Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Vibration Fatigue Evaluation on Solder Joints of Under-Filled BGA
A previously developed ball grid array (BGA) solder joint vibration fatigue life prediction model,which was experimentally
validated by Test Vehicle One (TV1) test data for the BGAs with and wi
.. weiterlesen
Development of High Density Wiring Technology and Interconnect Technology with Silicon Through-Hole
We have developed the copper high density wiring formation technology with Cu/photosensitive Benzocyclobutene (BCB) as
a dielectric material,and interconnect technology with Silicon through-hol
.. weiterlesen
Insulation Material for Next Generation Packaging Substrates
With the progress of miniaturizing electronic equipment with higher performance,packaging substrates for semiconductor
devices are required to cope with finer patterning and higher wiring densi
.. weiterlesen
Micro Bump Array Constructions on the Organic Substrates for the Non-Permanent Terminations
A series of electrical plating processes to build various kinds of micro bump arrays on the organic substrates has been developed for non-permanent connections. Copper bump arrays with nickel/h
.. weiterlesen
An Issue in Time to Delamination (T260) Testing for PCBs
It has been reported by several laboratories that the time to delamination or decomposition of a printed circuit board specimen
at 260°C decreases with the specimen thickness. A temperature gra
.. weiterlesen
Flexural Fatigue Life Evaluation for Flexible Printed Circuit Boards
We report test results of bending characteristics of flexible printed circuit board,which contributes to the development of
higher density and more sophisticated function of mobile devices and
.. weiterlesen
Interconnection Reliability of HDI Printed Wiring Boards
It is effective to use the stack-via-holes method (via-on-via structure),which stacks micro via-holes (MVH),in the
development of higher density circuits on build-up printed wiring boards. When
.. weiterlesen
New Product Introduction Process Integration
The world market is changing for the OEM,CEM,and electronic manufacturers. This changing market dictates that as a
global industry more focus is placed on reducing the time to market for “New P
.. weiterlesen
Behind Growth,New Chances and Challenges in China Printed Circuit Industry
After the world electronic circuit industry finally turned out from the unprecedented recession,the business management of
today’s printed circuit industry may possibly have a chance to take a
.. weiterlesen
Bridge Detection in the Solder Paste Print Process
This paper describes part of a research effort currently under way in the field of print defect detection. The techniques
described have proven to be robust and particularly well suited for det
.. weiterlesen
Application of Thermography and Holography to Thermal Stress Evaluation of Printed Circuit Board
The comparison of the thermal pattern and the deformation pattern both are obtained on the surface of Printed Circuit Board
(PCB) was done to understand how both patterns correspond to each oth
.. weiterlesen
Development of Ultrasonic Flip Chip Bonding for Flexible Printed Circuit
Small form factor and high density of printed circuit boards (PCB) have been already realized by flip chip (FC) bonding
technology. However,the requirement for finer pitch PCB is still increasi
.. weiterlesen
The Integration of Third-Party Boundary-Scan Products into Customer Preferred Test Platforms has Become and Attractive Cost Effective Test Solution
In today’s complex manufacturing test environments,it is becoming increasingly difficult to detect and diagnose structural
faults within highly complex multi-layer PCB designs that offer extrem
.. weiterlesen
High-Bandwidth Coaxial PWB Transmission Line Probe
The design and evaluation of a wide bandwidth (3 dB attenuation bandwidth > 20 GHz),50 S,coaxial probe for the
electrical characterization of printed wiring board (PWB) transmission lines is de
.. weiterlesen
Applying a New In-Circuit Probing Technique for High-Speed/High Density Printed Circuit Boards to a Real-Life Product
Design for test rules (DFT) for in circuit test (ICT) test pads are well known and have served the industry well for nearly two
decades. However,increasing PCB densities continually put pressur
.. weiterlesen
Real Life Applications of Nanotechnology in Electronics
Nanotechnology is receiving a lot of attention from companies,universities and governments. The US $3.8million National
Nanotechnology Initiative is matched by initiatives in Europe and Asia. B
.. weiterlesen
Polymer-Ceramic Nanocomposites Based on New Concepts for Embedded Capacitor
Polymer-ceramic nanocomposites based on new concepts were developed for embedded capacitor applications. The dielectric
constant was above 80 at 1 MHz and the specific capacitance was successfu
.. weiterlesen
Enabling Ultra-Fine Pitch Packages: Soldermask Patterning using Laser Ablation
The trend towards tighter pitch,smaller features,and shrinking pad sizes have put a strain on the standard photolithographic
processes for soldermask patterning on substrate packaging and rigid
.. weiterlesen
Loss Tangent and Dielectric Constant of Solder Mask Measured with Split-Post Dielectric Resonators
As PCB computing bus frequencies climb above 1GHz,measurement of the high-frequency properties of PCB materials
becomes critical for design modeling. Understanding these properties and their de
.. weiterlesen
The Executive Dashboard: Fact or Fiction
Information Technology has come a long way from the humble payroll accounting system to integrated suite of business
applications,ostensibly to assist corporations to manage their businesses mo
.. weiterlesen
Business Cycles in the Electronic Equipment Food Chain - Growth Comparisons and Forecasts for Process Consumables & Equipment,Passive Components,Semiconductors and...
