Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Anzeige
The Electronic Considerations of Embedded Passive Components in Optical PCB Fabrication
The current technology includes transmission of between optical units (typically modulated laser sender and receiver units) and fiber optic cables or flexible kapton fiber optic cables with whi
.. weiterlesen
Manufacturing Embedded Resistors
Increasing component density and the requirements of higher performance electronic devices are driving the development of embedded passive devices in the printed circuit board (PCB). The benefi
.. weiterlesen
New Non-Reinforced Substrates for use as Embedded Capacitors
As CPUs increase in performance,the number of passive components on the surface of the boards are increasing dramatically. To reduce the number of components,as well as improve the electrical p
.. weiterlesen
Laser Ablation in the Interconnect Industry
The last 10 years have seen the rise of lasers used in the interconnect industry to a point where their use is almost becoming ‘main stream’. As line width and spacing requirements become small
.. weiterlesen
Development of High Density and High Frequency Substrate Using B^2it Technology for Next Generation Packaging
For faster,smaller,and high performance integrated circuits the new concept of buried bump interconnect substrates is required. We have developed B2itTM (buried bump interconnection technology
.. weiterlesen
Microvia Drilling Technology
The need for the high density provided by Build-up PWB installed in the mobile communication products requires the general trend towards a gradually smaller hole diameter. For the micro via dri
.. weiterlesen
A New Technology for the Inspection of Contaminant Residues from the Formation of PCB Microvias
The evolution of interconnection systems for Printed Circuit Boards has been extremely interesting. The first connections were those generated in a copper foil on the surface of a single sided
.. weiterlesen
Solid,Reliable and Planar Microvias Using (Mostly) Conventional Multilayer PCB Technology
Despite the strong increase in demand for high-density circuit boards,very few manufacturers are offering microvia architectures in high volume. Current microvia technologies require significan
.. weiterlesen
Microvia PWB's Qualified for Avionics,Microvias Can Enhance PWB Reliability
Laser-drilled microvias are being added to the list of approved technologies for printed wiring boards destined for use in a rapidly increasing number of application types and environments. Mic
.. weiterlesen
Programming Considerations in Complex Wave Form Pulse Reverse Plating: Part 1,Developing the Tool
With the advent of more flexible versions of pulse-reverse plating technologies,and with the ability to program more of the waveform parameters,comes an increased number of options facing the u
.. weiterlesen
Folded-Flex and Stacked CSP,the 3D Solution for SiP Applications
The multiple die chip-scale package technology (identified as the ?Z™) is a truly innovative,folded-flex stacked packaging technology. The concept has already been proven in a collaborative dev
.. weiterlesen
Programming Considerations in Complex Wave Form Pulse Reverse Plating: Part 1,Developing the Tool
With the advent of more flexible versions of pulse-reverse plating technologies,and with the ability to program more of the waveform parameters,comes an increased number of options facing the u
.. weiterlesen
Overcoming Technical and Business Issues Associated with System in Package Adoption
In today's world of electronics the keywords are smaller,faster and cheaper. With more and more circuitry going onto existing circuit boards,the designers are searching for ways to contain this
.. weiterlesen
Advanced Packaging Using Liquid Crystalline Polymer (LCP) Substrates
Liquid crystalline polymer (LCP) substrates offer a number of advantages for high-density packaging. These properties include high temperature capability (>250oC),low coefficient of thermal exp
.. weiterlesen
The Era of the 3-D System In Package (SIP) will be Ushered in by Japanese Mobile Phones
It is becoming impossible to realize the latest mobile phones and other mobile equipment without Chip Size Packages (CSP) and other high-density semiconductor package technology. At present,the
.. weiterlesen
Yield Enhancement in BGA Substrates and Packaging
The growing use of high density interconnect (HDI) substrates in the microelectronics packaging industry has brought along a broad range of yield issues. Many of these issues are associated wit
.. weiterlesen
The Evolution of Any Layer IVH Structure PWB
With the advent of digitisation,networking,broadband telecommunication,and miniaturization in electronic set products,electronic devices are essentially required to deliver high electrical and
.. weiterlesen
Copper Foil Technology for High-Frequency Applications
Advances in information/communications technology are transforming the Internet from a medium for searching for information into a medium for providing and receiving various types of informatio
.. weiterlesen
Material Properties of LCP Film and its Broad Applications in IT-Related Devices
All-aromatic polyester,one of the super engineering plastics,is highly regarded as a base material of electronic circuit for its environmental compatibility,moisture resistance,dimensional stab
