Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Key Issues in Bottom Termination Component (BTC) Design and Assembly for Improved Reliability and Yield
With the release of IPC 7093,"Design and Assembly Process Implementation for Bottom Termination SMT Components," earlier this year,the term BTC is the newest acronym to enter the world of SMT.
.. weiterlesen
Low Silver Solder Alloys with Good Drop Shock and Thermal Cycle Reliability
SAC105 was shown to have better drop shock reliability than SAC305 however SAC105 thermal cycle performance was not necessarily as good at SAC305. Small quantities (0.1% or so) of some elements
.. weiterlesen
Thermal Cycle Solder Joint Integrity Assessment of SnBi Plated Components
The implementation of the European Restriction of Hazardous Substances (RoHS) Directive has initiated an electronics industry materials evolution. Printed wiring board laminate suppliers,compon
.. weiterlesen
A Review of Issues and Next Steps in Moving From Sn3Ag0.5Cu to Low Silver Solder Alloys
The implementation of the European Restriction of Hazardous Substances (RoHS) Directive has initiated an electronics industry materials evolution. Printed wiring board laminate suppliers,compon
.. weiterlesen
How to Manage Wave Solder Alloy Contaminations
European electronics industry is soldering with lead-free alloys for one decade now. In this period not only the knowledge of the alloys in the assembly process has been improved,but also a hig
.. weiterlesen
Use of the IPC Solder Spread Coupon to Evaluate Pb-Free Solder Pastes and PCB Surface Finishes
Continental is using the IPC solder spread coupon (adopted from NPL) to evaluate Pb-free solder pastes and PCB surface finishes for Solderability. This presentation will compare and contrast so
.. weiterlesen
Physics-of-Failure Approach to Integrated Circuit Reliability
Modern electronics typically consist of microprocessors and other complex integrated circuits (ICs) such as FPGAs,ADCs,and memory. They are susceptible to electrical,mechanical and thermal mode
.. weiterlesen
Testing the Long Term Reliability of an Environmentally Friendly PCB Final Finish
The new plasma polymer PCB final finish that eliminates harsh chemicals and waste streams also promises to eliminate creep corrosion,but will it stand the test of time? Before any new produc
.. weiterlesen
Controlling Moisture in Printed Circuit Boards
Moisture can accelerate various failure mechanisms in printed circuit board assemblies. Moisture can be initially present in the epoxy glass prepreg,absorbed during the wet processes in printed
.. weiterlesen
HDPUG Pb-Free Board Materials Reliability Project 2 Moisture Sensitivity and Its Effect on Delamination
As part of High Density Packaging Users Group (HDPUG) Pb-Free Board Materials Reliability Project 2,the moisture sensitivity of various lead-free laminates and the effect of moisture uptake on
.. weiterlesen
Moisture Measurements in PCBs and Impact of Design on Desorption Behaviour
High levels of residual moisture in PCBs are problematic and can result in delamination during soldering and rework. Moisture accumulates during storage and industry practice recommends specifi
.. weiterlesen
A New Method for Measuring Conformal Coating Adhesion
Coating adhesion has been a difficult property to measure,and the industry has made do with a scratch test that is only capable of qualitative tests. NPL with industrial partners,have developed
.. weiterlesen
Introducing Novel Flame Retardant Materials to Produce Exceptionally Low Viscosity,High Temperature Resistant Epoxy Encapsulation Compounds
The most common epoxy encapsulation compounds available on the market utilise specialised fillers,such as Alumina trihydrate (ATH),to provide a high level of flame retardancy. Such fillers deco
.. weiterlesen
Exploring the Performance of Silicone Gels at High and Low Temperature
Silicones have been used in the electronics industry as protective/assembly materials for operations that will have a wide temperature variation. A large variety of silicone products are availa
.. weiterlesen
Applications of Solder Fortification with Preforms
Although many have predicted the demise of through-hole components,they are alive and well with tens of billions assembled each year. In many cases these components are assembled by wave solder
