Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Anzeige
Recovery of Copper Metal in the Continuous Regeneration of Cupric Chloride Etchant
An electrochemical device has been developed that deposits non adherent copper metal powder at the cathode,and generates chlorine gas at the anode. The chlorine is contained within the system,a
.. weiterlesen
Cupric Chloride-Hydrochloric Acid Microetch Roughening Process and its Applications
We have developed a cupric chloride-hydrochloric acid based microetchant process. This process provides a unique roughened copper surface,which yields excellent adhesion for both solder mask an
.. weiterlesen
Changing the Methodology for DFM Moving from Design-Checker to Interactive,Informed Design Methodologies
The phrase "Design For Manufacture" strongly implies the use of manufacturing information while making of design decisions or,in other words,incorporating manufacturing knowledge during initial
.. weiterlesen
The Importance of Being Grounded
The proper grounding of all conductive items in the production workplace is an essential element of ESD (electrostatic discharge) management. ESD damage to components and assemblies in manufact
.. weiterlesen
RoHS and Green Compliance in IC Packaging
In this report,BGA packages with conventional and green material combination were selected as test vehicles for the investigation of MSL/temperature rating at the packaging level. The IC packag
.. weiterlesen
Assembly of Large PWBs in a RoHS Environment
As early as 2001,leading cellular phone manufacturers had established stable assembly processes that were RoHS compliant for their cellular phone products. Since this time,the products manufact
.. weiterlesen
Effects of Tin Mitigation Processes on Whisker Growth and Solder Joint Reliability for Chip and Small-Outline Package Components
This paper reports the results of an evaluation of tin mitigation processes for components,i.e. converting parts with pure tin (Sn) and other lead-free (Pb-free) finishes to tin-lead (SnPb) fin
.. weiterlesen
Tin Allotropic Transformation ~ Tin Pest
It is known that pure tin will undergo an allotropic transformation below 13°C where it becomes a semiconductor with a 26% [1,2] volume increase,and in appearance turns from a bright shiny m
.. weiterlesen
High Phosphorus Electroless Nickel for Selective ENIG (SENIG)
Concerns
There are some areas that must be accepted if planning to run the newest SENIG process:
- Slower plating rate in nickel (to get 150µ“ it will take 20 minutes)
- It works better at hig
.. weiterlesen
Optimizing Immersion Silver Chemistries for Copper
Immersion silver chemistry has been promoted as a final finish for solderability for several years now. There are different commercially available products that will deposit silver in a wide ra
.. weiterlesen
Industrial Backward Solution for Lead-Free Exempted AHP* Electronic Products
Since the European 2002/95/EC RoHS directive enforcement on 1st July 2006,a dominating part of the electronic industry suppressed the use of Pb in electronic equipment. As one of the consequenc
.. weiterlesen
Solder Joint Reliability of Pb-free Sn-Ag-Cu Ball Grid Array (BGA) Components in Sn-Pb Assembly Process
For companies that choose to take the Pb-free exemption under the European Union’s RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products,there is a growing concern abo
.. weiterlesen
Base Material Consideration for High Speed Printed Circuit Boards
Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon
.. weiterlesen
Novel CCL Based on New Fluoropolymer Exhibits Extremely Low Loss Characteristics and New Evaluation Method for Separating Dielectric and Conductive...
We demonstrate here a novel CCL (Copper Clad Laminate),which exhibits an extremely low transmission loss at mm-wave band. The CCL,which we developed,is based on a new fluoropolymer with adhesiv
.. weiterlesen
Novel Low Dk/Df Materials for High Speed PWB
The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f
.. weiterlesen
Investigating the 01005-Component Assembly Process Requirements
In 2006 we conducted two formal detailed experiments on the 01005-component assembly process. Two of the most significant findings from those experiments were that a 0.003” thick stencil is req
.. weiterlesen
01005 Assembly Process – From the Board Design to the Reflow Process
The trend towards ever smaller components and more function density continues unabated in the SMT field. Manufacturers and users must increasingly coordinate their activities to develop usable
.. weiterlesen
How to Achieve 40 Microns (1.6 Mil) Placement Spacing with E01005/M0402
When trying to achieve 40 microns of placement spacing,bridges and tombstones may occur due to the variation of the component dimensions,equipment accuracy and pickup position variations.
