Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
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Board Level Interconnect Reliability Assessment of High I/O BGA Packages
To meet the complex design requirements of the electronics industry,there is an increased need for large size high
I/O BGA packages. The size of these large BGA packages (up to 50 mm2 and 1157+
.. weiterlesen
Mechanical Reliability of Fine Pitch Packages for use in Server and Mobile Electronic Packages
In both the server and portable electronic markets,monotonic mechanical overstress has become a primary issue in
manufacturing and field usage. Appropriate test methods,including four point ben
.. weiterlesen
Selective Soldering Of Flexible Circuits Using Diode Lasers
The use of laser technology has found increasing applications in the electronics assembly industry. This non-contact
heating technique is ideal for components that require careful handling whic
.. weiterlesen
Robotic Selective Soldering,an Enabling Soldering Technique
Wave and reflow soldering are well known,successfully proven mass soldering techniques. They offer the ability to
solder printed circuit boards in high volumes quickly with low defect levels,pr
.. weiterlesen
New Challenges in Selective Soldering
Current circuit board designs,particularly those in telecommunications,are so densely populated that they do not
provide enough clearance between SMT components and through-hole components to a
.. weiterlesen
SMT Rework Machines – Capability,Repeatability and Verification of In-Service Performance
SMT rework machines are vital tools to many production engineers. They can be used to correct process errors and
repair test failures. They can also be used to service and upgrade products retu
.. weiterlesen
Flexible Rules Based Thermal Profiling for Surface Mount Rework
Surface Mount Rework systems have evolved into sophisticated thermal processing tools with the ability to
accurately mimic original reflow oven profiles at a localized rework site. Features suc
.. weiterlesen
Soldering Fluxes and the Repair Process
Wave soldering fluxes are currently used in hand soldering operations as a matter of course and with little
regard for flux deposition amounts. This use has led to the investigation of fluxes u
.. weiterlesen
A Self Assessment Software Tool for SMT Processes and Productivity Optimization
Numerous studies and anecdotal data suggest that most SMT assembly lines are not optimized. This situation is true
whether one looks at the individual processes,such as stencil printing or plac
.. weiterlesen
Using Heuristics to Identify Maverick Lots at In-Circuit Test
Yield and defect levels in the manufacturing of high-complexity and high-reliability Printed Circuit Board
Assemblies (PCBAs) are extremely sensitive to variations in the process,component qual
.. weiterlesen
Lessons Learned from the IPC-2501 Testbed Prototype Performance Test at a Motorola Factory
The IPC 2501 Web Service Definition for the exchange of XML data provides an XML middleware integration
environment that enables the deployment of IPC Computer Aided Manufacturing using XML (CA
.. weiterlesen
PCB Equipment Communication Standards Today and Tomorrow
All manufacturers in the printed circuit board (PCB) industry have experienced lack of reliability,maintenance,and
performance problems with their machines. These challenges decrease manufactur
.. weiterlesen
Advances in Shop Floor Equipment Communication Standards for Final Assembly and Packaging
The Final assembly and packaging area experiences similar integration issues as the Printed Wiring Board –
PWB manufacturing industry. Communications between production equipment is based on di
.. weiterlesen
Recent Developments in MSD Control
This paper discusses some of the new challenges
associated with MSD Control in PCB assembly
plants and offers a solution to reduce manufacturing
costs and improve quality by automating this cri
.. weiterlesen
Lead Free Reflow Process Control
All areas of manufacturing worldwide are impacted
by the lead free initiative; none more than the reflow
process. The higher melt temperatures and soak
duration of leadless solder formulas requ
.. weiterlesen
MSD Control in a High Reliability Production Environment
The Information and Electronic Warfare Systems
business of BAE SYSTEMS Information and
Electronic Systems Integration,Inc. (“BAE
SYSTEMS IEWS”),a subsidiary of BAE SYSTEMS
North America,is invo
.. weiterlesen
New Insights in Underfill Flow and Flip Chip Reliability
During the last years Flip Chip Technology has been widely accepted as a means for maximum miniaturization of
microelectronic assemblies. As an example the use of Flip Chips in advanced product
.. weiterlesen
Analytical Imaging Techniques for Hard Die Coated Assemblies
With the advent of hard die coated microelectronic assemblies; the ability to perform visual inspections for quality control
and failure analysis has been seriously hindered. Analysts have had
.. weiterlesen
HDPUG's Lead-Free Design,Materials and Process of High Density Packages
The High Density Packaging Users Group (HDPUG) has conducted a substantial study of solder joint reliability of
high-density packages using lead-free solder. The design,material,and assembly pr
.. weiterlesen
HDPUG's Design for Lead-Free Solder Joint Reliability of High-Density Packages
The lead-free solder-joint reliability of the high-density packages,256-pin PBGA (plastic ball grid array),388-pin
PBGA,and 1657-pin CCGA (ceramic column grid array),on PCB (printed circuit boa
.. weiterlesen
HDPUG's Reliability Testing and Data Analysis of High-Density Packages Lead-Free Solder Joints
