Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Understanding when to use FR-4 laminates or High Frequency Laminates
Over the years a question that has been asked repeatedly of material suppliers is: “when do I need to use a high frequency laminate over the choice of a standard FR-4 substrate”? The answer has
.. weiterlesen
PCB Board Design Considerations for Impedance Control and Optimal Signal Integrity in High Speed Digital and RF Systems
For the electronics on PCB’s,dielectric materials provide not only material and media support for the high-speed digital and RF systems,but also electrical performance. Impedance control and si
.. weiterlesen
Counterfeit Parts Prevention Using Import/Export Controls as a Tool in Risk Mitigation
Several U.S. Government (USG) regulations require parties engaged in import activities to maintain records of transaction processes. By using formal documented tools integrating these regulatio
.. weiterlesen
Screening for Counterfeit Electronic Parts
Counterfeit electronic parts have become a significant cause of worry in the electronics part supply chain. Most of the counterfeit parts detected in the electronics industry are either new or
.. weiterlesen
Using DNA to Secure High Tech Supply Chains and Protect Against Counterfeiting and Diversion
DNA is a form of forensic evidence trusted by law enforcement and recognized by international courts around the world. This abstract provides an introduction to the utility of botanical DNA tag
.. weiterlesen
Assessing the Risk and Impact of Counterfeit Electronic Products
Counterfeiting is a widespread problem that affects every industry and which has the potential to significantly erode a company’s bottom line. According to the International Anti-Counterfeiting
.. weiterlesen
Component Risk Mitigation Strategies
- COMPONENTS
- Risk Mitigation Testing Strategies Examples
- Risk Mitigation Testing Affiliations
- IDEA – 1010
- AS5553
- Mil-Std-1580
.. weiterlesen
Use of Lead-Free Laminate DMA and TMA Data to Develop Stress versus Temperature Relationships for Predicting Plated Hole Reliability
Accelerated testing of plated hole life is necessary for economic reasons due to the long time to failure during field operating conditions. One difficulty in performing accelerated testing on
.. weiterlesen
High Density Packaging User Group – Pb-free Materials 2 Project Materials Testing of PWB Substrates to Establish Variability of Construction,...
An important element of the High Density Packaging Users Group (HDPUG) Consortium investigation into the reliability of printed wiring board (PWB) constructed with 20 different Pb-free mater
.. weiterlesen
Reliability Testing of PWB Plated through Holes in Air-to-Air Thermal Cycling and Interconnect Stress Testing after Pb-free Reflow Preconditioning
The High Density Packaging Users Group Consortium investigated plated through hole reliability of printed wiring board test vehicles constructed with 20 different Pb-free capable printed wiring
.. weiterlesen
A Standard Multilayer Printed Wiring Board for Material Reliability Evaluations
This paper details the Alcatel-Lucent Pb-free Material Reliability Test board (MRT) used in two different High Density Packaging User Group tests covering 56 different constructions and in nume
.. weiterlesen
New Cleaning Agent Designs for Removing No-Clean Lead-Free Flux Residues
The process cleaning rate theorem holds that the static rate (chemical forces) plus the dynamic cleaning rate (mechanical forces) equals the process cleaning rate. New lead-free flux residues r
.. weiterlesen
Meeting the Challenge of Removing Flux Residues from Electronic Circuitry Utilizing Low Standoff Heights
Our insatiable desire for smaller,faster and highly functional electronic devices presents numerous challenges for package designers and manufacturers. Current day popular approaches include st
.. weiterlesen
Cleaning PCBs in Electronics: Understanding today’s Needs
Because of the phase out of CFC’s and HCFC’s,standard solder pastes and fluxes evolved from RA and RMA fluxes,to No-Clean,to low residue No-Clean,to very low residue No-Clean. Many companies ca
.. weiterlesen
Defluxing for New Assembly Requirements