.. weiterlesen
Pad Design and Process for Voiding Control at QFN Assembly
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size,such as a near die si
.. weiterlesen
Investigation for Use of ‘Pin in Paste’ Reflow Process with Combination of Solder Preforms to Eliminate Wave Soldering
The Pin in Paste (PiP) technology is the process of soldering Pin through hole (PTH) components using the Surface Mount Technology (SMT) reflow process. The use of PiP process offers several ad
.. weiterlesen
Down-Selecting Low Solids Fluxes for Pb-free Selective Soldering
Although many predicted the demise of through-hole components,they are alive and well with tens of billions used each year. In mixed SMT/through-hole PCBs,through-hole components,and especially
.. weiterlesen
Effect of Thermal Conditions and Durations on Reaction Kinetics and Phase Transformations within SAC 305 Solder
As technology becomes increasingly reliant on electronics,understanding the longevity of lead-free solder also becomes imperative. This research project focused on phase transformation kinetics
.. weiterlesen
Mitigating Head-in-Pillow Defects: An Experimental Approach to Identify No-Clean Soldering Materials
•Overview
•Test Method Considerations
•Proposed Test Methodology
•PCB,Stencil & Part Information
•Pick-up Adapter Design
•Test Setup Overview
•Head-in-Pillow Defect Detection
•Test Parameters
•
.. weiterlesen
IPC Tutorial Topic 3: Evaluation of No-clean Pb-free Halogen-free Solder Pastes That Can Effectively Mitigate Head-in-Pillow Defects and Have Good...
•Background and Objective
•Head-in-Pillow (HiP) Defect
•In Circuit Test (ICT) Testability
•Evaluation Steps
- Solder Paste Selection
- Head-in-Pillow Test
- Printability & Solderability Test
.. weiterlesen
High Speed Digital Imaging Using Gray Level with Micromirror Array
In recent years the PCB industry has increasingly turned to digital,or maskless,imaging techniques in order meet demands for tighter registration between layers. Many of these techniques,includ
.. weiterlesen
The Elimination of Whiskers from Electroplated Tin
After the implementation of RoHS and the discontinued use of lead bearing products and the introduction of lead free (LF)
solders,tin and its alloys have come to the forefront as the first choi
.. weiterlesen
3D Interconnection Technologies for Electronic Products: A Perspective View of Electronic Interconnection Technologies from Chip to System
3D is the shorthand term for the three dimensions of Cartesian coordinate space X,Y and Z. With that definition in mind,one will find with little or no stretching of the imagination,that the fi
.. weiterlesen
Improved Efficiency Using Root Cause Failure Analysis
A PCB fails final test. Why? Was it the solder paste? The screen printer? The PCB assembly machine? The reflow oven or none of the above?
Unplanned downtime is a costly fact of life. In order t
.. weiterlesen
Reducing Defects with Embedded Sensing Technology
Typical SMT production lines are a collection of disconnected machines performing various tasks. Errors can occur at any step during this process,but often go undetected until the PWB is comple
.. weiterlesen
Analysis on Combination of AOI and AVI machines
In PCB industry,AOI (Automated Optical Inspection) has been grown rapidly in past decades. It is now playing an important role in manufacturing process. Most manufacturers are now using AOI m
.. weiterlesen
WLCSP and Flip Chip Production Bumping using Electroless Ni/Au Plating and Wafer Level Solder Sphere Transfer Technologies
There are three main packaging technologies used by the semiconductor industry today to create solder bumps on wafers: paste printing,electroplating,or sphere dropping [1]. The choice between t
.. weiterlesen
Cost Effective and User Friendly Nitrogen Inerting Technology For Lead-Free Wave Soldering
It is well known that nitrogen inerting in wave soldering can significantly reduce dross formation and improve solder wetting. For lead-free wave soldering,the benefits of N2 inerting are even
.. weiterlesen
Key Issues in Bottom Termination Component (BTC) Design and Assembly for Improved Reliability and Yield
With the release of IPC 7093,"Design and Assembly Process Implementation for Bottom Termination SMT Components," earlier this year,the term BTC is the newest acronym to enter the world of SMT.
