Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Anzeige
Effect of Contact Time on Lead-Free Wave Soldering
The increasing use of lead-free solder has introduced a new set of process parameters when setting up wave solder equipment for effective soldering. Determining the proper flow characteristics
.. weiterlesen
New Reinforcement Material can Solve Heat and Co-Efficient of Thermal Expansion Challenges of the Printed Circuit Board and IC Substrate
Printed Circuit Boards (PCB) and IC Substrates are the essential building blocks of electronics. As the technology moves rapidly into the future,the electronics industry faces issues with hot s
.. weiterlesen
Thermoplastic Substrates: Performance of Materials to Meet WEEE
Following the implementation of WEEE legislation,there will be an increasing interest in adopting more sustainable manufacturing processes and materials as targets are increased,and must be ach
.. weiterlesen
Printable Nanocomposites for Electronic Packaging
Printing technologies provide a simple solution to build electronic circuits on low cost flexible substrates. Nanocomposites will play important role for developing advanced printable technolog
.. weiterlesen
Ionic Analysis of Common Beverages Spilled on Electronics
Electronics,especially mobile electronic items,are subjected to unintentional abuse by having various beverages spilled onto or into them. Ion Chromatography and emission spectroscopy were used
.. weiterlesen
The Path to Robust Electronics - Preventing Corrosion of PCB Assemblies
All things corrode,and the rate of corrosion among electronics devices is accelerating. Electronic devices are being used in more places than ever before. They are finding more uses,they're mor
.. weiterlesen
Contamination of Hydrocarbon Ceramic Dielectric
Various forms of contamination on the surface of hydrocarbon ceramic dielectric PWBs have been observed following component population. Although contamination is occasionally observed on PWBs f
.. weiterlesen
Printed Circuit Board Reliability and Integrity Characterization Using MAJIC
The recent need to develop lead-free electrical and electronic products has resulted in an increased demand to characterize
solder joint integrity. Many standards exist to evaluate the long ter
.. weiterlesen
Atmospheric Plasma – A New Surface Treatment Technology for Cleaning PCBs
Low-pressure plasmas have been used for many years to surface clean and functionalize substrates prior to downstream
converting operations; therefore,the benefits of plasma treatment are well r
.. weiterlesen
Engineered Cleaning Fluid and Mechanical Impingement Optimization Innovations
The complexity of the electronic assembly manufacturing environment increases with the miniaturization,low standoff components,and solder alloy advancements. Past history suggests that the clea
.. weiterlesen
Cleaning a No-Clean Flux on Contaminated Hardware as a Recovery Plan
There is a growing problem in the industry with no-clean flux technology and the after effects it can have on reliability. If the
fluxes are not fully complexed (not fully heat activated) there
.. weiterlesen
Defluxing of Eutectic and Lead-Free PCBs in a Single Cleaning Application
As the entire electronic manufacturing industry braced for the July 1,2006 deadline,it has been reevaluating the entire production process. Likewise,the precision cleaning industry must also
.. weiterlesen
Solving the Metric Pitch BGA & Micro BGA Dilemma
Solving "Fine Pitch" Metric Pitch BGA routing is becoming increasingly challenging for PCB design layout. There are solutions but they are very hard to find. This presentation will cover common
.. weiterlesen
Case Study on the Validation of SAC305 and SnCu Based Solders in SMT,Wave and Hand-soldering at the Contract Assembler Level
insure the same quality a customer has been accustomed to with a Sn63Pb37 process is achieved. The reflow,wave soldering
and hand assembly processes must all be optimized carefully to insure go
.. weiterlesen
Impact Evaluation of Solder Transfer Peak Temperatures on C4NP Lead Free Solder Bumps
C4NP (Controlled Collapsed Chip Connection-New Process) is a novel solder bumping technology developed by IBM and
commercialized by Suss MicroTec. C4NP is a solder transfer technology where mol
.. weiterlesen
Productivity and Cost Efficiency of Lead-Free Selective Soldering
With the advent of widespread lead-free soldering,the issue of copper erosion has surfaced as a major quality concern when
soldering RoHS compliant through-hole devices. Many contract electroni
.. weiterlesen
0.3mm W.L CSP Assembly
Due to the ever-aggressive
miniaturization program that is rolling
through the electronics industry,the
next component that is fast approaching
this horizon is the 0.3mm CSP
• This paper will r
.. weiterlesen
Mechanical Vibrations: Its Effect on Assembly Equipment and Methods of Characterization
As electronic packages keep shrinking in size,high-speed high-accuracy package assembly equipment are becoming more
sensitive to mechanical vibrations. Alignment,positional and pick & place acc
.. weiterlesen
Thermal Expansion of Silicones in Electronic Reliability
CTE mismatches during temperature cycling can cause significant movement of components and materials relative to one
another,which in turn stresses solder joints and wirebonds. Silicones are of
.. weiterlesen
Low Dielectric Fabrics
While glass fibers are commonly used to reinforce circuit board substrates,they have a high dielectric constant and loss.