Consider defluxing at the design stage. This involves determining how product design may impact the assembly process. It also involves selecting the most effective,rugged defluxing option relat
.. weiterlesen
Solar PV: Challenges and Opportunities for the Electronics Assembly Industry
• 2010 turned out to be an unexpectedly strong year: > 130% growth in both cell production and installations over 2009
• 24GWp cell production
• All leading suppliers are expanding production c
.. weiterlesen
Photovoltaics: The iNEMI Road Map
•The 2011 iNEMI Solar PV roadmap
•Involvement of the electronics supply chain
•Example of an electronics opportunity – micro-inverters
.. weiterlesen
Solar PV Reliability Overview
•A vision of a solar-powered world
•Importance of reliability to success of solar
•Working together to establish reliability
•R&D issues related to:
•Product Development
•Quality Assurance duri
.. weiterlesen
Solar PV Module Assembly
- Solar Module Assembly vs. PCBA
- Crystalline Silicon Module (c-Si) Construction
- Module Assembly Process (c-Si)
- PV Cells – String - Array - Module
- Tab & String Process
- Lamination Proce
.. weiterlesen
Design and Fabrication of Thinner,Higher Speed Flexible Circuits
Modern flexible printed circuits demand improved signal integrity due to increasing data rate requirements for interconnects. At the same time,form factors available to designers are becoming s
.. weiterlesen
Results of Fabrication DOE for DuPont Pyralux TK®,A Low Dielectric,Thin Flexible Circuit Material
From the first time we heard of new thin,low Dk,flex laminate material from DuPont we were excited. The material is what is now known,and commercially available,as DuPont’s Pyralux TK®. Working
.. weiterlesen
A Comparison of the Environmental and Operating Costs of Spray in Air Batch Cleaners and Small Inline Aqueous Cleaners
This paper will discuss the environmental and financial cost of operating both batch cleaners and small inline aqueous cleaners. It is not the goal of this paper to endorse one type of cleaner
.. weiterlesen
Eu Rohs Recast – Are You Ready?
Since the European Union (EU) first published the Restriction on the use of Certain Hazardous Substances in electrical and electronic equipment directive (RoHS) in 2003,the document required up
.. weiterlesen
Pb-free Solder Joint Reliability in a Mildly Accelerated Test Condition
Two different temperature cycling profiles were used to compare the thermal fatigue reliability of Pb free and SnPb solder joints in 16 different,high strain surface mount (SMT) packages. In so
.. weiterlesen
The Effects of Non-filled Microvia in Pad on Pb-free Solder Joint Reliability of BGA and QFN Packages in Accelerated Thermal...
The High Density Packaging Users Group (HDPUG) Consortium has completed an experiment to investigate the effect of non-filled microvias in SMT solder joint pads and the associated solder voids
.. weiterlesen
An Analytical Characterization and Comparison of Adhesion Test for PCBs
Interest in the adhesive strength of PCBs has recently come to the forefront of the industry. This has been driven by the advent of lead free soldering processes which severely stress the mecha
.. weiterlesen
Simple Tools for Managing Engineering,Purchasing and Assembly Data
As the assembly of electronic products becomes more automated the collection,storage and retrieval of electronic data demands additional software tools to manage data. The wide spread use of we
.. weiterlesen
Dynamic LEAN Shop Floor SMT Material Control Starting ONLY What You Can Finish
In high mix (250+ Assemblies) environments,ensuring small batches are delivered in a timely yet flexible manner without large levels of safety stock and WIP requires the very best of LEAN Manuf
.. weiterlesen
Low dk Thermoplastic Substrate for Broadband Antennas
In high frequency circuit boards PTFE is widely used as a substrate material. It offers very low dielectric constant and low losses. However,it is relatively expensive to fabricate,making the c
.. weiterlesen
A Designed Experiment for the Influence of Copper Foils and Oxide Replacements on Impedance,DC Line Resistance and Insertion Loss
With ever increasing data transfer rates,insertion loss has become a limiting factor on today's systems.
