Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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The Embedded Passives Journey
When planning a trip for the first time there is usually a significant amount of planning and preparation involved. First,the destination is chosen that meets the objective (e.g. Las Vegas for
.. weiterlesen
The Study of High Density PCB Reliability
The increase in board routing density,decrease the hole-to-hole spacing and lower to 0.30mm. High aspect ration PTH reliability is not the major issue since the plating copper has at least 20%
.. weiterlesen
Laser Micromachining of Barium Titanate (BaTiO3)-Polymer Nanocomposite Based Flexible/Rollable Capacitors
This paper discusses laser micromachining of thin films. In particular,recent developments on high capacitance,large area,thin,flexible/rollable embedded capacitors are highlighted. A variety o
.. weiterlesen
Optimising Rheology for Package-on-Package Flux Dip Processes
The continued drive for more compact and lightweight handheld mobile devices has forcibly pushed the electronics assembly industry to look for novel packaging and assembly technologies. One of
.. weiterlesen
Ultra-Thin 3D Package Development and Qualification Testing
The motivation for developing higher density IC packaging continues to be the personal entertainment and the portable
handset markets. Consumers? expectations are that each new generation of pr
.. weiterlesen
Process and Assembly Methods for Increased Yield of Package on Package Devices
Increased functionality and smaller devices are significant drivers in innovative packaging designs. One of the newer package types to be introduced into the market place in the past few years
.. weiterlesen
New Technology to Meet Challenging Reflow Requirements
New packaging technologies are making higher demands on components and also jointing techniques. The application of
polymer electronics as well as the integration of optical components into the
.. weiterlesen
Cool It! Quickly Take Your Oven from Lead-Free to Leaded
Mixed leaded and lead-free processing requires that reflow ovens change temperature. Cooling a modern oven can take a long time,even longer than an older oven because modern ovens are more insu
.. weiterlesen
Flux Collection and Self-Clean Technique in Reflow Applications
The flux management system for a reflow oven is highly critical to the quality,cost,and yield of a reflow process. Flux accumulation and dripping inside the oven not only requires frequent main
.. weiterlesen
Fluid Flow Mechanics: Key to Low Standoff Cleaning
In recent years,various studies have been issued on cleaning under low standoff components; most however,with incomplete
information. It is essential to revisit and describe the latest challeng
.. weiterlesen
An Analytical Model for an Inline Counter Flow Processor
One of the most popular pieces of equipment in the PCB fabrication industry is the inline processor. These machines are used for a variety of tasks including resist removal,etching and cleaning
.. weiterlesen
Engineered Cleaning Fluids Designed for Batch Processing
Highly dense circuit assemblies increase the cleaning challenge. Batch cleaning equipment designs provide a small footprint,low cleaning fluid consumption,and low cost of ownership. Batch clean
.. weiterlesen
Methods for Choosing a Saponifier or Surfactant for Printed Circuit Board and Stencil Cleaning Applications
This paper will discuss the technical challenges associated with the selection of chemical additive for the printed circuit board assembly (PCBA) and stencil cleaning processes. The removal of
.. weiterlesen
A Compliant and Creep Resistant SAC-Al (Ni) Alloy
Addition of Al into SAC alloys reduces the number of hard Ag3Sn and Cu6Sn5 IMC particles,and forms larger,softer non-stoichiometric AlAg and AlCu particles. This results in a significant reduct
.. weiterlesen
Low-Silver BGA Assembly Phase I – Reflow Considerations and Joint Homogeneity Initial Report
Some Ball Grid Array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or 405 (4% Ag) to alloys with lower silver contents. There are a numerous perceived benefits to this move in
.. weiterlesen
Embedded Passives Predictability,As-Received and In-Service
Embedded resistors and capacitors provide high-density high-performance solutions,freeing up the surface for other
components and enabling tailored interconnect topology. This technology needs
.. weiterlesen
Nano- and Micro-Filled Conducting Adhesives for Z-axis Interconnections
This paper discusses micro-filled epoxy-based conducting adhesives modified with nanoparticles for z-axis interconnections,
especially as it relates to package level fabrication,integration,and
.. weiterlesen
Performing Flux-Technology for Pb-Free SN100C Solders
SN100C (Sn99Cu0.7 with Ni- and Ge-micro-additions) is a lead-free solder alloy that is finding increased acceptance globally and holds promise as a mainstream solution in terms of long-term sol
.. weiterlesen
Design for Manufacturability in the Lead Free Wave Solder Process
The recent use of lead free alloys has made the wave solder process more challenging in terms of achieving acceptable solder joints for both SMT and PTH components. It has been found that the D
.. weiterlesen
Design of Flexible RFID Tag and Rectifier Circuit using Low Cost Screen Printing Process
Flexible electronics is the future trend of the worldwide electronic industry. The RFID tag is one of the main applications in flexible electronics currently. This paper presents a flexible HF
.. weiterlesen
Peel Strength of Deposited Adhesiveless FCCL,or,Why Don’t They Ever Say,“It Sticks Too Good?”
