Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Polyphenylene Ether Macromonomer. Viii. Low Z-Axis Cte,Low Df Epoxy Laminates
Properties of printed circuit board laminates are a function of the type and levels of its components. Endeavors to a balance various performance criteria involve balancing the types and amount
.. weiterlesen
Identifying Reliable Applications for the Tin-Zinc Eutectic in Electrical and Electronic Assemblies
With a melting point of 199°C,about 20°C lower than the liquidus temperature of SAC305 the Sn-Zn eutectic (Sn~9% Zn) appears to be an attractive candidate as a Pb-free solder. With,at July 2010
.. weiterlesen
Mechanical Shock Test Performance of SAC105 (Sn-1.0Ag-0.5Cu) and Sn-3.5Ag,BGA Components with SAC305 Solder Paste on NiAu and OSP Board Surface...
Many BGA and CSP component suppliers have begun shipment of components with a variety of second generation lead-free
solder ball alloys based on the improved mechanical shock resistance. Althou
.. weiterlesen
Low-Silver BGA Assembly Phase II – Reliability Assessment Seventh Report: Mixed Metallurgy Solder Joint Thermal Cycling Results
Some ball grid array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or SAC405 (4% Ag) to alloys with lower silver contents and often with “micro alloying” additions. There are
.. weiterlesen
Failure Mechanisms in Embedded Planar Capacitors during High Temperature Operating Life (HTOL) Testing
High temperature operating life (HTOL) testing was performed on embedded planar capacitors (with epoxy- BaTiO3 composite dielectric) by subjecting these devices to highly accelerated temperatur
.. weiterlesen
Embedded Components: A Comparative Analysis of Reliability
In light of new process and product technologies in the field of embedded components,questions arise with respect to
advantages and potential disadvantages to standard SMT component placement w
.. weiterlesen
Development of a Design & Manufacturing Environment for Reliable and Cost- Effective PCB Embedding Technology
The desire to have more functionality into increasingly smaller size end products has been pushing the PCB and IC
Packaging industry towards High Density Interconnect (HDI) and 3D Packaging (st
.. weiterlesen
The Enigmatic Breakout Angle
We describe a coupon design that makes available,in an elegant and efficient way,information unattainable even from multiple-coupon vertical cross-sections. The new design allows quantitative d
.. weiterlesen
Nano Technology Improve Critical Printing Process
The challenges of successful solder printing in the High Volume / Low Mix cell phone environment,which is linked with the continuing trend to miniaturize electronic assemblies,requires a new ap
.. weiterlesen
Evaluation of Lead Free Solder Paste Materials for PCBA
Most of electronic components on a printed circuit board assembly (PCBA) are surface mount components assembled using solder paste material. Having a good solder paste material is very critical
.. weiterlesen
A Unified CAD-PLM Architecture for Improving Electronics Design Productivity through Automation,Collaboration,and Cloud Computing
In electronics design,Computer Aided Design (CAD) tools manage part data in a logical schematic view (a part symbol) and a physical PCB view (a part footprint). Yet,a part has a third view,whic
.. weiterlesen
Quantitative Evaluation of New SMT Stencil Materials
High yields in the stencil printing process are essential to a profitable SMT assembly operation. But as circuit complexity continues to increase,so do the challenges of maintaining a successfu
.. weiterlesen
Sculpted Flex Circuits as an Electronics Packaging Solution
Sculpted Flex Circuits are a very cost effective,low profile termination solution that is not very well known. These Flex Circuit hybrids can provide the user a simple interconnection between c
.. weiterlesen
Weigh/Bake/Weigh Testing To Determine Moisture Content in Printed Boards
Entrapped moisture within printed boards can expand during soldering operations,causing delamination or other damage. Available methods for determining moisture content may be destructive
or no
.. weiterlesen
HDI Training & Implementation at Eagle Test Systems
Eagle Test Systems (ETS) a Teradyne Company established a team during 2009 to develop a training exercise that would bring High Density Interconnect (HDI) knowledge to new products. A digital m
.. weiterlesen
Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies,generating much concern. A head-in-pillow defect is the in
.. weiterlesen
Void or Not to Void
- Background: What is a void?
- What is a "macro" void?
- What is a “planar” void?
- What is a “shrinkage” void?
- What is a “microvia” void?
- What is a “pinhole” void?
- What is a “Kirkendall
.. weiterlesen
Drop Testing of a Pb-Free Board after Assembly and SnPb-Rework
•Board-level drop shock test was performed on 9 assemblies
–63 parts / board
–Parts representative of military package styles
•Assembled on Pb-free compatible laminate with SAC 305 solder
•Sele
.. weiterlesen
Management and Mitigation of Tin Whiskers for Lead-Free Electronics
The lead-free directive from the EU has created a number of challenges for high reliability electronic applications. Key among those challenges is the need to address the issue of tin whiskers.
.. weiterlesen
Improving Tin Whisker Testing through Quantitative Measurements of Plated Film Properties
- Correlating film properties to the propensity to whisker will lead to the development of a comprehensive whisker growth model and create successful mitigation strategies.
