Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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High Yields and Low Costs Liquid Resists
In the multilayer PCB industry,the process of making the inner layer is the first step in a number of complex steps that
results in the production of a printed wiring board. This imaging manufa
.. weiterlesen
Practical Lead-Free Implementation
Environmental regulations are forcing the elimination of lead (Pb) from electronic equipment. 2005 will be the year that
many electronics assemblers will be transitioning their soldering proces
.. weiterlesen
Low Cost Lead Free Solution Evaluation for Electronic Consumer Applications
Lead products are no longer an option if you want to export to the EU market. RoHS regulations requiring the manufacture of
lead-free electronic products by July 2006 are pushing the industry t
.. weiterlesen
Lead-Free Product Transition: Impact on Printed Circuit Board Design and Material Selection
Electronic products are being stressed by increasing operating temperatures and higher assembly temperatures. Silicon and
product power consumption are increasing as the silicon densities and s
.. weiterlesen
A Study on Coplanar Structures for High Speed Transmission
Demand for higher speed digital signal processing is notable today in the electronics industry. To meet this demand,circuit
designs that employ coplanar structure,either for both single-end and
.. weiterlesen
Non-Classical Conductor Losses due to Copper Foil Roughness and Treatment
In high speed digital interconnects; signal attenuation is a result of both dielectric losses and conductor losses. Previous
works have showed in detail,the characterization and modeling effort
.. weiterlesen
High Power LED and Thermal Management
A high-power-SMD-LED (HL-LED) outline 3,3 x 2,9 mm² was developed,with chip-size up to 1 mm² and power dissipation
up to 1.500 mW (400 mA for UV-InGaN) in a corresponding thermal ambient. The t
.. weiterlesen
Advanced Filled Via Plating Methodology
This paper describes Advanced Filled Via Plating Methodology for stacked via technology. In this paper,via bottom crevice,
via bottom land etching and electroless copper plating coverage is foc
.. weiterlesen
Optimised Vertical Process for Microvia Filling and Through Hole Metallization Under Production-like Conditions
This article summarises how a copper metallization process for simultaneous via filling and through hole plating was
developed on a laboratory scale and the challenges encountered by scale-up t
.. weiterlesen
FVSS (Free Via Stacked up Structure)
The miniaturization of mobile electronic devices continues,market trends toward lighter and thinner printed circuit boards (PWB) have been accelerating. At the same time,the demand for increase
.. weiterlesen
Design for Manufacture – Ceramic Thick-Film Embedded Capacitors
Embedding discrete capacitors right into printed circuit boards (PWB),although not new,is part of a pivotal technology for
the PWB industry. For example,the ability to locate decoupling capacit
.. weiterlesen
Electrical Behavior of Thin Film Embedded Decoupling Capacitor in Printed Circuit Boards
In this study,we developed the thin film embedded decoupling capacitors and experimentally investigated its electrical
behavior in terms of power-ground impedance and simultaneous switching noi
.. weiterlesen
Materials for Capacitor Embedding in PWBs
We have developed a new resin-coated-foil (RCF) material named MCF-HD-45 to be embedded in PWBs to constitute
capacitors. The material is composed of a thermosetting resin and a high dielectric
.. weiterlesen
Removal of Palladium Residue in Semi-Additive Process for Enhanced Reliability in
In order to satisfy the ever-increasing demand for smaller and lighter electronic devices,a drastic miniaturization is making
rapid progresses for even circuit features on printed wiring boards
.. weiterlesen
Wiring Process by Electrophotography and Electroless Plating
For the purpose of mask-less manufacturing for Printed Circuit Board (PCB),a new process using electrophotography
technology,principle of copy machines,has been proposed and evaluated. Wiring p
.. weiterlesen
Oxidation and Topography of Powder in Pb-free Solder Paste
There are compelling reasons to study the relationship between oxidation and the topography of solder powder; these
include the following:
?? Customer requirements to reflow SAC-based (SnAgCu)
.. weiterlesen
The Effect of Ni on the Microstructure and Behaviour of the Sn-Cu Eutectic Lead-free Solder
While the Ni-stabilized Sn-0.7Cu alloy is now well established as a viable lead-free solder in large scale commercial printed
circuit board assembly the effect of Ni is not yet fully understood
.. weiterlesen
Lead Free Flip Chip and Chip Scale Package Inspection: New Challenges Will Require New Inspection Technologies
Lead free implementation will present new challenges for PCB manufacturers from a design,soldering process,and QC
standpoint. The higher reflow process temperatures will cause greater thermal s
.. weiterlesen
OEE,the New Gauge on the Dashboard for the PCB Assembly Industry
OEE (Overall Equipment Effectiveness) is commonly used in a wide range of businesses when it comes to measuring and
monitoring manufacturing performance. Even though OEE has been applied in var
.. weiterlesen
An Open Standards Based Approach to the Exchange of Data in an Automated Electronics Assembly Operation
A tier one supplier to the automotive industry has determined that a key to staying competitive in the electronics
manufacturing industry is to adopt open standards for the exchange of data. Sp
.. weiterlesen
Optimizing Production Cost with Electronic Manufacturing Simulation
Factory simulation has been used extensively to optimize and reduce costs across many manufacturing disciplines.