The peel test will be reviewed,with special attention given to deposited adhesiveless copperclads. Details of the specification are reviewed The relevance of the title subject will be addressed
.. weiterlesen
Screen Printing Process for High Density Flexible Electronics
A series of advanced screen-printing processes have been developed to build functional high density flexible electronic circuits. Not only do the single layer circuits have fine conductor trace
.. weiterlesen
Round-Robin,Predictor Models for T-Cycle life
Solder joints tend to crack after extended thermal cycling,if the component and the circuit board are CTE mis-matched. Predicting t-cycle lifetime is a crucial first step in optimizing product
.. weiterlesen
Effect of Design Variables on the Reliability of Lead Free Area Array Connectors
As the use of area array connectors has become more widespread in electronic assemblies,the need to evaluate their reliability has increased. There is,however,limited information on how best to
.. weiterlesen
Failure Analysis of Eutectic and Pb-Free Solder Alloys after High Stress Exposure
Failure analysis was performed on fourteen thermally cycled or vibration tested PDIP components from the JCAA-JG-PP Lead-Free Joint Test Project. The components differed in component finish,sol
.. weiterlesen
Image Rotation to Mitigate the Fiberweave Effect its Impact on PCB Manufacturing
Typical PCB materials have inherent properties (the “Fiberweave Effect”) which can be detrimental to the Signal Integrity of the physical link. This presentation describes the effect and a mean
.. weiterlesen
Manufacture and Performance of a Z-interconnect HDI Circuit Card
More and more circuit board designs require signals paths that can handle multi-gigahertz frequencies. The challenges for organic circuit boards,in meeting these electrical requirements,include
.. weiterlesen
Towards a PCB Production Floor Metric for Go/No Go Testing of Lossy High Speed Transmission Lines
As designers strive to extract ever more performance from high speed transmission lines on FR4 substrates and their high speed derivatives,a requirement has arisen for a practical and robust “G
.. weiterlesen
A Study of Alternative Lead Free Wave Alloys: From Process Yield to Reliability
Recent industry trends have focused around alternatives for the commonly used SAC305 or SAC405 alloys for wave soldering and solder fountain rework processes. Industry consortia are currently f
.. weiterlesen
Comparison of Copper Erosion at Plated Through-Hole Knees in Motherboards Using SAC305 and an SnCuNiGe Alternative Alloy for Wave Soldering...
Copper erosion from plated through holes (PTH) barrels in printed circuit boards (PCB) during both wave soldering and mini-pot rework can increase the risk of PTH reliability failures during fi
.. weiterlesen
The Embedded Passives Journey
When planning a trip for the first time there is usually a significant amount of planning and preparation involved. First,the destination is chosen that meets the objective (e.g. Las Vegas for
.. weiterlesen
The Study of High Density PCB Reliability
The increase in board routing density,decrease the hole-to-hole spacing and lower to 0.30mm. High aspect ration PTH reliability is not the major issue since the plating copper has at least 20%
.. weiterlesen
Laser Micromachining of Barium Titanate (BaTiO3)-Polymer Nanocomposite Based Flexible/Rollable Capacitors
This paper discusses laser micromachining of thin films. In particular,recent developments on high capacitance,large area,thin,flexible/rollable embedded capacitors are highlighted. A variety o
.. weiterlesen
Optimising Rheology for Package-on-Package Flux Dip Processes
The continued drive for more compact and lightweight handheld mobile devices has forcibly pushed the electronics assembly industry to look for novel packaging and assembly technologies. One of
.. weiterlesen
Ultra-Thin 3D Package Development and Qualification Testing
The motivation for developing higher density IC packaging continues to be the personal entertainment and the portable
handset markets. Consumers? expectations are that each new generation of pr
.. weiterlesen
Process and Assembly Methods for Increased Yield of Package on Package Devices
Increased functionality and smaller devices are significant drivers in innovative packaging designs. One of the newer package types to be introduced into the market place in the past few years
.. weiterlesen
New Technology to Meet Challenging Reflow Requirements
New packaging technologies are making higher demands on components and also jointing techniques. The application of
polymer electronics as well as the integration of optical components into the
.. weiterlesen
Cool It! Quickly Take Your Oven from Lead-Free to Leaded
Mixed leaded and lead-free processing requires that reflow ovens change temperature. Cooling a modern oven can take a long time,even longer than an older oven because modern ovens are more insu
.. weiterlesen
Flux Collection and Self-Clean Technique in Reflow Applications
The flux management system for a reflow oven is highly critical to the quality,cost,and yield of a reflow process. Flux accumulation and dripping inside the oven not only requires frequent main
.. weiterlesen
Fluid Flow Mechanics: Key to Low Standoff Cleaning
In recent years,various studies have been issued on cleaning under low standoff components; most however,with incomplete
information. It is essential to revisit and describe the latest challeng
.. weiterlesen
An Analytical Model for an Inline Counter Flow Processor