Hawse
.. weiterlesen
Properties that are Important in Lead-Free Solders
The change to lead-free solders has forced the electronics industry to consider more than it ever has before what properties are important in a solder. When the tin-lead eutectic was the only s
.. weiterlesen
Future Lead-Free Solder Alloys and Fluxes – Meeting Challenges of Miniaturization
In general,new lead-free solder alloys with the following characteristics are desired in order to enable the continuation of miniaturization trend: (1) alloy with a reduced melting temperature,
.. weiterlesen
Final Finishes for High Temperature Applications: A Comparison of OSP and Immersion Silver Final Finish Coatings
With the increased use of lead-free alloys there has been interest in understanding the applications and limitations of final finish coatings for lead-free assembly processes. The higher temper
.. weiterlesen
"Behind the Scenes" of Effective OSP Protection in Pb-free Processing
Advancements and evolutions in printed circuit board manufacturing,design,and electronics assembly have driven new research on high temperature organic solderability preservative (HT OSP) surfa
.. weiterlesen
Non-Destructive Real-time Optical Metrology of OSP Coatings on Production PCBs
Organic Solderability Preservative (OSP) coatings feature among the leading surface finish options in the printed circuit board (PCB) industry because of their excellent solderability,lead-free
.. weiterlesen
Calculated Shear Stress Produced by Silicone and Epoxy Thermal Interface Materials (TIMs) During Thermal Cycling
Choosing a Thermal Interface Material adhesive can have an impact on the reliability of the microelectronic package in harsh thermal environments where thermal cycling temperature ranges are mo
.. weiterlesen
Application Research of Snap Curing CSP Underfill
CSP underfill commonly acts to protect solder bumps of fine pitch CSP and enhances the reliability. This paper presents four snap curing underfills (=2min@150?or=5min@120?),tested on SnPb assem
.. weiterlesen
Implementation of Flip-Chip and Chip-Size Package Technology
As new generations of electronic products emerge they often surpass the capability of existing packaging and interconnection technology and the infrastructure needed to support newer technologi
.. weiterlesen
Impact of Hole-Fill and Voiding on Pin Through-Hole Solder Joint Reliability
In this study,thermal cycling tests for samples of different hole-fill percentages and voiding were conducted,and cross sections of the PTH solder joints were performed to evaluate the solder m
.. weiterlesen
Process Development with Temperature Sensitive Components in Server Applications
As the electronics industry prepares for the possibility of Pb-free Printed Circuit Board Assembly (PCBA) processing without the EU RoHS server Pb solder exemption,many studies continue to focu
.. weiterlesen
The Evaluation of CAF property for narrow TH pitch PCB
To better evaluate CAF (Conductive Anodic Filament) growth we have developed a Test Printed circuit board (PCB) with narrow pitch through holes. (THs) This test PCB can evaluate anti-CAF proper
.. weiterlesen
A Case for Multiple Sheet Resistivities for Thin Film Embedded Resistor Packaging Applications
Designers of high performance electronics continue to have system requirements that necessitate the implementation of embedded resistors in microelectronic package and multilayer printed circui
.. weiterlesen
Recovery of Copper Metal in the Continuous Regeneration of Cupric Chloride Etchant
An electrochemical device has been developed that deposits non adherent copper metal powder at the cathode,and generates chlorine gas at the anode. The chlorine is contained within the system,a
.. weiterlesen
Cupric Chloride-Hydrochloric Acid Microetch Roughening Process and its Applications
We have developed a cupric chloride-hydrochloric acid based microetchant process. This process provides a unique roughened copper surface,which yields excellent adhesion for both solder mask an
.. weiterlesen
Changing the Methodology for DFM Moving from Design-Checker to Interactive,Informed Design Methodologies
The phrase "Design For Manufacture" strongly implies the use of manufacturing information while making of design decisions or,in other words,incorporating manufacturing knowledge during initial
.. weiterlesen
The Importance of Being Grounded
The proper grounding of all conductive items in the production workplace is an essential element of ESD (electrostatic discharge) management. ESD damage to components and assemblies in manufact
.. weiterlesen
RoHS and Green Compliance in IC Packaging
In this report,BGA packages with conventional and green material combination were selected as test vehicles for the investigation of MSL/temperature rating at the packaging level. The IC packag
.. weiterlesen
Assembly of Large PWBs in a RoHS Environment
As early as 2001,leading cellular phone manufacturers had established stable assembly processes that were RoHS compliant for their cellular phone products. Since this time,the products manufact
.. weiterlesen
Effects of Tin Mitigation Processes on Whisker Growth and Solder Joint Reliability for Chip and Small-Outline Package Components
This paper reports the results of an evaluation of tin mitigation processes for components,i.e. converting parts with pure tin (Sn) and other lead-free (Pb-free) finishes to tin-lead (SnPb) fin
.. weiterlesen
Tin Allotropic Transformation ~ Tin Pest
It is known that pure tin will undergo an allotropic transformation below 13°C where it becomes a semiconductor with a 26% [1,2] volume increase,and in appearance turns from a bright shiny m
.. weiterlesen
High Phosphorus Electroless Nickel for Selective ENIG (SENIG)
Concerns
There are some areas that must be accepted if planning to run the newest SENIG process:
- Slower plating rate in nickel (to get 150µ“ it will take 20 minutes)
- It works better at hig
.. weiterlesen
Optimizing Immersion Silver Chemistries for Copper
Immersion silver chemistry has been promoted as a final finish for solderability for several years now. There are different commercially available products that will deposit silver in a wide ra
.. weiterlesen
Industrial Backward Solution for Lead-Free Exempted AHP* Electronic Products
Since the European 2002/95/EC RoHS directive enforcement on 1st July 2006,a dominating part of the electronic industry suppressed the use of Pb in electronic equipment. As one of the consequenc
.. weiterlesen
Solder Joint Reliability of Pb-free Sn-Ag-Cu Ball Grid Array (BGA) Components in Sn-Pb Assembly Process
For companies that choose to take the Pb-free exemption under the European Union’s RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products,there is a growing concern abo
.. weiterlesen
Base Material Consideration for High Speed Printed Circuit Boards
Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon
.. weiterlesen
Novel CCL Based on New Fluoropolymer Exhibits Extremely Low Loss Characteristics and New Evaluation Method for Separating Dielectric and Conductive...