.. weiterlesen
Low Silver Solder Alloys with Good Drop Shock and Thermal Cycle Reliability
SAC105 was shown to have better drop shock reliability than SAC305 however SAC105 thermal cycle performance was not necessarily as good at SAC305. Small quantities (0.1% or so) of some elements
.. weiterlesen
Thermal Cycle Solder Joint Integrity Assessment of SnBi Plated Components
The implementation of the European Restriction of Hazardous Substances (RoHS) Directive has initiated an electronics industry materials evolution. Printed wiring board laminate suppliers,compon
.. weiterlesen
A Review of Issues and Next Steps in Moving From Sn3Ag0.5Cu to Low Silver Solder Alloys
The implementation of the European Restriction of Hazardous Substances (RoHS) Directive has initiated an electronics industry materials evolution. Printed wiring board laminate suppliers,compon
.. weiterlesen
How to Manage Wave Solder Alloy Contaminations
European electronics industry is soldering with lead-free alloys for one decade now. In this period not only the knowledge of the alloys in the assembly process has been improved,but also a hig
.. weiterlesen
Use of the IPC Solder Spread Coupon to Evaluate Pb-Free Solder Pastes and PCB Surface Finishes
Continental is using the IPC solder spread coupon (adopted from NPL) to evaluate Pb-free solder pastes and PCB surface finishes for Solderability. This presentation will compare and contrast so
.. weiterlesen
Physics-of-Failure Approach to Integrated Circuit Reliability
Modern electronics typically consist of microprocessors and other complex integrated circuits (ICs) such as FPGAs,ADCs,and memory. They are susceptible to electrical,mechanical and thermal mode
.. weiterlesen
Testing the Long Term Reliability of an Environmentally Friendly PCB Final Finish
The new plasma polymer PCB final finish that eliminates harsh chemicals and waste streams also promises to eliminate creep corrosion,but will it stand the test of time? Before any new produc
.. weiterlesen
Controlling Moisture in Printed Circuit Boards
Moisture can accelerate various failure mechanisms in printed circuit board assemblies. Moisture can be initially present in the epoxy glass prepreg,absorbed during the wet processes in printed
.. weiterlesen
HDPUG Pb-Free Board Materials Reliability Project 2 Moisture Sensitivity and Its Effect on Delamination
As part of High Density Packaging Users Group (HDPUG) Pb-Free Board Materials Reliability Project 2,the moisture sensitivity of various lead-free laminates and the effect of moisture uptake on
.. weiterlesen
Moisture Measurements in PCBs and Impact of Design on Desorption Behaviour
High levels of residual moisture in PCBs are problematic and can result in delamination during soldering and rework. Moisture accumulates during storage and industry practice recommends specifi
.. weiterlesen
A New Method for Measuring Conformal Coating Adhesion
Coating adhesion has been a difficult property to measure,and the industry has made do with a scratch test that is only capable of qualitative tests. NPL with industrial partners,have developed
.. weiterlesen
Introducing Novel Flame Retardant Materials to Produce Exceptionally Low Viscosity,High Temperature Resistant Epoxy Encapsulation Compounds
The most common epoxy encapsulation compounds available on the market utilise specialised fillers,such as Alumina trihydrate (ATH),to provide a high level of flame retardancy. Such fillers deco
.. weiterlesen
Exploring the Performance of Silicone Gels at High and Low Temperature
Silicones have been used in the electronics industry as protective/assembly materials for operations that will have a wide temperature variation. A large variety of silicone products are availa
.. weiterlesen
Applications of Solder Fortification with Preforms
Although many have predicted the demise of through-hole components,they are alive and well with tens of billions assembled each year. In many cases these components are assembled by wave solder
.. weiterlesen