Insertion loss can be separated into dielectric loss and copper loss. While dielectric l
.. weiterlesen
Understanding when to use FR-4 laminates or High Frequency Laminates
Over the years a question that has been asked repeatedly of material suppliers is: “when do I need to use a high frequency laminate over the choice of a standard FR-4 substrate”? The answer has
.. weiterlesen
PCB Board Design Considerations for Impedance Control and Optimal Signal Integrity in High Speed Digital and RF Systems
For the electronics on PCB’s,dielectric materials provide not only material and media support for the high-speed digital and RF systems,but also electrical performance. Impedance control and si
.. weiterlesen
Counterfeit Parts Prevention Using Import/Export Controls as a Tool in Risk Mitigation
Several U.S. Government (USG) regulations require parties engaged in import activities to maintain records of transaction processes. By using formal documented tools integrating these regulatio
.. weiterlesen
Screening for Counterfeit Electronic Parts
Counterfeit electronic parts have become a significant cause of worry in the electronics part supply chain. Most of the counterfeit parts detected in the electronics industry are either new or
.. weiterlesen
Using DNA to Secure High Tech Supply Chains and Protect Against Counterfeiting and Diversion
DNA is a form of forensic evidence trusted by law enforcement and recognized by international courts around the world. This abstract provides an introduction to the utility of botanical DNA tag
.. weiterlesen
Assessing the Risk and Impact of Counterfeit Electronic Products
Counterfeiting is a widespread problem that affects every industry and which has the potential to significantly erode a company’s bottom line. According to the International Anti-Counterfeiting
.. weiterlesen
Component Risk Mitigation Strategies
- COMPONENTS
- Risk Mitigation Testing Strategies Examples
- Risk Mitigation Testing Affiliations
- IDEA – 1010
- AS5553
- Mil-Std-1580
.. weiterlesen
Use of Lead-Free Laminate DMA and TMA Data to Develop Stress versus Temperature Relationships for Predicting Plated Hole Reliability
Accelerated testing of plated hole life is necessary for economic reasons due to the long time to failure during field operating conditions. One difficulty in performing accelerated testing on
.. weiterlesen
High Density Packaging User Group – Pb-free Materials 2 Project Materials Testing of PWB Substrates to Establish Variability of Construction,...
An important element of the High Density Packaging Users Group (HDPUG) Consortium investigation into the reliability of printed wiring board (PWB) constructed with 20 different Pb-free mater
.. weiterlesen
Reliability Testing of PWB Plated through Holes in Air-to-Air Thermal Cycling and Interconnect Stress Testing after Pb-free Reflow Preconditioning
The High Density Packaging Users Group Consortium investigated plated through hole reliability of printed wiring board test vehicles constructed with 20 different Pb-free capable printed wiring
.. weiterlesen
A Standard Multilayer Printed Wiring Board for Material Reliability Evaluations
This paper details the Alcatel-Lucent Pb-free Material Reliability Test board (MRT) used in two different High Density Packaging User Group tests covering 56 different constructions and in nume
.. weiterlesen
New Cleaning Agent Designs for Removing No-Clean Lead-Free Flux Residues
The process cleaning rate theorem holds that the static rate (chemical forces) plus the dynamic cleaning rate (mechanical forces) equals the process cleaning rate. New lead-free flux residues r
.. weiterlesen
Meeting the Challenge of Removing Flux Residues from Electronic Circuitry Utilizing Low Standoff Heights
Our insatiable desire for smaller,faster and highly functional electronic devices presents numerous challenges for package designers and manufacturers. Current day popular approaches include st
.. weiterlesen
Cleaning PCBs in Electronics: Understanding today’s Needs
Because of the phase out of CFC’s and HCFC’s,standard solder pastes and fluxes evolved from RA and RMA fluxes,to No-Clean,to low residue No-Clean,to very low residue No-Clean. Many companies ca
.. weiterlesen
Defluxing for New Assembly Requirements
