Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Uniformity of Nickel Plating Thickness in High Aspect Ratio Plated Through Holes
Nickel plating is often used on PWBs to increase wear resistance and to prevent diffusion between copper and other plated metals. The nickel plating is often present in through holes as well as
.. weiterlesen
Embedded Passives ….Predictability,As-Received and In-Service
Embedded passives technology offers high-density high-performance solutions,but needs characterization before becoming a resource in harsh-environment applications. This paper discusses two cri
.. weiterlesen
Rising Opportunities for EMS Organizations In the Medical,Industrial,and Aerospace/Defense/Homeland Security Segments
As electronics manufacturing,design and after market services evolve into as a strategic option for today’s electronics original equipment manufacturers (OEM),opportunities for further growth e
.. weiterlesen
Changes in North American PWB Materials Infrastructure
This paper will compare the current capabilities of raw material suppliers to the PWB industry to those same capabilities 10 and 20 years ago. Key raw materials such as resin,glass fabric,coppe
.. weiterlesen
Qualification of PWBs Outsourced from Asia
The growth of portable wireless products and related consumer electronics is fueling a major outsourcing effort towards Asia. Most OEM (original equipment manufacturers) are partnering with CMs
.. weiterlesen
Understanding the Requirements of a Mass-Imaging Platform with Reference to the Impact of Interconnect Miniaturisation
As the frontiers of feature size and interspace between devices become ever challenging,we as an industry have to start revaluating the performance of the toolsets that are used in the SMT aren
.. weiterlesen
The Graping Phenomenon: Improving Pb-Free Solder Coalescence through Process and Material Optimization
As small surface-mount components such as 0201 and 01005 packages have entered volume assembly,manufacturers are observing increased instances of poor solder coalescence during reflow. The root
.. weiterlesen
Fine Powder Solder Paste Applications for Semiconductor Packaging
Fine solder powder paste applications continue to grow as a cost effective solution to many semiconductor packaging needs. Applications for solder paste continue to evolve from the standard SMT
.. weiterlesen
To be or not to be (before reflow): That is the question (in AOI)
Rarely do PCB manufacturers have the resources for purchasing an inspection machine for every stage of the manufacturing process. Typically,therefore,they have to decide whether to deploy AOI p
.. weiterlesen
Solder Paste Inspection Technologies: 2D-3D Correlation
It is understood that the solder paste printing process presents far more opportunities for defects than any of the other individual Surface Mount Technology (SMT) Manufacturing Processes. In a
.. weiterlesen
Results from 2007 Industry Defect Level and Test Effectiveness Studies
To select an optimal test strategy,good knowledge of defect levels and test effectiveness are two very important factors to include. In 1999 an industry defect level study was completed and was
.. weiterlesen
Prisma - A Novel PCB Engineering Software
Prisma is a PCB-Engineering software developed by DYCONEX AG,Switzerland (manufacturer of PCBs). Compared to existing solutions on the market it allows for broad standardization of the process
.. weiterlesen
Standardized Traceability Ratings for Manufacturing
Traceability and process control are no longer requirements reserved for manufacturers in regulatory or specific market segments. Today,all manufacturers who aspire to achieve or to maintain a
.. weiterlesen
Tools & Methods for Lean Production Management in EA
Lean manufacturing is far from a new concept,and many within the Electronics Assembly (EA) industry are already familiar with the principles and concepts behind it. However,in spite of widespre
.. weiterlesen
Development of Micro Drill Bit for Drilling Environment-Friendly PCBs
Currently environment-friendly PCBs (including lead-free assembly compatible PCB and halogen-free PCB) become popular in PCB industry to meet the requirements of environmental protection. Corre
.. weiterlesen
Processing High Density Interconnects: Selecting the Best Option for Via Fill Applications
With the increased use of High Density Interconnects in printed wiring boards (PWB) there is a critical need for reliable methods to completely fill through hole and blind vias. Complete fillin
.. weiterlesen
Uniformity of Nickel Plating Thickness in High Aspect Ratio Plated Through Holes
Nickel plating is often used on PWBs to increase wear resistance and to prevent diffusion between copper and other plated metals. The nickel plating is often present in through holes as well as
.. weiterlesen
Design Environment ROI: How Design Teams On a Budget Can Build a Best in Class Design Environment
Design workflow is the core to your design team?s competitive advantage; it?s the conduit by which you turn your team?s expertise and ideas into manufacturable products. And yet,all engineering
.. weiterlesen
Calculating Total Cost of Ownership in Electronics Manufacturing
Total cost of ownership is a financial estimate designed to help consumers and enterprise managers assess direct and indirect costs commonly related to software or hardware. It is a form of ful