•Hillock and whisker
.. weiterlesen
Leveraging IPC 1752 for Product Lifecycle Analytics
- Regulations are driving increasing IPC-1752 use
- More restricted substances and product categories in scope
- The business challenge is much bigger than “regulatory compliance”
- Teams incre
.. weiterlesen
Reliability and Quality Planning in the Product Development Cycle
In globally competitive markets,managing product quality,reliability and risk is not an option. However,it also brings its own unique set of challenges to complex organizations:
- Product desig
.. weiterlesen
Effects of Nano-Tio2 Particles Additions on Microstructure Development And Hardness of Sn3.5Ag0.5Cu Composite Solder
The effects of nano-TiO particle additives on the microstructure and microhardness of the 2 Sn3.5Ag0.5Cu composite solder were studied. Results show that alloying with nano-TiO 2 particles dram
.. weiterlesen
Tin Corrosion under QFN Packages at Elevated Temperature and Humidity
Using X-ray imaging,solder corrosion,resembling metal migration,had been observed under QFN (Quad Flat No-Lead package) devices and chip resistors on circuit boards that were processed with two
.. weiterlesen
Analytical Procedures for Portable Lead-Free Alloy Test Data
• Genesis in December 2008
• Follow-up discussions APEX 2009
• Input received from SMEs
• Conference Call July 22,2009
• Discussions IPC Midwest 2009
• First white paper issued by IPC SPVC June
.. weiterlesen
ESD Control for the Automotive Electronics Industry
Like many other electronics industries,the automotive electronics industry has long been concerned about ESD. As dramatically seen in the news today,quality recalls can detrimentally affect the
.. weiterlesen
Strategies for the Prevention of Board Strain and Cracked Chips in Automotive Electronics
BGA’s,ceramic capacitors,and similar strain sensitive components are used extensively throughout the automotive and consumer electronics industries. Unfortunately these components can be easily
.. weiterlesen
Reliable Solder Identification by X-ray Fluorescence Spectroscopy
High reliability applications in the military and aerospace industry require reliable solder finish
identification on components within the supply system of DoD,NASA,and many other organization
.. weiterlesen
Design for Reliability: The Next Generation
As margins on electronics technology have continued to erode,an increasing number of organizations have implemented design for reliability practices to ensure device performance while meeting t
.. weiterlesen
Die Attach Solder Materials and Application Technology
Advancing technology frequently requires an accompanying advancement in materials technology. Recently,these advances are also driven by changes in environmental legislation as well. Specifical
.. weiterlesen
Polyphenylene Ether Macromonomer. Viii. Low Z-Axis Cte,Low Df Epoxy Laminates
Properties of printed circuit board laminates are a function of the type and levels of its components. Endeavors to a balance various performance criteria involve balancing the types and amount
.. weiterlesen
Identifying Reliable Applications for the Tin-Zinc Eutectic in Electrical and Electronic Assemblies
With a melting point of 199°C,about 20°C lower than the liquidus temperature of SAC305 the Sn-Zn eutectic (Sn~9% Zn) appears to be an attractive candidate as a Pb-free solder. With,at July 2010
.. weiterlesen
Mechanical Shock Test Performance of SAC105 (Sn-1.0Ag-0.5Cu) and Sn-3.5Ag,BGA Components with SAC305 Solder Paste on NiAu and OSP Board Surface...
Many BGA and CSP component suppliers have begun shipment of components with a variety of second generation lead-free
solder ball alloys based on the improved mechanical shock resistance. Althou
.. weiterlesen
Low-Silver BGA Assembly Phase II – Reliability Assessment Seventh Report: Mixed Metallurgy Solder Joint Thermal Cycling Results
Some ball grid array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or SAC405 (4% Ag) to alloys with lower silver contents and often with “micro alloying” additions. There are
.. weiterlesen
Failure Mechanisms in Embedded Planar Capacitors during High Temperature Operating Life (HTOL) Testing
High temperature operating life (HTOL) testing was performed on embedded planar capacitors (with epoxy- BaTiO3 composite dielectric) by subjecting these devices to highly accelerated temperatur
.. weiterlesen
Embedded Components: A Comparative Analysis of Reliability
In light of new process and product technologies in the field of embedded components,questions arise with respect to
advantages and potential disadvantages to standard SMT component placement w
.. weiterlesen
Development of a Design & Manufacturing Environment for Reliable and Cost- Effective PCB Embedding Technology
The desire to have more functionality into increasingly smaller size end products has been pushing the PCB and IC
Packaging industry towards High Density Interconnect (HDI) and 3D Packaging (st
.. weiterlesen
The Enigmatic Breakout Angle
We describe a coupon design that makes available,in an elegant and efficient way,information unattainable even from multiple-coupon vertical cross-sections. The new design allows quantitative d
.. weiterlesen
Nano Technology Improve Critical Printing Process
The challenges of successful solder printing in the High Volume / Low Mix cell phone environment,which is linked with the continuing trend to miniaturize electronic assemblies,requires a new ap
.. weiterlesen
Evaluation of Lead Free Solder Paste Materials for PCBA