Consider defluxing at the design stage. This involves determining how product design may impact the assembly process. It also involves selecting the most effective,rugged defluxing option relat
.. weiterlesen
Solar PV: Challenges and Opportunities for the Electronics Assembly Industry
• 2010 turned out to be an unexpectedly strong year: > 130% growth in both cell production and installations over 2009
• 24GWp cell production
• All leading suppliers are expanding production c
.. weiterlesen
Photovoltaics: The iNEMI Road Map
•The 2011 iNEMI Solar PV roadmap
•Involvement of the electronics supply chain
•Example of an electronics opportunity – micro-inverters
.. weiterlesen
Solar PV Reliability Overview
•A vision of a solar-powered world
•Importance of reliability to success of solar
•Working together to establish reliability
•R&D issues related to:
•Product Development
•Quality Assurance duri
.. weiterlesen
Solar PV Module Assembly
- Solar Module Assembly vs. PCBA
- Crystalline Silicon Module (c-Si) Construction
- Module Assembly Process (c-Si)
- PV Cells – String - Array - Module
- Tab & String Process
- Lamination Proce
.. weiterlesen
Design and Fabrication of Thinner,Higher Speed Flexible Circuits
Modern flexible printed circuits demand improved signal integrity due to increasing data rate requirements for interconnects. At the same time,form factors available to designers are becoming s
.. weiterlesen
Results of Fabrication DOE for DuPont Pyralux TK®,A Low Dielectric,Thin Flexible Circuit Material
From the first time we heard of new thin,low Dk,flex laminate material from DuPont we were excited. The material is what is now known,and commercially available,as DuPont’s Pyralux TK®. Working
.. weiterlesen
A Comparison of the Environmental and Operating Costs of Spray in Air Batch Cleaners and Small Inline Aqueous Cleaners
This paper will discuss the environmental and financial cost of operating both batch cleaners and small inline aqueous cleaners. It is not the goal of this paper to endorse one type of cleaner
.. weiterlesen
Eu Rohs Recast – Are You Ready?
Since the European Union (EU) first published the Restriction on the use of Certain Hazardous Substances in electrical and electronic equipment directive (RoHS) in 2003,the document required up
.. weiterlesen
Pb-free Solder Joint Reliability in a Mildly Accelerated Test Condition
Two different temperature cycling profiles were used to compare the thermal fatigue reliability of Pb free and SnPb solder joints in 16 different,high strain surface mount (SMT) packages. In so
.. weiterlesen
The Effects of Non-filled Microvia in Pad on Pb-free Solder Joint Reliability of BGA and QFN Packages in Accelerated Thermal...
The High Density Packaging Users Group (HDPUG) Consortium has completed an experiment to investigate the effect of non-filled microvias in SMT solder joint pads and the associated solder voids
.. weiterlesen
An Analytical Characterization and Comparison of Adhesion Test for PCBs
Interest in the adhesive strength of PCBs has recently come to the forefront of the industry. This has been driven by the advent of lead free soldering processes which severely stress the mecha
.. weiterlesen
Simple Tools for Managing Engineering,Purchasing and Assembly Data
As the assembly of electronic products becomes more automated the collection,storage and retrieval of electronic data demands additional software tools to manage data. The wide spread use of we
.. weiterlesen
Dynamic LEAN Shop Floor SMT Material Control Starting ONLY What You Can Finish
In high mix (250+ Assemblies) environments,ensuring small batches are delivered in a timely yet flexible manner without large levels of safety stock and WIP requires the very best of LEAN Manuf
.. weiterlesen
Low dk Thermoplastic Substrate for Broadband Antennas
In high frequency circuit boards PTFE is widely used as a substrate material. It offers very low dielectric constant and low losses. However,it is relatively expensive to fabricate,making the c
.. weiterlesen
A Designed Experiment for the Influence of Copper Foils and Oxide Replacements on Impedance,DC Line Resistance and Insertion Loss
With ever increasing data transfer rates,insertion loss has become a limiting factor on today's systems.
Insertion loss can be separated into dielectric loss and copper loss. While dielectric l
.. weiterlesen