Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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New Improved Polyimides for Increased Reliability
A Design of Experiment (DOE) was conducted to determine the best filler,or combination of fillers that would offer the best
reduction of CTE expansion from 50oC to 260o C without compromising e
.. weiterlesen
All Polyimide Thin Multi-Layer Substrate
As a promising candidate for future substrate with high pin-count and low transmission loss at high frequency,we have
developed an all polyimide multi-layered board laminated by single batch pr
.. weiterlesen
Novel Polyimide Build-up Material for Fine-line Fabrication
We have developed a new thermosetting polyimide build-up material for high performance build-up PWBs,which can mount
high speed CPUs with high I/O numbers. These PWBs meet the following require
.. weiterlesen
Design of Experiment in Micro-Via Thermal Fatigue Test
The objectives of the present study are to design,fabricate,and test various configurations of micro-vias over military
thermal environment,and then evaluate the impacts of micro-via design/man
.. weiterlesen
Qualification of Stacked Microvia Boards for Handset Assembly
The trends of increased functionality and reduced size of portable wireless products,such as handsets and PDAs,are
demanding increased routing densities for printed circuit boards. The handheld
.. weiterlesen
Evaluation of Underfill Material on Board Level Reliability Improvement of Wafer Level CSP Component
In recent years,Wafer Level Chip Scale Packages (WLCSP) are used not only in the hand held devices but also in high-end
networking and telecommunication products. Due to their small footprint a
.. weiterlesen
The Effect of Thermal Loaded Bend Test on the Solder Joint Reliability
With the function of today’s electronic devices become more and more complicate,the high I/O flip chip ball grid array
package (FCBGA) is used more popularly in recent years. The FCBGA package
.. weiterlesen
Investigation of the Manufacturing Challenges of 2577 I/O Flip Chip Ball Grid Arrays
Higher I/O Ball Grid Arrays (BGAs) are high speed,high pin count,and high performance array packages. These BGAs are
also more complex in structure than “standard” BGAs and are generally target
.. weiterlesen
Adhesive Deposit Performance Characterization using Standard X-ray Analysis Tools
Quantifying SMT adhesive dispensing performance has typically been attribute analysis via a microscope. Individual
adhesive deposits were inspected for strings or tails,extra dots,missing dots
.. weiterlesen
When are Conductive Adhesives an Alternative to Solder?
Conductive adhesives (CAs) have been an important problem-solving class of assembly materials for decades,but primarily
as die attaches products,ever since they replaced metallurgical systems.
.. weiterlesen
Comparative Evaluation of AOI Systems
The electronic industry trend of smaller component packages and tighter spacing has put greater demands on manufacturing
for process control and product verification. Defects must be caught ear
.. weiterlesen
Solder Paste Printing Inspection – An Inside Look
Industry cost control pressures and technology drivers demand more powerful 3D AOI machines for control of solder paste
printing. Here is an inside look at the factors potential purchasers of t
.. weiterlesen
Dynamic Testing and Modeling for Solder Joint Reliability Evaluation
The behavior of BGA solder joints under dynamic loads has become more significant in recent years. This work explored test
methodologies for solder joint failure evaluation under dynamic loads.
.. weiterlesen
Comparing Digital and Analogue X-ray Inspection for BGA,Flip Chip and CSP Analysis
Non-destructive testing during the manufacture of printed wiring boards (PWBs) has become ever more important for
checking product quality without compromising productivity. Using x-ray inspect
.. weiterlesen
Thermal Mechanical Analysis T-260 Printed Wiring Board Testing
Evaluation of printed wiring boards (PWBs) for thermal reliability during assembly and rework operations by Thermal
Mechanical Analyzer (TMA) “T-260” testing has been an accepted practice for m
.. weiterlesen
Issues and Challenges of Testing Modern Low Voltage Devices with Conventional In-Circuit Testers
The popularity of low voltage technologies has grown significantly over the last decade as semiconductor device
manufacturers have moved to satisfy market demands for more powerful products,sma
.. weiterlesen
Lead Free First Article Inspection: The Key to Success
Process,Process,Process – these words must ring loudly in our ears,and must be at the forefront of lead free
implementation. The smaller process windows dictated by lead free alloys are going t
.. weiterlesen
Deposition of Gold and Silver Surface Finishes Using Organic-Based Solutions
A novel electrochemical plating process for depositing gold and silver surface finishes using environmentally benign,
organic-based solutions as the plating bath is being investigated. The plat
.. weiterlesen
Neutral Type Auto-Catalytic Electroless Gold Plating Process
In order to understand the reaction mechanism of an auto-catalytic type gold plating bath,it is necessary to recognize the
following reactions --- oxidation of reducing agent,gold deposition an
.. weiterlesen
Study of SMT Assembly Processes for Fine Pitch CSP Packages
The SMT (surface mount technology) assembly process for 0.4 mm pitch CSP (chip scale package) components was studied
in this work. For the screen printing process,the printing performance of di
.. weiterlesen
PCB Materials Behaviours towards Humidity and Impact of the Design,Finishes,Baking and Assembly Processes on Assembly Quality and Solder Joint Reliability
As Electrostatic discharge,humidity can have a bad impact on assembly quality. It requires environmental conditions and
process controls but also risks knowledge. To overcome humidity issue,par
.. weiterlesen
A Fast,Precise and Reproducible QC-Rheometry Routine for Solder Paste
SPC data has shown that the solder paste printing process is the primary source of soldering defects in SMT assembly.