Fluctuating demand for electronic equipment has led to repetitive “boom and bust” business cycles throughout the electronics
“food chain.” Double ordering,inventory building and component outag
.. weiterlesen
Reference Designs Leading PWB Fabricators to Future Technology
New Chip Packages for advanced electronics are striving for higher density of the printed wiring boards. However,in the
supply chain,the PWB fabricator is often the last link that will learn wh
.. weiterlesen
PCB Design for Flipchip Components
The emerging technology known as ‘flipchips’ is poised to take over the world of the portable device. In an age when
more and more power and functionality is being offered in ever smaller packa
.. weiterlesen
A Comparison of PCB Adhesion Test Methods and Adhesion Promoters
Interest in the adhesive strength of PCBs has recently come to the forefront of the industry. This has been driven by the
advent of lead free soldering processes that severely stress the mechan
.. weiterlesen
The Importance of CTE in Multi-Layer Registration and Improved Measurement Methods
The current worldwide market for printed circuit boards is approximately $40 billion,with the multi-layer printed circuit
boards (MLB) comprising approximately 40% of the market. One of the mos
.. weiterlesen
Embedding Passive and Active Components in PCB - Solution For Miniaturization
The miniaturization of the electronics continues and requires the utilization of inner space of a PCB for component
placement. The embedding of the passive components inside the PCB has already
.. weiterlesen
Novel Substrate for Use as Embedded Capacitance: An Easy to Process Higher Dk Material
We have previously published our work on developing thin substrates for use as embedded capacitor layers. Both unfilled
and filled materials were characterized in regards to performance,reliabi
.. weiterlesen
Trimming Embedded Resistors Using Available PWB Equipment Technology
By using two existing pieces of common printed wiring board manufacturing equipment,embedded resistor manufacturers
can obtain laser trim results similar to the trimming obtained using a specia
.. weiterlesen
The Latest Technical Trend of Dry Film Photo Resist
This paper describes the performance of several types of the most advanced Dry Film photo Resist (DFR),for producing
high-density package substrates and chip on films (COF).
1) High resolution
.. weiterlesen
The Development of Dry Film Photoresist with 15um Lines and Spaces Resolution for Semi-Additive Processing
Next generation IC substrate designs will feature higher interconnect density and faster signal speed than current designs.
Circuitization of these substrates uses copper pattern plating follow
.. weiterlesen
Vibration Fatigue Evaluation on Solder Joints of Under-Filled BGA
A previously developed ball grid array (BGA) solder joint vibration fatigue life prediction model,which was experimentally
validated by Test Vehicle One (TV1) test data for the BGAs with and wi
.. weiterlesen
Development of High Density Wiring Technology and Interconnect Technology with Silicon Through-Hole
We have developed the copper high density wiring formation technology with Cu/photosensitive Benzocyclobutene (BCB) as
a dielectric material,and interconnect technology with Silicon through-hol
.. weiterlesen
Insulation Material for Next Generation Packaging Substrates
With the progress of miniaturizing electronic equipment with higher performance,packaging substrates for semiconductor
devices are required to cope with finer patterning and higher wiring densi
.. weiterlesen
Micro Bump Array Constructions on the Organic Substrates for the Non-Permanent Terminations
A series of electrical plating processes to build various kinds of micro bump arrays on the organic substrates has been developed for non-permanent connections. Copper bump arrays with nickel/h
.. weiterlesen
An Issue in Time to Delamination (T260) Testing for PCBs
It has been reported by several laboratories that the time to delamination or decomposition of a printed circuit board specimen
at 260°C decreases with the specimen thickness. A temperature gra
.. weiterlesen
Flexural Fatigue Life Evaluation for Flexible Printed Circuit Boards
We report test results of bending characteristics of flexible printed circuit board,which contributes to the development of
higher density and more sophisticated function of mobile devices and
.. weiterlesen
Interconnection Reliability of HDI Printed Wiring Boards
It is effective to use the stack-via-holes method (via-on-via structure),which stacks micro via-holes (MVH),in the
development of higher density circuits on build-up printed wiring boards. When
.. weiterlesen
New Product Introduction Process Integration
The world market is changing for the OEM,CEM,and electronic manufacturers. This changing market dictates that as a
global industry more focus is placed on reducing the time to market for “New P
.. weiterlesen
Behind Growth,New Chances and Challenges in China Printed Circuit Industry
After the world electronic circuit industry finally turned out from the unprecedented recession,the business management of
today’s printed circuit industry may possibly have a chance to take a
.. weiterlesen
Bridge Detection in the Solder Paste Print Process
This paper describes part of a research effort currently under way in the field of print defect detection. The techniques
described have proven to be robust and particularly well suited for det
.. weiterlesen
Application of Thermography and Holography to Thermal Stress Evaluation of Printed Circuit Board
The comparison of the thermal pattern and the deformation pattern both are obtained on the surface of Printed Circuit Board