.. weiterlesen
Lean Kitting: A Case Study
Kitting is the first step in printed circuit board assembly. It is initiated well in advance of actual production start to be able to prepare and deliver the kit on time. Kitting involves gathe
.. weiterlesen
Broadband Printing – A Paradigm
The SMT industry is going through a challenging phase of assembling miniature components,such as micro BGA,0.3mm CSP and 01005 passives onto Printed Circuit Boards (PCB). This effort is primari
.. weiterlesen
A Study of 0201’s and Tombstoning in Lead-Free Systems,Phase II Comparison of Final Finishes and Solder Paste Formulations
Tombstoning,the phenomena where a chip component stands up on one end during the reflow cycle,is well-documented and understood in tin-lead systems. It is reported to occur more frequently in l
.. weiterlesen
Base Material Consideration for High Speed Printed Circuit Boards
Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon
.. weiterlesen
BGA and QFN Repair Process
Repairing a PCB with a defective BGA,uBGA,or QFN is often a difficult and tedious task. The conventional method is to remove the defective device from the PCB; clean the pads on the PCB,then pr
.. weiterlesen
Reducing Defects in Hand Soldering Operations
Wire soldering operations are still widely accepted in the electronics assembly industry. When a product or the parts within cannot withstand the heat of oven reflow,the localized heat provided
.. weiterlesen
INEMI Rework Machine Temperature Tolerance and Repeatability Study
Currently little data exists on temperature repeatability of BGA/CSP rework machine equipment. This is an issue especially for lead-free rework as the temperatures during lead-free BGA/CSP rewo
.. weiterlesen
Understanding EuP and REACH
There has been a global trend towards legislation meant to encourage sustainable manufacturing and minimize the environmental impact of product manufacturing. In the global economy,with its dis
.. weiterlesen
EU RoHS VS. CHINA RoHS
Companies not only need to understand the reliability issues with environmental compliance,but also how to comply with the various regulations from the business end. China is the second jurisdi
.. weiterlesen
Understanding the IPC 175X Data Model
More and more political bodies (countries,states,and unions) are enacting legislation designed to protect the environment from the impact of manufacturing. One category of restrictive legislati
.. weiterlesen
High Uniformity PCB Processing with Vacuum Gas Plasma
Emerging technologies in the printed circuit board industry including smaller holes,higher aspect ratios,three-dimensional features,fine pitch,blind via holes,and new lead free materials contin
.. weiterlesen
Uniformity of Nickel Plating Thickness in High Aspect Ratio Plated Through Holes
Nickel plating is often used on PWBs to increase wear resistance and to prevent diffusion between copper and other plated metals. The nickel plating is often present in through holes as well as
.. weiterlesen
Embedded Passives ….Predictability,As-Received and In-Service
Embedded passives technology offers high-density high-performance solutions,but needs characterization before becoming a resource in harsh-environment applications. This paper discusses two cri
.. weiterlesen
Rising Opportunities for EMS Organizations In the Medical,Industrial,and Aerospace/Defense/Homeland Security Segments
As electronics manufacturing,design and after market services evolve into as a strategic option for today’s electronics original equipment manufacturers (OEM),opportunities for further growth e
.. weiterlesen
Changes in North American PWB Materials Infrastructure
This paper will compare the current capabilities of raw material suppliers to the PWB industry to those same capabilities 10 and 20 years ago. Key raw materials such as resin,glass fabric,coppe
.. weiterlesen
Qualification of PWBs Outsourced from Asia
The growth of portable wireless products and related consumer electronics is fueling a major outsourcing effort towards Asia. Most OEM (original equipment manufacturers) are partnering with CMs
.. weiterlesen
Understanding the Requirements of a Mass-Imaging Platform with Reference to the Impact of Interconnect Miniaturisation
As the frontiers of feature size and interspace between devices become ever challenging,we as an industry have to start revaluating the performance of the toolsets that are used in the SMT aren
.. weiterlesen
The Graping Phenomenon: Improving Pb-Free Solder Coalescence through Process and Material Optimization
As small surface-mount components such as 0201 and 01005 packages have entered volume assembly,manufacturers are observing increased instances of poor solder coalescence during reflow. The root
.. weiterlesen
Fine Powder Solder Paste Applications for Semiconductor Packaging
Fine solder powder paste applications continue to grow as a cost effective solution to many semiconductor packaging needs. Applications for solder paste continue to evolve from the standard SMT
.. weiterlesen
To be or not to be (before reflow): That is the question (in AOI)
Rarely do PCB manufacturers have the resources for purchasing an inspection machine for every stage of the manufacturing process. Typically,therefore,they have to decide whether to deploy AOI p
.. weiterlesen
Solder Paste Inspection Technologies: 2D-3D Correlation