Unfortunately,general purpose factory simulators do not effectively model the sp
.. weiterlesen
Filling Pastes in PCB Production – Fields of Application,Possibilities and Limitations
In the past the use of filling pastes in PCB production was largely limited to via hole fillers. These materials with a solids
content of 100% are still successfully employed today to close via
.. weiterlesen
The Feasibility of Blind Via on PTFE-FR4 Laminated Multi-Layer PCB
PTFE-FR4 hybrid laminated multi-layer PCB technology is being applied more and more widely. This technology requires blind via fabrication in a PTFE core. This paper gives a picture of the manu
.. weiterlesen
Backdrilling Technology for Backpanel
In order to get excellent signal Integrity,half PTH holes will be a new trend in high frequency backpanel designing.
Backdrilling is necessary for this application. This paper explores the appl
.. weiterlesen
Direct Immersion Gold as a Final Finish
In this study,the DIG process (Direct Immersion Gold),is investigated. DIG is a process in which gold is plated directly on
copper as a surface finish for printed circuit board and package appl
.. weiterlesen
Characterization,Reproduction,and Resolution of Solder Joint Microvoiding
Microvoids are tiny voids in solder joints and differ from the more well known solder joint voiding in their individual size
and location. The microvoids discussed herein are described as an ab
.. weiterlesen
Implementing Laser Marking of Printed Circuit Boards
Manufacturers of electronic devices,from home audio equipment to automotive keyless entry systems,are increasingly
seeking a reliable,cost effective method for uniquely identifying and tracking
.. weiterlesen
Conductive Polymer Imaging For Communications and Electronics
Conductive inks and polymers based on metals were originally envisaged for quick repairs to Printed Circuit Boards (PCBs)
and semiconductor chips. Increasingly these materials are being used to
.. weiterlesen
Optimization of Lead-Free Soldering Processes for Volume Manufacturing
In this paper,a comprehensive review is provided on the optimization of soldering processes (including reflow,wave
soldering,and rework),for different component types,different PCB sizes and fi
.. weiterlesen
Lead-Free Solder Flip Chips on FR-4 Substrates with Different Assembly Processes and Materials
This study is focused on using different assembly options such as dip fluxing,flux jetting and reflow encapsulate for 200-
250um pitch lead-free (SnAgCu) flip chips on FR4 substrates. The impac
.. weiterlesen
High Yields and Low Costs Liquid Resists
In the multilayer PCB industry,the process of making the inner layer is the first step in a number of complex steps that
results in the production of a printed wiring board. This imaging manufa
.. weiterlesen
Practical Lead-Free Implementation
Environmental regulations are forcing the elimination of lead (Pb) from electronic equipment. 2005 will be the year that
many electronics assemblers will be transitioning their soldering proces
.. weiterlesen
Low Cost Lead Free Solution Evaluation for Electronic Consumer Applications
Lead products are no longer an option if you want to export to the EU market. RoHS regulations requiring the manufacture of
lead-free electronic products by July 2006 are pushing the industry t
.. weiterlesen
Lead-Free Product Transition: Impact on Printed Circuit Board Design and Material Selection
Electronic products are being stressed by increasing operating temperatures and higher assembly temperatures. Silicon and
product power consumption are increasing as the silicon densities and s
.. weiterlesen
A Study on Coplanar Structures for High Speed Transmission
Demand for higher speed digital signal processing is notable today in the electronics industry. To meet this demand,circuit
designs that employ coplanar structure,either for both single-end and
.. weiterlesen
Non-Classical Conductor Losses due to Copper Foil Roughness and Treatment
In high speed digital interconnects; signal attenuation is a result of both dielectric losses and conductor losses. Previous
works have showed in detail,the characterization and modeling effort
.. weiterlesen
High Power LED and Thermal Management
A high-power-SMD-LED (HL-LED) outline 3,3 x 2,9 mm² was developed,with chip-size up to 1 mm² and power dissipation
up to 1.500 mW (400 mA for UV-InGaN) in a corresponding thermal ambient. The t
.. weiterlesen
Advanced Filled Via Plating Methodology
This paper describes Advanced Filled Via Plating Methodology for stacked via technology. In this paper,via bottom crevice,
via bottom land etching and electroless copper plating coverage is foc
.. weiterlesen
Optimised Vertical Process for Microvia Filling and Through Hole Metallization Under Production-like Conditions
This article summarises how a copper metallization process for simultaneous via filling and through hole plating was
developed on a laboratory scale and the challenges encountered by scale-up t
.. weiterlesen
FVSS (Free Via Stacked up Structure)
The miniaturization of mobile electronic devices continues,market trends toward lighter and thinner printed circuit boards (PWB) have been accelerating. At the same time,the demand for increase
.. weiterlesen
Design for Manufacture – Ceramic Thick-Film Embedded Capacitors
Embedding discrete capacitors right into printed circuit boards (PWB),although not new,is part of a pivotal technology for