Consequently,verification of the specified printing properties of solder pa
.. weiterlesen
Optimizing Solder Paste Printing For Wafer Bumping
Recently,wafer bumping using solder paste with very fine solder powder has come into focus as more cost effective than
conventional sputtered or plated methods. This additive method revolves ar
.. weiterlesen
Solder Paste Printing of High Density Substrates using Enhanced Print Technology
The research discussed in this paper uses an innovative enhancement technique for printing High Density substrates. The
technique takes advantage of high frequency low amplitude vibrations appl
.. weiterlesen
Investigating Compliant Tooling Solutions within a Mass Imaging Process
The printing process is always highlighted as contributing the most process defects to a surface mount manufacturing
production facility; typical values presented are around the 60% range. Fact
.. weiterlesen
Squeegee Blades vs. Pump Technology: A Comparison of Solder Paste Print Performance
Enclosed print heads have recently been available to circuit board manufacturers as an alternate technology to conventional
squeegee printing. By design,enclosed print heads offer several advan
.. weiterlesen
A New Non-Halogen Flame-Retardant System for Printed Wiring Boards
There is continued interest in utilizing alternatives to bromine-based flame retardants for printed wiring boards. As a result,a
wide variety of phosphorus and non-phosphorus systems have been
.. weiterlesen
New Materials for HDI Interconnect Applications
A study was conduced to see if faster laser ablation rates,improved fracture resistance and better copper adhesion
after electroless plating could be engineered into existing Resin Coated Foils
.. weiterlesen
High Phosphorous Electroless Nickel Process for Mobile Phone PWBs
An Electroless Nickel and Immersion Gold (ENIG) plating process with a middle phosphorous content nickel layer is
currently a mainstream final finishing application for mobile phone Printed Wir
.. weiterlesen
Next Generation Organic Solderability Preservatives (OSP) for Lead-free soldering and Mixed Metal Finish PWB’s and BGA Substrates
With the electronics industry rapidly moving to lead-free soldering and requirements for long term reliability of the assembly
becoming more critical,fabricators and OEM’s must determine the mo
.. weiterlesen
New Improved Polyimides for Increased Reliability
A Design of Experiment (DOE) was conducted to determine the best filler,or combination of fillers that would offer the best
reduction of CTE expansion from 50oC to 260o C without compromising e
.. weiterlesen
All Polyimide Thin Multi-Layer Substrate
As a promising candidate for future substrate with high pin-count and low transmission loss at high frequency,we have
developed an all polyimide multi-layered board laminated by single batch pr
.. weiterlesen
Novel Polyimide Build-up Material for Fine-line Fabrication
We have developed a new thermosetting polyimide build-up material for high performance build-up PWBs,which can mount
high speed CPUs with high I/O numbers. These PWBs meet the following require
.. weiterlesen
Design of Experiment in Micro-Via Thermal Fatigue Test
The objectives of the present study are to design,fabricate,and test various configurations of micro-vias over military
thermal environment,and then evaluate the impacts of micro-via design/man
.. weiterlesen
Qualification of Stacked Microvia Boards for Handset Assembly
The trends of increased functionality and reduced size of portable wireless products,such as handsets and PDAs,are
demanding increased routing densities for printed circuit boards. The handheld
.. weiterlesen
Evaluation of Underfill Material on Board Level Reliability Improvement of Wafer Level CSP Component
In recent years,Wafer Level Chip Scale Packages (WLCSP) are used not only in the hand held devices but also in high-end
networking and telecommunication products. Due to their small footprint a
.. weiterlesen
The Effect of Thermal Loaded Bend Test on the Solder Joint Reliability
With the function of today’s electronic devices become more and more complicate,the high I/O flip chip ball grid array
package (FCBGA) is used more popularly in recent years. The FCBGA package
.. weiterlesen
Investigation of the Manufacturing Challenges of 2577 I/O Flip Chip Ball Grid Arrays
Higher I/O Ball Grid Arrays (BGAs) are high speed,high pin count,and high performance array packages. These BGAs are
also more complex in structure than “standard” BGAs and are generally target
.. weiterlesen
Adhesive Deposit Performance Characterization using Standard X-ray Analysis Tools
Quantifying SMT adhesive dispensing performance has typically been attribute analysis via a microscope. Individual
adhesive deposits were inspected for strings or tails,extra dots,missing dots
.. weiterlesen
When are Conductive Adhesives an Alternative to Solder?
Conductive adhesives (CAs) have been an important problem-solving class of assembly materials for decades,but primarily
as die attaches products,ever since they replaced metallurgical systems.