Most of electronic components on a printed circuit board assembly (PCBA) are surface mount components assembled using solder paste material. Having a good solder paste material is very critical
.. weiterlesen
A Unified CAD-PLM Architecture for Improving Electronics Design Productivity through Automation,Collaboration,and Cloud Computing
In electronics design,Computer Aided Design (CAD) tools manage part data in a logical schematic view (a part symbol) and a physical PCB view (a part footprint). Yet,a part has a third view,whic
.. weiterlesen
Quantitative Evaluation of New SMT Stencil Materials
High yields in the stencil printing process are essential to a profitable SMT assembly operation. But as circuit complexity continues to increase,so do the challenges of maintaining a successfu
.. weiterlesen
Sculpted Flex Circuits as an Electronics Packaging Solution
Sculpted Flex Circuits are a very cost effective,low profile termination solution that is not very well known. These Flex Circuit hybrids can provide the user a simple interconnection between c
.. weiterlesen
Weigh/Bake/Weigh Testing To Determine Moisture Content in Printed Boards
Entrapped moisture within printed boards can expand during soldering operations,causing delamination or other damage. Available methods for determining moisture content may be destructive
or no
.. weiterlesen
HDI Training & Implementation at Eagle Test Systems
Eagle Test Systems (ETS) a Teradyne Company established a team during 2009 to develop a training exercise that would bring High Density Interconnect (HDI) knowledge to new products. A digital m
.. weiterlesen
Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies,generating much concern. A head-in-pillow defect is the in
.. weiterlesen
Void or Not to Void
- Background: What is a void?
- What is a "macro" void?
- What is a “planar” void?
- What is a “shrinkage” void?
- What is a “microvia” void?
- What is a “pinhole” void?
- What is a “Kirkendall
.. weiterlesen
Drop Testing of a Pb-Free Board after Assembly and SnPb-Rework
•Board-level drop shock test was performed on 9 assemblies
–63 parts / board
–Parts representative of military package styles
•Assembled on Pb-free compatible laminate with SAC 305 solder
•Sele
.. weiterlesen
Management and Mitigation of Tin Whiskers for Lead-Free Electronics
The lead-free directive from the EU has created a number of challenges for high reliability electronic applications. Key among those challenges is the need to address the issue of tin whiskers.
.. weiterlesen
Improving Tin Whisker Testing through Quantitative Measurements of Plated Film Properties
- Correlating film properties to the propensity to whisker will lead to the development of a comprehensive whisker growth model and create successful mitigation strategies.
•Hillock and whisker
.. weiterlesen
Leveraging IPC 1752 for Product Lifecycle Analytics
- Regulations are driving increasing IPC-1752 use
- More restricted substances and product categories in scope
- The business challenge is much bigger than “regulatory compliance”
- Teams incre
.. weiterlesen
Reliability and Quality Planning in the Product Development Cycle
In globally competitive markets,managing product quality,reliability and risk is not an option. However,it also brings its own unique set of challenges to complex organizations:
- Product desig
.. weiterlesen
Effects of Nano-Tio2 Particles Additions on Microstructure Development And Hardness of Sn3.5Ag0.5Cu Composite Solder
The effects of nano-TiO particle additives on the microstructure and microhardness of the 2 Sn3.5Ag0.5Cu composite solder were studied. Results show that alloying with nano-TiO 2 particles dram
.. weiterlesen
Tin Corrosion under QFN Packages at Elevated Temperature and Humidity
Using X-ray imaging,solder corrosion,resembling metal migration,had been observed under QFN (Quad Flat No-Lead package) devices and chip resistors on circuit boards that were processed with two
.. weiterlesen
Analytical Procedures for Portable Lead-Free Alloy Test Data
• Genesis in December 2008
• Follow-up discussions APEX 2009
• Input received from SMEs
• Conference Call July 22,2009
• Discussions IPC Midwest 2009
• First white paper issued by IPC SPVC June
.. weiterlesen
ESD Control for the Automotive Electronics Industry
Like many other electronics industries,the automotive electronics industry has long been concerned about ESD. As dramatically seen in the news today,quality recalls can detrimentally affect the
.. weiterlesen
Strategies for the Prevention of Board Strain and Cracked Chips in Automotive Electronics
BGA’s,ceramic capacitors,and similar strain sensitive components are used extensively throughout the automotive and consumer electronics industries. Unfortunately these components can be easily
.. weiterlesen
Reliable Solder Identification by X-ray Fluorescence Spectroscopy
High reliability applications in the military and aerospace industry require reliable solder finish
identification on components within the supply system of DoD,NASA,and many other organization
.. weiterlesen
Design for Reliability: The Next Generation
As margins on electronics technology have continued to erode,an increasing number of organizations have implemented design for reliability practices to ensure device performance while meeting t
.. weiterlesen
Die Attach Solder Materials and Application Technology
Advancing technology frequently requires an accompanying advancement in materials technology. Recently,these advances are also driven by changes in environmental legislation as well. Specifical
.. weiterlesen