Cyclic olefin copolymer fibers have a lower dielectric constant and los
.. weiterlesen
Low Temperature Characteristics of Silicones
Silicones are often used to protect electronic applications designed for cold environments. The low temperature flexibility
of silicones is well recognized,but not as well understood. While the
.. weiterlesen
Effect of Contact Time on Lead-Free Wave Soldering
The increasing use of lead-free solder has introduced a new set of process parameters when setting up wave solder equipment for effective soldering. Determining the proper flow characteristics
.. weiterlesen
New Reinforcement Material can Solve Heat and Co-Efficient of Thermal Expansion Challenges of the Printed Circuit Board and IC Substrate
Printed Circuit Boards (PCB) and IC Substrates are the essential building blocks of electronics. As the technology moves rapidly into the future,the electronics industry faces issues with hot s
.. weiterlesen
Thermoplastic Substrates: Performance of Materials to Meet WEEE
Following the implementation of WEEE legislation,there will be an increasing interest in adopting more sustainable manufacturing processes and materials as targets are increased,and must be ach
.. weiterlesen
Printable Nanocomposites for Electronic Packaging
Printing technologies provide a simple solution to build electronic circuits on low cost flexible substrates. Nanocomposites will play important role for developing advanced printable technolog
.. weiterlesen
Ionic Analysis of Common Beverages Spilled on Electronics
Electronics,especially mobile electronic items,are subjected to unintentional abuse by having various beverages spilled onto or into them. Ion Chromatography and emission spectroscopy were used
.. weiterlesen
The Path to Robust Electronics - Preventing Corrosion of PCB Assemblies
All things corrode,and the rate of corrosion among electronics devices is accelerating. Electronic devices are being used in more places than ever before. They are finding more uses,they're mor
.. weiterlesen
Contamination of Hydrocarbon Ceramic Dielectric
Various forms of contamination on the surface of hydrocarbon ceramic dielectric PWBs have been observed following component population. Although contamination is occasionally observed on PWBs f
.. weiterlesen
Printed Circuit Board Reliability and Integrity Characterization Using MAJIC
The recent need to develop lead-free electrical and electronic products has resulted in an increased demand to characterize
solder joint integrity. Many standards exist to evaluate the long ter
.. weiterlesen
Atmospheric Plasma – A New Surface Treatment Technology for Cleaning PCBs
Low-pressure plasmas have been used for many years to surface clean and functionalize substrates prior to downstream
converting operations; therefore,the benefits of plasma treatment are well r
.. weiterlesen
Engineered Cleaning Fluid and Mechanical Impingement Optimization Innovations
The complexity of the electronic assembly manufacturing environment increases with the miniaturization,low standoff components,and solder alloy advancements. Past history suggests that the clea
.. weiterlesen
Cleaning a No-Clean Flux on Contaminated Hardware as a Recovery Plan
There is a growing problem in the industry with no-clean flux technology and the after effects it can have on reliability. If the
fluxes are not fully complexed (not fully heat activated) there
.. weiterlesen
Defluxing of Eutectic and Lead-Free PCBs in a Single Cleaning Application
As the entire electronic manufacturing industry braced for the July 1,2006 deadline,it has been reevaluating the entire production process. Likewise,the precision cleaning industry must also
.. weiterlesen
Solving the Metric Pitch BGA & Micro BGA Dilemma
Solving "Fine Pitch" Metric Pitch BGA routing is becoming increasingly challenging for PCB design layout. There are solutions but they are very hard to find. This presentation will cover common
.. weiterlesen
Case Study on the Validation of SAC305 and SnCu Based Solders in SMT,Wave and Hand-soldering at the Contract Assembler Level
insure the same quality a customer has been accustomed to with a Sn63Pb37 process is achieved. The reflow,wave soldering
and hand assembly processes must all be optimized carefully to insure go
.. weiterlesen
Impact Evaluation of Solder Transfer Peak Temperatures on C4NP Lead Free Solder Bumps
C4NP (Controlled Collapsed Chip Connection-New Process) is a novel solder bumping technology developed by IBM and
commercialized by Suss MicroTec. C4NP is a solder transfer technology where mol
.. weiterlesen
Productivity and Cost Efficiency of Lead-Free Selective Soldering
With the advent of widespread lead-free soldering,the issue of copper erosion has surfaced as a major quality concern when
soldering RoHS compliant through-hole devices. Many contract electroni
.. weiterlesen
0.3mm W.L CSP Assembly
Due to the ever-aggressive
miniaturization program that is rolling
through the electronics industry,the
next component that is fast approaching
this horizon is the 0.3mm CSP
• This paper will r
.. weiterlesen
Mechanical Vibrations: Its Effect on Assembly Equipment and Methods of Characterization
As electronic packages keep shrinking in size,high-speed high-accuracy package assembly equipment are becoming more
sensitive to mechanical vibrations. Alignment,positional and pick & place acc
.. weiterlesen
Thermal Expansion of Silicones in Electronic Reliability
CTE mismatches during temperature cycling can cause significant movement of components and materials relative to one
another,which in turn stresses solder joints and wirebonds. Silicones are of
.. weiterlesen
Low Dielectric Fabrics
While glass fibers are commonly used to reinforce circuit board substrates,they have a high dielectric constant and loss.
Cyclic olefin copolymer fibers have a lower dielectric constant and los
.. weiterlesen
Low Temperature Characteristics of Silicones
Silicones are often used to protect electronic applications designed for cold environments. The low temperature flexibility
of silicones is well recognized,but not as well understood. While the
.. weiterlesen