Temperature cycling test and statistical analysis of various high-density packages on PCBs with SnCu HASL,NiAu,
and OSP finishes are investigated in this study. Emphasis is placed on the determ
.. weiterlesen
HDPUG's Failure Analysis of High-Density Packages’ Lead-Free Solder Joints
Failure analyses of the leadfree and SnPb solder joints of high-density packages such as the PBGA (plastic ball grid
array) and the CCGA (ceramic column grid array) soldered on SnCu HASL (hot-a
.. weiterlesen
Adhesiveless Copper on Polyimide Substrate with Nickel-Chromium Tiecoat
Adhesiveless copper on polyimide substrates are used extensively for high density,flexible circuit applications. A
typical construction includes the polyimide substrate,a thin vacuum deposited
.. weiterlesen
Advanced Conductive Adhesive for Interconnect of Solder/Sn-Terminated Components in Flexible Circuitry: A Case Study
Solder is used in polyimide-based flexible circuits for interconnect applications. But it cannot be used with polyester
and epoxy based substrates because of the low temperature tolerance of th
.. weiterlesen
An Alternate Oxide
A new oxide chemistry has been developed which
solves many of the annoying properties of the
currently available alternate oxides. The process is
simple to operate,even simpler to maintain,requ
.. weiterlesen
Application of Thermal Analysis Techniques to Determine Performance Entitlement of Base Materials through Assembly
Multiple soldering assembly steps are essentially
standard for PWBs based on current technologies and
needs. A variety of tests are currently in use to
evaluate the performance of finished PWBs
.. weiterlesen
Aqueous Base Compatible Waveguide Materials for Optical Interconnect Applications
There are a number of organic,inorganic,and hybrid inorganic waveguide materials that are currently being used for
a wide variety of optical interconnect applications. Depending upon the approa
.. weiterlesen
Automated Optical Inspection (AOI) - A Yield Management Solution for the High Density Interconnection (HDI) - Flexible Circuit Industry
The information age has arrived. A growing percentage of the Earth’s population now has access to pagers,cellular
phones,computers,personal digital assistants (PDA’s),and a host of other electr
.. weiterlesen
Benchmarking PCB Process Capability,Quality and Reliability Becomes a Reality
The IPC-PCQR2 (Process Capability,Quality and Relative Reliability) program has developed a library of process
capability panel designs,and a database that details the manufacturing capability,
.. weiterlesen
BGA Mounting Using Improved Solder Columns
BGAs are usually solder-reflowed on substrates,which are frequently made of a different material than that of the
BGAs,which results in a TCE Mismatch between the components. If such an assembl
.. weiterlesen
Board Level Interconnect Reliability Assessment of High I/O BGA Packages
To meet the complex design requirements of the electronics industry,there is an increased need for large size high
I/O BGA packages. The size of these large BGA packages (up to 50 mm2 and 1157+
.. weiterlesen
Mechanical Reliability of Fine Pitch Packages for use in Server and Mobile Electronic Packages
In both the server and portable electronic markets,monotonic mechanical overstress has become a primary issue in
manufacturing and field usage. Appropriate test methods,including four point ben
.. weiterlesen
Selective Soldering Of Flexible Circuits Using Diode Lasers
The use of laser technology has found increasing applications in the electronics assembly industry. This non-contact
heating technique is ideal for components that require careful handling whic
.. weiterlesen
Robotic Selective Soldering,an Enabling Soldering Technique
Wave and reflow soldering are well known,successfully proven mass soldering techniques. They offer the ability to
solder printed circuit boards in high volumes quickly with low defect levels,pr
.. weiterlesen
New Challenges in Selective Soldering
Current circuit board designs,particularly those in telecommunications,are so densely populated that they do not
provide enough clearance between SMT components and through-hole components to a
.. weiterlesen
SMT Rework Machines – Capability,Repeatability and Verification of In-Service Performance
SMT rework machines are vital tools to many production engineers. They can be used to correct process errors and
repair test failures. They can also be used to service and upgrade products retu
.. weiterlesen
Flexible Rules Based Thermal Profiling for Surface Mount Rework
Surface Mount Rework systems have evolved into sophisticated thermal processing tools with the ability to
accurately mimic original reflow oven profiles at a localized rework site. Features suc
.. weiterlesen
Soldering Fluxes and the Repair Process
Wave soldering fluxes are currently used in hand soldering operations as a matter of course and with little
regard for flux deposition amounts. This use has led to the investigation of fluxes u
.. weiterlesen
A Self Assessment Software Tool for SMT Processes and Productivity Optimization
Numerous studies and anecdotal data suggest that most SMT assembly lines are not optimized. This situation is true
whether one looks at the individual processes,such as stencil printing or plac
.. weiterlesen
Using Heuristics to Identify Maverick Lots at In-Circuit Test
Yield and defect levels in the manufacturing of high-complexity and high-reliability Printed Circuit Board
Assemblies (PCBAs) are extremely sensitive to variations in the process,component qual
.. weiterlesen