It is understood that the solder paste printing process presents far more opportunities for defects than any of the other individual Surface Mount Technology (SMT) Manufacturing Processes. In a
.. weiterlesen
Results from 2007 Industry Defect Level and Test Effectiveness Studies
To select an optimal test strategy,good knowledge of defect levels and test effectiveness are two very important factors to include. In 1999 an industry defect level study was completed and was
.. weiterlesen
Prisma - A Novel PCB Engineering Software
Prisma is a PCB-Engineering software developed by DYCONEX AG,Switzerland (manufacturer of PCBs). Compared to existing solutions on the market it allows for broad standardization of the process
.. weiterlesen
Standardized Traceability Ratings for Manufacturing
Traceability and process control are no longer requirements reserved for manufacturers in regulatory or specific market segments. Today,all manufacturers who aspire to achieve or to maintain a
.. weiterlesen
Tools & Methods for Lean Production Management in EA
Lean manufacturing is far from a new concept,and many within the Electronics Assembly (EA) industry are already familiar with the principles and concepts behind it. However,in spite of widespre
.. weiterlesen
Development of Micro Drill Bit for Drilling Environment-Friendly PCBs
Currently environment-friendly PCBs (including lead-free assembly compatible PCB and halogen-free PCB) become popular in PCB industry to meet the requirements of environmental protection. Corre
.. weiterlesen
Processing High Density Interconnects: Selecting the Best Option for Via Fill Applications
With the increased use of High Density Interconnects in printed wiring boards (PWB) there is a critical need for reliable methods to completely fill through hole and blind vias. Complete fillin
.. weiterlesen
Uniformity of Nickel Plating Thickness in High Aspect Ratio Plated Through Holes
Nickel plating is often used on PWBs to increase wear resistance and to prevent diffusion between copper and other plated metals. The nickel plating is often present in through holes as well as
.. weiterlesen
Design Environment ROI: How Design Teams On a Budget Can Build a Best in Class Design Environment
Design workflow is the core to your design team?s competitive advantage; it?s the conduit by which you turn your team?s expertise and ideas into manufacturable products. And yet,all engineering
.. weiterlesen
Calculating Total Cost of Ownership in Electronics Manufacturing
Total cost of ownership is a financial estimate designed to help consumers and enterprise managers assess direct and indirect costs commonly related to software or hardware. It is a form of ful
.. weiterlesen
Lean Kitting: A Case Study
Kitting is the first step in printed circuit board assembly. It is initiated well in advance of actual production start to be able to prepare and deliver the kit on time. Kitting involves gathe
.. weiterlesen
Broadband Printing – A Paradigm
The SMT industry is going through a challenging phase of assembling miniature components,such as micro BGA,0.3mm CSP and 01005 passives onto Printed Circuit Boards (PCB). This effort is primari
.. weiterlesen
A Study of 0201’s and Tombstoning in Lead-Free Systems,Phase II Comparison of Final Finishes and Solder Paste Formulations
Tombstoning,the phenomena where a chip component stands up on one end during the reflow cycle,is well-documented and understood in tin-lead systems. It is reported to occur more frequently in l
.. weiterlesen
Base Material Consideration for High Speed Printed Circuit Boards
Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon
.. weiterlesen
BGA and QFN Repair Process
Repairing a PCB with a defective BGA,uBGA,or QFN is often a difficult and tedious task. The conventional method is to remove the defective device from the PCB; clean the pads on the PCB,then pr
.. weiterlesen
Reducing Defects in Hand Soldering Operations
Wire soldering operations are still widely accepted in the electronics assembly industry. When a product or the parts within cannot withstand the heat of oven reflow,the localized heat provided
.. weiterlesen
INEMI Rework Machine Temperature Tolerance and Repeatability Study
Currently little data exists on temperature repeatability of BGA/CSP rework machine equipment. This is an issue especially for lead-free rework as the temperatures during lead-free BGA/CSP rewo
.. weiterlesen
Understanding EuP and REACH
There has been a global trend towards legislation meant to encourage sustainable manufacturing and minimize the environmental impact of product manufacturing. In the global economy,with its dis
.. weiterlesen
EU RoHS VS. CHINA RoHS
Companies not only need to understand the reliability issues with environmental compliance,but also how to comply with the various regulations from the business end. China is the second jurisdi
.. weiterlesen
Understanding the IPC 175X Data Model
More and more political bodies (countries,states,and unions) are enacting legislation designed to protect the environment from the impact of manufacturing. One category of restrictive legislati
.. weiterlesen
High Uniformity PCB Processing with Vacuum Gas Plasma
Emerging technologies in the printed circuit board industry including smaller holes,higher aspect ratios,three-dimensional features,fine pitch,blind via holes,and new lead free materials contin
.. weiterlesen