Pad Design and Process for Voiding Control at QFN Assembly
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size,such as a near die si
.. weiterlesen
Investigation for Use of ‘Pin in Paste’ Reflow Process with Combination of Solder Preforms to Eliminate Wave Soldering
The Pin in Paste (PiP) technology is the process of soldering Pin through hole (PTH) components using the Surface Mount Technology (SMT) reflow process. The use of PiP process offers several ad
.. weiterlesen
Down-Selecting Low Solids Fluxes for Pb-free Selective Soldering
Although many predicted the demise of through-hole components,they are alive and well with tens of billions used each year. In mixed SMT/through-hole PCBs,through-hole components,and especially
.. weiterlesen
Effect of Thermal Conditions and Durations on Reaction Kinetics and Phase Transformations within SAC 305 Solder
As technology becomes increasingly reliant on electronics,understanding the longevity of lead-free solder also becomes imperative. This research project focused on phase transformation kinetics
.. weiterlesen
Mitigating Head-in-Pillow Defects: An Experimental Approach to Identify No-Clean Soldering Materials
•Overview
•Test Method Considerations
•Proposed Test Methodology
•PCB,Stencil & Part Information
•Pick-up Adapter Design
•Test Setup Overview
•Head-in-Pillow Defect Detection
•Test Parameters
•
.. weiterlesen
IPC Tutorial Topic 3: Evaluation of No-clean Pb-free Halogen-free Solder Pastes That Can Effectively Mitigate Head-in-Pillow Defects and Have Good...
•Background and Objective
•Head-in-Pillow (HiP) Defect
•In Circuit Test (ICT) Testability
•Evaluation Steps
- Solder Paste Selection
- Head-in-Pillow Test
- Printability & Solderability Test
.. weiterlesen
High Speed Digital Imaging Using Gray Level with Micromirror Array
In recent years the PCB industry has increasingly turned to digital,or maskless,imaging techniques in order meet demands for tighter registration between layers. Many of these techniques,includ
.. weiterlesen
The Elimination of Whiskers from Electroplated Tin
After the implementation of RoHS and the discontinued use of lead bearing products and the introduction of lead free (LF)
solders,tin and its alloys have come to the forefront as the first choi
.. weiterlesen
3D Interconnection Technologies for Electronic Products: A Perspective View of Electronic Interconnection Technologies from Chip to System
3D is the shorthand term for the three dimensions of Cartesian coordinate space X,Y and Z. With that definition in mind,one will find with little or no stretching of the imagination,that the fi
.. weiterlesen
Improved Efficiency Using Root Cause Failure Analysis
A PCB fails final test. Why? Was it the solder paste? The screen printer? The PCB assembly machine? The reflow oven or none of the above?
Unplanned downtime is a costly fact of life. In order t
.. weiterlesen
Reducing Defects with Embedded Sensing Technology
Typical SMT production lines are a collection of disconnected machines performing various tasks. Errors can occur at any step during this process,but often go undetected until the PWB is comple
.. weiterlesen
Analysis on Combination of AOI and AVI machines
In PCB industry,AOI (Automated Optical Inspection) has been grown rapidly in past decades. It is now playing an important role in manufacturing process. Most manufacturers are now using AOI m
.. weiterlesen
WLCSP and Flip Chip Production Bumping using Electroless Ni/Au Plating and Wafer Level Solder Sphere Transfer Technologies
There are three main packaging technologies used by the semiconductor industry today to create solder bumps on wafers: paste printing,electroplating,or sphere dropping [1]. The choice between t
.. weiterlesen
Cost Effective and User Friendly Nitrogen Inerting Technology For Lead-Free Wave Soldering
It is well known that nitrogen inerting in wave soldering can significantly reduce dross formation and improve solder wetting. For lead-free wave soldering,the benefits of N2 inerting are even
.. weiterlesen