.. weiterlesen
The Electronic Considerations of Embedded Passive Components in Optical PCB Fabrication
The current technology includes transmission of between optical units (typically modulated laser sender and receiver units) and fiber optic cables or flexible kapton fiber optic cables with whi
.. weiterlesen
Manufacturing Embedded Resistors
Increasing component density and the requirements of higher performance electronic devices are driving the development of embedded passive devices in the printed circuit board (PCB). The benefi
.. weiterlesen
New Non-Reinforced Substrates for use as Embedded Capacitors
As CPUs increase in performance,the number of passive components on the surface of the boards are increasing dramatically. To reduce the number of components,as well as improve the electrical p
.. weiterlesen
Laser Ablation in the Interconnect Industry
The last 10 years have seen the rise of lasers used in the interconnect industry to a point where their use is almost becoming ‘main stream’. As line width and spacing requirements become small
.. weiterlesen
Development of High Density and High Frequency Substrate Using B^2it Technology for Next Generation Packaging
For faster,smaller,and high performance integrated circuits the new concept of buried bump interconnect substrates is required. We have developed B2itTM (buried bump interconnection technology
.. weiterlesen
Microvia Drilling Technology
The need for the high density provided by Build-up PWB installed in the mobile communication products requires the general trend towards a gradually smaller hole diameter. For the micro via dri
.. weiterlesen
A New Technology for the Inspection of Contaminant Residues from the Formation of PCB Microvias
The evolution of interconnection systems for Printed Circuit Boards has been extremely interesting. The first connections were those generated in a copper foil on the surface of a single sided
.. weiterlesen
Solid,Reliable and Planar Microvias Using (Mostly) Conventional Multilayer PCB Technology
Despite the strong increase in demand for high-density circuit boards,very few manufacturers are offering microvia architectures in high volume. Current microvia technologies require significan
.. weiterlesen
Microvia PWB's Qualified for Avionics,Microvias Can Enhance PWB Reliability
Laser-drilled microvias are being added to the list of approved technologies for printed wiring boards destined for use in a rapidly increasing number of application types and environments. Mic
.. weiterlesen
Programming Considerations in Complex Wave Form Pulse Reverse Plating: Part 1,Developing the Tool
With the advent of more flexible versions of pulse-reverse plating technologies,and with the ability to program more of the waveform parameters,comes an increased number of options facing the u
.. weiterlesen
Folded-Flex and Stacked CSP,the 3D Solution for SiP Applications
The multiple die chip-scale package technology (identified as the ?Z™) is a truly innovative,folded-flex stacked packaging technology. The concept has already been proven in a collaborative dev
.. weiterlesen
Programming Considerations in Complex Wave Form Pulse Reverse Plating: Part 1,Developing the Tool
With the advent of more flexible versions of pulse-reverse plating technologies,and with the ability to program more of the waveform parameters,comes an increased number of options facing the u
.. weiterlesen
Overcoming Technical and Business Issues Associated with System in Package Adoption
In today's world of electronics the keywords are smaller,faster and cheaper. With more and more circuitry going onto existing circuit boards,the designers are searching for ways to contain this
.. weiterlesen
Advanced Packaging Using Liquid Crystalline Polymer (LCP) Substrates
Liquid crystalline polymer (LCP) substrates offer a number of advantages for high-density packaging. These properties include high temperature capability (>250oC),low coefficient of thermal exp
.. weiterlesen
The Era of the 3-D System In Package (SIP) will be Ushered in by Japanese Mobile Phones
It is becoming impossible to realize the latest mobile phones and other mobile equipment without Chip Size Packages (CSP) and other high-density semiconductor package technology. At present,the
.. weiterlesen
Yield Enhancement in BGA Substrates and Packaging
The growing use of high density interconnect (HDI) substrates in the microelectronics packaging industry has brought along a broad range of yield issues. Many of these issues are associated wit
.. weiterlesen
The Evolution of Any Layer IVH Structure PWB
With the advent of digitisation,networking,broadband telecommunication,and miniaturization in electronic set products,electronic devices are essentially required to deliver high electrical and
.. weiterlesen
Copper Foil Technology for High-Frequency Applications
Advances in information/communications technology are transforming the Internet from a medium for searching for information into a medium for providing and receiving various types of informatio
.. weiterlesen
Material Properties of LCP Film and its Broad Applications in IT-Related Devices
All-aromatic polyester,one of the super engineering plastics,is highly regarded as a base material of electronic circuit for its environmental compatibility,moisture resistance,dimensional stab
.. weiterlesen