.. weiterlesen
Comparative Evaluation of AOI Systems
The electronic industry trend of smaller component packages and tighter spacing has put greater demands on manufacturing
for process control and product verification. Defects must be caught ear
.. weiterlesen
Solder Paste Printing Inspection – An Inside Look
Industry cost control pressures and technology drivers demand more powerful 3D AOI machines for control of solder paste
printing. Here is an inside look at the factors potential purchasers of t
.. weiterlesen
Dynamic Testing and Modeling for Solder Joint Reliability Evaluation
The behavior of BGA solder joints under dynamic loads has become more significant in recent years. This work explored test
methodologies for solder joint failure evaluation under dynamic loads.
.. weiterlesen
Comparing Digital and Analogue X-ray Inspection for BGA,Flip Chip and CSP Analysis
Non-destructive testing during the manufacture of printed wiring boards (PWBs) has become ever more important for
checking product quality without compromising productivity. Using x-ray inspect
.. weiterlesen
Thermal Mechanical Analysis T-260 Printed Wiring Board Testing
Evaluation of printed wiring boards (PWBs) for thermal reliability during assembly and rework operations by Thermal
Mechanical Analyzer (TMA) “T-260” testing has been an accepted practice for m
.. weiterlesen
Issues and Challenges of Testing Modern Low Voltage Devices with Conventional In-Circuit Testers
The popularity of low voltage technologies has grown significantly over the last decade as semiconductor device
manufacturers have moved to satisfy market demands for more powerful products,sma
.. weiterlesen
Lead Free First Article Inspection: The Key to Success
Process,Process,Process – these words must ring loudly in our ears,and must be at the forefront of lead free
implementation. The smaller process windows dictated by lead free alloys are going t
.. weiterlesen
Deposition of Gold and Silver Surface Finishes Using Organic-Based Solutions
A novel electrochemical plating process for depositing gold and silver surface finishes using environmentally benign,
organic-based solutions as the plating bath is being investigated. The plat
.. weiterlesen
Neutral Type Auto-Catalytic Electroless Gold Plating Process
In order to understand the reaction mechanism of an auto-catalytic type gold plating bath,it is necessary to recognize the
following reactions --- oxidation of reducing agent,gold deposition an
.. weiterlesen
Study of SMT Assembly Processes for Fine Pitch CSP Packages
The SMT (surface mount technology) assembly process for 0.4 mm pitch CSP (chip scale package) components was studied
in this work. For the screen printing process,the printing performance of di
.. weiterlesen
PCB Materials Behaviours towards Humidity and Impact of the Design,Finishes,Baking and Assembly Processes on Assembly Quality and Solder Joint Reliability
As Electrostatic discharge,humidity can have a bad impact on assembly quality. It requires environmental conditions and
process controls but also risks knowledge. To overcome humidity issue,par
.. weiterlesen
A Fast,Precise and Reproducible QC-Rheometry Routine for Solder Paste
SPC data has shown that the solder paste printing process is the primary source of soldering defects in SMT assembly.
Consequently,verification of the specified printing properties of solder pa
.. weiterlesen
Optimizing Solder Paste Printing For Wafer Bumping
Recently,wafer bumping using solder paste with very fine solder powder has come into focus as more cost effective than
conventional sputtered or plated methods. This additive method revolves ar
.. weiterlesen
Solder Paste Printing of High Density Substrates using Enhanced Print Technology
The research discussed in this paper uses an innovative enhancement technique for printing High Density substrates. The
technique takes advantage of high frequency low amplitude vibrations appl
.. weiterlesen
Investigating Compliant Tooling Solutions within a Mass Imaging Process
The printing process is always highlighted as contributing the most process defects to a surface mount manufacturing
production facility; typical values presented are around the 60% range. Fact
.. weiterlesen
Squeegee Blades vs. Pump Technology: A Comparison of Solder Paste Print Performance
Enclosed print heads have recently been available to circuit board manufacturers as an alternate technology to conventional
squeegee printing. By design,enclosed print heads offer several advan
.. weiterlesen
A New Non-Halogen Flame-Retardant System for Printed Wiring Boards
There is continued interest in utilizing alternatives to bromine-based flame retardants for printed wiring boards. As a result,a
wide variety of phosphorus and non-phosphorus systems have been
.. weiterlesen
New Materials for HDI Interconnect Applications
A study was conduced to see if faster laser ablation rates,improved fracture resistance and better copper adhesion
after electroless plating could be engineered into existing Resin Coated Foils
.. weiterlesen
High Phosphorous Electroless Nickel Process for Mobile Phone PWBs
An Electroless Nickel and Immersion Gold (ENIG) plating process with a middle phosphorous content nickel layer is
currently a mainstream final finishing application for mobile phone Printed Wir
.. weiterlesen
Next Generation Organic Solderability Preservatives (OSP) for Lead-free soldering and Mixed Metal Finish PWB’s and BGA Substrates
With the electronics industry rapidly moving to lead-free soldering and requirements for long term reliability of the assembly
becoming more critical,fabricators and OEM’s must determine the mo
.. weiterlesen