempted from 25 g/L limit
– NESHAP-like equipment & controls
• 150 g/L VOC maximum for electronics assemblies
.. weiterlesen
High Melting Lead-Free Mixed Biagx Solder Paste System
Although lead-free soldering has been main stream in the industry since 2006,with the replacement of eutectic SnPb system by the Sn/Ag/Cu system,the development of drop-in lead-free alternative
.. weiterlesen
An Investigation into Low Temperature Tin-Bismuth and Tin-Bismuth-Silver Lead-Free Alloy Solder Pastes for Electronics Manufacturing Applications
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive component
.. weiterlesen
Assembly Challenges of Bottom Terminated Components
Bottom terminated component (BTC) assembly has rapidly increased in recent years. This type of package is attractive due to its low cost and good functional performance (improved signal speeds
.. weiterlesen
Pb-Free Selective Wave Solder Guidelines for Thermally Challenging PCBs
As the use of lead-free alloys has increased in electronic assemblies,much work has been done to develop Design for Manufacturability (DFM) guidelines for the new materials. However,there are s
.. weiterlesen
Hot nitrogen for wave soldering
- Hot nitrogen technology for local inerting system of wave
soldering machines has proved to give significant advantages with Tin Lead or Lead free solders:
- Better heat transfer on the PCBs,e
.. weiterlesen
Step Stress Testing of Solid Tantalum Capacitors
Solid tantalum capacitors were introduced to the market more than five decades ago and continue to be widely used. Reliability issues arise when tantalum capacitors are exposed to excessive the
.. weiterlesen
Flip Chip Package Qualification of RF-IC Packages
Quad Flat Pack No Leads (QFNs) are thermally enhanced plastic packages that use conventional copper leadframe with wire bonded interconnects. . These leadless components provide an advanced pac
.. weiterlesen
Effect of Chemical and Processing Parameters on Hole Filling Characteristics of Copper Electroplating
Miniaturization and increased functionality demands of electronics have substantially decreased the sizes of electronic features that need to be plated. The circuit density of printed circuit d
.. weiterlesen
New Challenges for Higher Aspect Ratio: Filling Through holes and Blind Micro Vias with Copper by Reverse Pulse Plating
This paper presents systematic investigations on complete Through Hole filling for cores by a Cu electroplating process as an alternative to the common paste plugging process. This electro plat
.. weiterlesen
PTH Core-to-Core Interconnect Using Sintered Conductive Pastes
The market for high-layer-count printed circuit boards (PCB) containing blind and buried vias was once relatively small,and
focused on specialized applications in the military and high end comp
.. weiterlesen