the PWB industry. For example,the ability to locate decoupling capacit
.. weiterlesen
Electrical Behavior of Thin Film Embedded Decoupling Capacitor in Printed Circuit Boards
In this study,we developed the thin film embedded decoupling capacitors and experimentally investigated its electrical
behavior in terms of power-ground impedance and simultaneous switching noi
.. weiterlesen
Materials for Capacitor Embedding in PWBs
We have developed a new resin-coated-foil (RCF) material named MCF-HD-45 to be embedded in PWBs to constitute
capacitors. The material is composed of a thermosetting resin and a high dielectric
.. weiterlesen
Removal of Palladium Residue in Semi-Additive Process for Enhanced Reliability in
In order to satisfy the ever-increasing demand for smaller and lighter electronic devices,a drastic miniaturization is making
rapid progresses for even circuit features on printed wiring boards
.. weiterlesen
Wiring Process by Electrophotography and Electroless Plating
For the purpose of mask-less manufacturing for Printed Circuit Board (PCB),a new process using electrophotography
technology,principle of copy machines,has been proposed and evaluated. Wiring p
.. weiterlesen
Oxidation and Topography of Powder in Pb-free Solder Paste
There are compelling reasons to study the relationship between oxidation and the topography of solder powder; these
include the following:
?? Customer requirements to reflow SAC-based (SnAgCu)
.. weiterlesen
The Effect of Ni on the Microstructure and Behaviour of the Sn-Cu Eutectic Lead-free Solder
While the Ni-stabilized Sn-0.7Cu alloy is now well established as a viable lead-free solder in large scale commercial printed
circuit board assembly the effect of Ni is not yet fully understood
.. weiterlesen
Lead Free Flip Chip and Chip Scale Package Inspection: New Challenges Will Require New Inspection Technologies
Lead free implementation will present new challenges for PCB manufacturers from a design,soldering process,and QC
standpoint. The higher reflow process temperatures will cause greater thermal s
.. weiterlesen
OEE,the New Gauge on the Dashboard for the PCB Assembly Industry
OEE (Overall Equipment Effectiveness) is commonly used in a wide range of businesses when it comes to measuring and
monitoring manufacturing performance. Even though OEE has been applied in var
.. weiterlesen
An Open Standards Based Approach to the Exchange of Data in an Automated Electronics Assembly Operation
A tier one supplier to the automotive industry has determined that a key to staying competitive in the electronics
manufacturing industry is to adopt open standards for the exchange of data. Sp
.. weiterlesen
Optimizing Production Cost with Electronic Manufacturing Simulation
Factory simulation has been used extensively to optimize and reduce costs across many manufacturing disciplines.
Unfortunately,general purpose factory simulators do not effectively model the sp
.. weiterlesen
Filling Pastes in PCB Production – Fields of Application,Possibilities and Limitations
In the past the use of filling pastes in PCB production was largely limited to via hole fillers. These materials with a solids
content of 100% are still successfully employed today to close via
.. weiterlesen
The Feasibility of Blind Via on PTFE-FR4 Laminated Multi-Layer PCB
PTFE-FR4 hybrid laminated multi-layer PCB technology is being applied more and more widely. This technology requires blind via fabrication in a PTFE core. This paper gives a picture of the manu
.. weiterlesen
Backdrilling Technology for Backpanel
In order to get excellent signal Integrity,half PTH holes will be a new trend in high frequency backpanel designing.
Backdrilling is necessary for this application. This paper explores the appl
.. weiterlesen
Direct Immersion Gold as a Final Finish
In this study,the DIG process (Direct Immersion Gold),is investigated. DIG is a process in which gold is plated directly on
copper as a surface finish for printed circuit board and package appl
.. weiterlesen
Characterization,Reproduction,and Resolution of Solder Joint Microvoiding
Microvoids are tiny voids in solder joints and differ from the more well known solder joint voiding in their individual size
and location. The microvoids discussed herein are described as an ab
.. weiterlesen
Implementing Laser Marking of Printed Circuit Boards
Manufacturers of electronic devices,from home audio equipment to automotive keyless entry systems,are increasingly
seeking a reliable,cost effective method for uniquely identifying and tracking
.. weiterlesen
Conductive Polymer Imaging For Communications and Electronics
Conductive inks and polymers based on metals were originally envisaged for quick repairs to Printed Circuit Boards (PCBs)
and semiconductor chips. Increasingly these materials are being used to
.. weiterlesen
Optimization of Lead-Free Soldering Processes for Volume Manufacturing
In this paper,a comprehensive review is provided on the optimization of soldering processes (including reflow,wave
soldering,and rework),for different component types,different PCB sizes and fi
.. weiterlesen
Lead-Free Solder Flip Chips on FR-4 Substrates with Different Assembly Processes and Materials
This study is focused on using different assembly options such as dip fluxing,flux jetting and reflow encapsulate for 200-
250um pitch lead-free (SnAgCu) flip chips on FR4 substrates. The impac
.. weiterlesen