(PCB) was done to understand how both patterns correspond to each oth
.. weiterlesen
Development of Ultrasonic Flip Chip Bonding for Flexible Printed Circuit
Small form factor and high density of printed circuit boards (PCB) have been already realized by flip chip (FC) bonding
technology. However,the requirement for finer pitch PCB is still increasi
.. weiterlesen
The Integration of Third-Party Boundary-Scan Products into Customer Preferred Test Platforms has Become and Attractive Cost Effective Test Solution
In today’s complex manufacturing test environments,it is becoming increasingly difficult to detect and diagnose structural
faults within highly complex multi-layer PCB designs that offer extrem
.. weiterlesen
High-Bandwidth Coaxial PWB Transmission Line Probe
The design and evaluation of a wide bandwidth (3 dB attenuation bandwidth > 20 GHz),50 S,coaxial probe for the
electrical characterization of printed wiring board (PWB) transmission lines is de
.. weiterlesen
Applying a New In-Circuit Probing Technique for High-Speed/High Density Printed Circuit Boards to a Real-Life Product
Design for test rules (DFT) for in circuit test (ICT) test pads are well known and have served the industry well for nearly two
decades. However,increasing PCB densities continually put pressur
.. weiterlesen
Real Life Applications of Nanotechnology in Electronics
Nanotechnology is receiving a lot of attention from companies,universities and governments. The US $3.8million National
Nanotechnology Initiative is matched by initiatives in Europe and Asia. B
.. weiterlesen
Polymer-Ceramic Nanocomposites Based on New Concepts for Embedded Capacitor
Polymer-ceramic nanocomposites based on new concepts were developed for embedded capacitor applications. The dielectric
constant was above 80 at 1 MHz and the specific capacitance was successfu
.. weiterlesen
Enabling Ultra-Fine Pitch Packages: Soldermask Patterning using Laser Ablation
The trend towards tighter pitch,smaller features,and shrinking pad sizes have put a strain on the standard photolithographic
processes for soldermask patterning on substrate packaging and rigid
.. weiterlesen
Loss Tangent and Dielectric Constant of Solder Mask Measured with Split-Post Dielectric Resonators
As PCB computing bus frequencies climb above 1GHz,measurement of the high-frequency properties of PCB materials
becomes critical for design modeling. Understanding these properties and their de
.. weiterlesen
The Executive Dashboard: Fact or Fiction
Information Technology has come a long way from the humble payroll accounting system to integrated suite of business
applications,ostensibly to assist corporations to manage their businesses mo
.. weiterlesen
Business Cycles in the Electronic Equipment Food Chain - Growth Comparisons and Forecasts for Process Consumables & Equipment,Passive Components,Semiconductors and...
Fluctuating demand for electronic equipment has led to repetitive “boom and bust” business cycles throughout the electronics
“food chain.” Double ordering,inventory building and component outag
.. weiterlesen
Reference Designs Leading PWB Fabricators to Future Technology
New Chip Packages for advanced electronics are striving for higher density of the printed wiring boards. However,in the
supply chain,the PWB fabricator is often the last link that will learn wh
.. weiterlesen
PCB Design for Flipchip Components
The emerging technology known as ‘flipchips’ is poised to take over the world of the portable device. In an age when
more and more power and functionality is being offered in ever smaller packa
.. weiterlesen
A Comparison of PCB Adhesion Test Methods and Adhesion Promoters
Interest in the adhesive strength of PCBs has recently come to the forefront of the industry. This has been driven by the
advent of lead free soldering processes that severely stress the mechan
.. weiterlesen
The Importance of CTE in Multi-Layer Registration and Improved Measurement Methods
The current worldwide market for printed circuit boards is approximately $40 billion,with the multi-layer printed circuit
boards (MLB) comprising approximately 40% of the market. One of the mos
.. weiterlesen
Embedding Passive and Active Components in PCB - Solution For Miniaturization
The miniaturization of the electronics continues and requires the utilization of inner space of a PCB for component
placement. The embedding of the passive components inside the PCB has already
.. weiterlesen
Novel Substrate for Use as Embedded Capacitance: An Easy to Process Higher Dk Material
We have previously published our work on developing thin substrates for use as embedded capacitor layers. Both unfilled
and filled materials were characterized in regards to performance,reliabi
.. weiterlesen
Trimming Embedded Resistors Using Available PWB Equipment Technology
By using two existing pieces of common printed wiring board manufacturing equipment,embedded resistor manufacturers
can obtain laser trim results similar to the trimming obtained using a specia
.. weiterlesen
The Latest Technical Trend of Dry Film Photo Resist
This paper describes the performance of several types of the most advanced Dry Film photo Resist (DFR),for producing
high-density package substrates and chip on films (COF).
1) High resolution
.. weiterlesen
The Development of Dry Film Photoresist with 15um Lines and Spaces Resolution for Semi-Additive Processing
Next generation IC substrate designs will feature higher interconnect density and faster signal speed than current designs.
Circuitization of these substrates uses copper pattern plating follow
.. weiterlesen