Lessons Learned from the IPC-2501 Testbed Prototype Performance Test at a Motorola Factory
The IPC 2501 Web Service Definition for the exchange of XML data provides an XML middleware integration
environment that enables the deployment of IPC Computer Aided Manufacturing using XML (CA
.. weiterlesen
PCB Equipment Communication Standards Today and Tomorrow
All manufacturers in the printed circuit board (PCB) industry have experienced lack of reliability,maintenance,and
performance problems with their machines. These challenges decrease manufactur
.. weiterlesen
Advances in Shop Floor Equipment Communication Standards for Final Assembly and Packaging
The Final assembly and packaging area experiences similar integration issues as the Printed Wiring Board –
PWB manufacturing industry. Communications between production equipment is based on di
.. weiterlesen
Recent Developments in MSD Control
This paper discusses some of the new challenges
associated with MSD Control in PCB assembly
plants and offers a solution to reduce manufacturing
costs and improve quality by automating this cri
.. weiterlesen
Lead Free Reflow Process Control
All areas of manufacturing worldwide are impacted
by the lead free initiative; none more than the reflow
process. The higher melt temperatures and soak
duration of leadless solder formulas requ
.. weiterlesen
MSD Control in a High Reliability Production Environment
The Information and Electronic Warfare Systems
business of BAE SYSTEMS Information and
Electronic Systems Integration,Inc. (“BAE
SYSTEMS IEWS”),a subsidiary of BAE SYSTEMS
North America,is invo
.. weiterlesen
New Insights in Underfill Flow and Flip Chip Reliability
During the last years Flip Chip Technology has been widely accepted as a means for maximum miniaturization of
microelectronic assemblies. As an example the use of Flip Chips in advanced product
.. weiterlesen
Analytical Imaging Techniques for Hard Die Coated Assemblies
With the advent of hard die coated microelectronic assemblies; the ability to perform visual inspections for quality control
and failure analysis has been seriously hindered. Analysts have had
.. weiterlesen
HDPUG's Lead-Free Design,Materials and Process of High Density Packages
The High Density Packaging Users Group (HDPUG) has conducted a substantial study of solder joint reliability of
high-density packages using lead-free solder. The design,material,and assembly pr
.. weiterlesen
HDPUG's Design for Lead-Free Solder Joint Reliability of High-Density Packages
The lead-free solder-joint reliability of the high-density packages,256-pin PBGA (plastic ball grid array),388-pin
PBGA,and 1657-pin CCGA (ceramic column grid array),on PCB (printed circuit boa
.. weiterlesen
HDPUG's Reliability Testing and Data Analysis of High-Density Packages Lead-Free Solder Joints
Temperature cycling test and statistical analysis of various high-density packages on PCBs with SnCu HASL,NiAu,
and OSP finishes are investigated in this study. Emphasis is placed on the determ
.. weiterlesen
HDPUG's Failure Analysis of High-Density Packages’ Lead-Free Solder Joints
Failure analyses of the leadfree and SnPb solder joints of high-density packages such as the PBGA (plastic ball grid
array) and the CCGA (ceramic column grid array) soldered on SnCu HASL (hot-a
.. weiterlesen
Adhesiveless Copper on Polyimide Substrate with Nickel-Chromium Tiecoat
Adhesiveless copper on polyimide substrates are used extensively for high density,flexible circuit applications. A
typical construction includes the polyimide substrate,a thin vacuum deposited
.. weiterlesen
Advanced Conductive Adhesive for Interconnect of Solder/Sn-Terminated Components in Flexible Circuitry: A Case Study
Solder is used in polyimide-based flexible circuits for interconnect applications. But it cannot be used with polyester
and epoxy based substrates because of the low temperature tolerance of th
.. weiterlesen
An Alternate Oxide
A new oxide chemistry has been developed which
solves many of the annoying properties of the
currently available alternate oxides. The process is
simple to operate,even simpler to maintain,requ
.. weiterlesen
Application of Thermal Analysis Techniques to Determine Performance Entitlement of Base Materials through Assembly
Multiple soldering assembly steps are essentially
standard for PWBs based on current technologies and
needs. A variety of tests are currently in use to
evaluate the performance of finished PWBs
.. weiterlesen
Aqueous Base Compatible Waveguide Materials for Optical Interconnect Applications
There are a number of organic,inorganic,and hybrid inorganic waveguide materials that are currently being used for
a wide variety of optical interconnect applications. Depending upon the approa
.. weiterlesen
Automated Optical Inspection (AOI) - A Yield Management Solution for the High Density Interconnection (HDI) - Flexible Circuit Industry
The information age has arrived. A growing percentage of the Earth’s population now has access to pagers,cellular
phones,computers,personal digital assistants (PDA’s),and a host of other electr
.. weiterlesen
Benchmarking PCB Process Capability,Quality and Reliability Becomes a Reality
The IPC-PCQR2 (Process Capability,Quality and Relative Reliability) program has developed a library of process
capability panel designs,and a database that details the manufacturing capability,
.. weiterlesen
BGA Mounting Using Improved Solder Columns
BGAs are usually solder-reflowed on substrates,which are frequently made of a different material than that of the
BGAs,which results in a TCE Mismatch between the components. If such an assembl
.. weiterlesen