One of the most popular pieces of equipment in the PCB fabrication industry is the inline processor. These machines are used for a variety of tasks including resist removal,etching and cleaning
.. weiterlesen
Engineered Cleaning Fluids Designed for Batch Processing
Highly dense circuit assemblies increase the cleaning challenge. Batch cleaning equipment designs provide a small footprint,low cleaning fluid consumption,and low cost of ownership. Batch clean
.. weiterlesen
Methods for Choosing a Saponifier or Surfactant for Printed Circuit Board and Stencil Cleaning Applications
This paper will discuss the technical challenges associated with the selection of chemical additive for the printed circuit board assembly (PCBA) and stencil cleaning processes. The removal of
.. weiterlesen
A Compliant and Creep Resistant SAC-Al (Ni) Alloy
Addition of Al into SAC alloys reduces the number of hard Ag3Sn and Cu6Sn5 IMC particles,and forms larger,softer non-stoichiometric AlAg and AlCu particles. This results in a significant reduct
.. weiterlesen
Low-Silver BGA Assembly Phase I – Reflow Considerations and Joint Homogeneity Initial Report
Some Ball Grid Array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or 405 (4% Ag) to alloys with lower silver contents. There are a numerous perceived benefits to this move in
.. weiterlesen
Embedded Passives Predictability,As-Received and In-Service
Embedded resistors and capacitors provide high-density high-performance solutions,freeing up the surface for other
components and enabling tailored interconnect topology. This technology needs
.. weiterlesen
Nano- and Micro-Filled Conducting Adhesives for Z-axis Interconnections
This paper discusses micro-filled epoxy-based conducting adhesives modified with nanoparticles for z-axis interconnections,
especially as it relates to package level fabrication,integration,and
.. weiterlesen
Performing Flux-Technology for Pb-Free SN100C Solders
SN100C (Sn99Cu0.7 with Ni- and Ge-micro-additions) is a lead-free solder alloy that is finding increased acceptance globally and holds promise as a mainstream solution in terms of long-term sol
.. weiterlesen
Design for Manufacturability in the Lead Free Wave Solder Process
The recent use of lead free alloys has made the wave solder process more challenging in terms of achieving acceptable solder joints for both SMT and PTH components. It has been found that the D
.. weiterlesen
Design of Flexible RFID Tag and Rectifier Circuit using Low Cost Screen Printing Process
Flexible electronics is the future trend of the worldwide electronic industry. The RFID tag is one of the main applications in flexible electronics currently. This paper presents a flexible HF
.. weiterlesen
Peel Strength of Deposited Adhesiveless FCCL,or,Why Don’t They Ever Say,“It Sticks Too Good?”
The peel test will be reviewed,with special attention given to deposited adhesiveless copperclads. Details of the specification are reviewed The relevance of the title subject will be addressed
.. weiterlesen
Screen Printing Process for High Density Flexible Electronics
A series of advanced screen-printing processes have been developed to build functional high density flexible electronic circuits. Not only do the single layer circuits have fine conductor trace
.. weiterlesen
Round-Robin,Predictor Models for T-Cycle life
Solder joints tend to crack after extended thermal cycling,if the component and the circuit board are CTE mis-matched. Predicting t-cycle lifetime is a crucial first step in optimizing product
.. weiterlesen
Effect of Design Variables on the Reliability of Lead Free Area Array Connectors
As the use of area array connectors has become more widespread in electronic assemblies,the need to evaluate their reliability has increased. There is,however,limited information on how best to
.. weiterlesen
Failure Analysis of Eutectic and Pb-Free Solder Alloys after High Stress Exposure
Failure analysis was performed on fourteen thermally cycled or vibration tested PDIP components from the JCAA-JG-PP Lead-Free Joint Test Project. The components differed in component finish,sol
.. weiterlesen
Image Rotation to Mitigate the Fiberweave Effect its Impact on PCB Manufacturing
Typical PCB materials have inherent properties (the “Fiberweave Effect”) which can be detrimental to the Signal Integrity of the physical link. This presentation describes the effect and a mean
.. weiterlesen
Manufacture and Performance of a Z-interconnect HDI Circuit Card
More and more circuit board designs require signals paths that can handle multi-gigahertz frequencies. The challenges for organic circuit boards,in meeting these electrical requirements,include
.. weiterlesen
Towards a PCB Production Floor Metric for Go/No Go Testing of Lossy High Speed Transmission Lines
As designers strive to extract ever more performance from high speed transmission lines on FR4 substrates and their high speed derivatives,a requirement has arisen for a practical and robust “G
.. weiterlesen
A Study of Alternative Lead Free Wave Alloys: From Process Yield to Reliability
Recent industry trends have focused around alternatives for the commonly used SAC305 or SAC405 alloys for wave soldering and solder fountain rework processes. Industry consortia are currently f
.. weiterlesen
Comparison of Copper Erosion at Plated Through-Hole Knees in Motherboards Using SAC305 and an SnCuNiGe Alternative Alloy for Wave Soldering...
Copper erosion from plated through holes (PTH) barrels in printed circuit boards (PCB) during both wave soldering and mini-pot rework can increase the risk of PTH reliability failures during fi
.. weiterlesen