We demonstrate here a novel CCL (Copper Clad Laminate),which exhibits an extremely low transmission loss at mm-wave band. The CCL,which we developed,is based on a new fluoropolymer with adhesiv
.. weiterlesen
Novel Low Dk/Df Materials for High Speed PWB
The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f
.. weiterlesen
Investigating the 01005-Component Assembly Process Requirements
In 2006 we conducted two formal detailed experiments on the 01005-component assembly process. Two of the most significant findings from those experiments were that a 0.003” thick stencil is req
.. weiterlesen
01005 Assembly Process – From the Board Design to the Reflow Process
The trend towards ever smaller components and more function density continues unabated in the SMT field. Manufacturers and users must increasingly coordinate their activities to develop usable
.. weiterlesen
How to Achieve 40 Microns (1.6 Mil) Placement Spacing with E01005/M0402
When trying to achieve 40 microns of placement spacing,bridges and tombstones may occur due to the variation of the component dimensions,equipment accuracy and pickup position variations.
Hawse
.. weiterlesen
Properties that are Important in Lead-Free Solders
The change to lead-free solders has forced the electronics industry to consider more than it ever has before what properties are important in a solder. When the tin-lead eutectic was the only s
.. weiterlesen
Future Lead-Free Solder Alloys and Fluxes – Meeting Challenges of Miniaturization
In general,new lead-free solder alloys with the following characteristics are desired in order to enable the continuation of miniaturization trend: (1) alloy with a reduced melting temperature,
.. weiterlesen
Final Finishes for High Temperature Applications: A Comparison of OSP and Immersion Silver Final Finish Coatings
With the increased use of lead-free alloys there has been interest in understanding the applications and limitations of final finish coatings for lead-free assembly processes. The higher temper
.. weiterlesen
"Behind the Scenes" of Effective OSP Protection in Pb-free Processing
Advancements and evolutions in printed circuit board manufacturing,design,and electronics assembly have driven new research on high temperature organic solderability preservative (HT OSP) surfa
.. weiterlesen
Non-Destructive Real-time Optical Metrology of OSP Coatings on Production PCBs
Organic Solderability Preservative (OSP) coatings feature among the leading surface finish options in the printed circuit board (PCB) industry because of their excellent solderability,lead-free
.. weiterlesen
Calculated Shear Stress Produced by Silicone and Epoxy Thermal Interface Materials (TIMs) During Thermal Cycling
Choosing a Thermal Interface Material adhesive can have an impact on the reliability of the microelectronic package in harsh thermal environments where thermal cycling temperature ranges are mo
.. weiterlesen
Application Research of Snap Curing CSP Underfill
CSP underfill commonly acts to protect solder bumps of fine pitch CSP and enhances the reliability. This paper presents four snap curing underfills (=2min@150?or=5min@120?),tested on SnPb assem
.. weiterlesen
Implementation of Flip-Chip and Chip-Size Package Technology
As new generations of electronic products emerge they often surpass the capability of existing packaging and interconnection technology and the infrastructure needed to support newer technologi
.. weiterlesen
Impact of Hole-Fill and Voiding on Pin Through-Hole Solder Joint Reliability
In this study,thermal cycling tests for samples of different hole-fill percentages and voiding were conducted,and cross sections of the PTH solder joints were performed to evaluate the solder m
.. weiterlesen
Process Development with Temperature Sensitive Components in Server Applications
As the electronics industry prepares for the possibility of Pb-free Printed Circuit Board Assembly (PCBA) processing without the EU RoHS server Pb solder exemption,many studies continue to focu
.. weiterlesen
The Evaluation of CAF property for narrow TH pitch PCB
To better evaluate CAF (Conductive Anodic Filament) growth we have developed a Test Printed circuit board (PCB) with narrow pitch through holes. (THs) This test PCB can evaluate anti-CAF proper
.. weiterlesen
A Case for Multiple Sheet Resistivities for Thin Film Embedded Resistor Packaging Applications
Designers of high performance electronics continue to have system requirements that necessitate the implementation of embedded resistors in microelectronic package and multilayer printed circui
.. weiterlesen