Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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A Technique for Improving the Yields of Fine Feature Prints
A technique that enhances the release of solder paste from stencils during the print process has been developed. The
technique is based on applying variable high frequency and low amplitude vib
.. weiterlesen
The Bumping of Wafer Level Packages
The relentless trend for smaller,lighter,cheaper consumer products continues to fuel the demand for new,smaller,
efficient electronic packages. In recent years wafer level packaging concepts ha
.. weiterlesen
Optimization Study for Solder Pastes Used in Wafer Bumping Applications
Solder paste for use in wafer bumping applications is becoming an extremely viable technology. Yields from solder
paste printing applications are approaching that of typical bumping technologie
.. weiterlesen
Optimizing the Supply Chain with Returnable Packaging: Solutions to Improve Profitability in the Electronics Industry
In the complex electronics industry,supply chain costs can have a major impact on a company’s profitability. Like
the industrial supply chain,where costs are estimated to account for as much as
.. weiterlesen
Stencil Printing Studies
Today’s SMT assemblies are being driven toward SMD’s with higher lead densities as well as smaller packages.
This places additional performance requirements on the printing process. The stencil
.. weiterlesen
Defining Solder Paste Performance via Novel Quantitative Methods
Quantitative solder paste performance or use testing enables material formulators to focus on and maximize key
material traits such as wettability and printability. These same material test met
.. weiterlesen
Print Process Characterization for Fine Pitch Area Array Packages using Taguchi Techniques
The trend in electronics packaging towards product miniaturization,has forced the industry to use fine pitch area
array packages instead of fine pitch leaded packages. These area array packages
.. weiterlesen
Qualification of Solder Beading and Tombstoning in Passive Devices using Designed Experiments
Solder beading and tombstoning are observed increasingly with chip components as their size decreases. This is
even more crucial in today’s packaging,due to the high ratio of passive components
.. weiterlesen
A Materials Based Solution for the Elimination of Tombstones
The drive for electronic devices to become lightweight,more portable,and posses increased functionality has driven
electronic components to smaller and smaller sizes. This decease in size does
.. weiterlesen
Evaluating the Use of Next Generation Reflow Profile Control for High Volume Electronics Manufacturing
In recent years,technological advances in electronics manufacturing have allowed high volume manufacturers to
significantly improve process control and documentation. Manufacturers have acceler
.. weiterlesen
Extending the Power of Boundary-Scan: System-Level Testing
Boundary-scan has achieved many of the goals envisioned by its original architects and today is in use in thousands
of production facilities around the world to test complex digital printed cir
.. weiterlesen
A Boundary-Scan Infrastructure for Linking Design and Manufacturing Test
This paper will discuss:
a. Boundary scan as a key test tool that enables the leveraged test approach
b. The advantages of standardizing and reusing design verification tests and PLD programs i
.. weiterlesen
Investigation of the Effectiveness of Automated X-ray Inspection Systems in a High Volume – Low Mix SMT Line
The advent of miniature surface mount components coupled with increasing lead counts has posed tremendous
challenges during assembly. This is especially true in an Electronics Manufacturing Ser
.. weiterlesen
Comparison of X-ray Inspection Systems for BGA/CCGA Quality Assurance and Crack Detection
For high reliability applications,the use of x-ray technique has become an additional inspection requirement for
quality control and detection of unique defects due to manufacturing of advanced
.. weiterlesen
A Case Study of In-Process Inspection Methods to Improve First Pass Yields
The electronics content of many consumer products has increased substantially over the past decade. Several of the
electronics added to the automobile control vehicle functions that have a dire
.. weiterlesen
Management of DPMO Metrics Reduces the Cost of PCB Assembly
Manufacturers can use DPMO metrics to reduce the cost of PCB assembly with fewer resources. DPMO data can be
used for predicting the fault spectrum on future products,quoting new business,setti
.. weiterlesen
Increasing Operating Margins in a Down Economy: Case Studies in SMT Production Monitoring Software & Applications
Shrinking profits and overcapacity have forced Electronics Manufacturers to squeeze every last penny out of Site
Operations. To reduce conversion costs in a short timeframe,some facilities have
.. weiterlesen
Manufacturing Process Management – Facilitating Stage 3 of Manufacturing Outsourcing
The slowdown in the electronics industry has allowed the management of electronics products manufacturers to
dedicate time to reconsider their manufacturing strategy. For most of these companie
.. weiterlesen
Increased Productivity in X-ray Inspection – The Role of ADR Technology
The economic environment in the electronics
industry has changed dramatically over the last two
years. The focus on the production floor has moved
from increasing capacity to improving the yiel
.. weiterlesen
Biologically Inspired Vision Makes for Smarter PCBA Manufacturing Technology - New Technologies Overcome Fundamental Limitations of Conventional Optical Inspection Methods
For test engineers and managers,automated optical
inspection (AOI) systems have emerged as a
countermeasure to the growing threats of lost
physical or electrical access to assembled PCB. AOI
sy
.. weiterlesen
2D Off-line X-ray Inspection in the SMT Production Line: Working Towards the Zero-Defect Goal
The goal of SMT production is a zero-defect process in which flawed materials never get to the customer; however,
in the ideal scenario,zero-defect production would mean that no flawed products
.. weiterlesen
Practical Implementation of Lead-Free Soldering The Experience of the Japanese Electronics Industry
With the US military now committed to the phasing
out of lead-containing solders via the Joint Group on
Pollution Prevention (JG-PP) the electronics industry
has moved beyond debate about wheth
.. weiterlesen
Robust Optimization of a Lead Free SMT Process
This paper will focus on Dr. Taguchi’s Robust Engineering methodology,measurement methods and experimental
results for the optimization of a lead free SMT process for use in an Automotive Elect
.. weiterlesen
Reduction of Hazardous Substances vs. Recycling
Much of the environmental emphasis is currently on elimination of undesirable elements and compounds such as
lead or halogens. The unintended consequences are huge in terms of diversion of reso
.. weiterlesen
Assessing Circuit Pack Design and Assembly for Environmental Performance and Sustainability
Circuit pack assembly involves the use of numerous materials and processes of environmental concern,including
electronic components and associated assembly operations. It is necessary to be abl
.. weiterlesen
Life-Cycle Comparison of Energy Use during the Application of Lead-Free Solders
The energy consumed during the reflow assembly of printed wiring board assemblies is expected to be environmentally
significant within the solder product life-cycle. Wide differences in the mel
.. weiterlesen
Solder Joint Thermal Fatigue Damage Evaluation by a Simplified Method
In the present study,a simplified analysis methodology is used to evaluate thermal fatigue damage of solder joints of
a leadless ceramic chip carrier (LCCC) or a leadless chip capacitor/resisto
.. weiterlesen
An Efficient Test Model to Study the Board Level Reliability For High I/O Flip Chip BGA Packages
With the increasing demands of complex functions in a single chipset or microprocessor,the development of large
size high I/O Flip Chip BGA (FCBGA) package becomes very important in recent year
.. weiterlesen
Solderability Testing Methodologies for BGA Packages
Solderability testing is carried out at the IC (Integrated Circuit) manufacturer’s end to evaluate the quality of the IC
package terminals in terms of solder wetting ability. Current industrial
.. weiterlesen
Implementation of High I/O Count 1mm Pitch BGA Technology
Electronic package size reduction and demand for increased functions within less board space make a challenge for
the PCB designer to find smaller footprint components that will out perform lar
.. weiterlesen
A Technique for Improving the Yields of Fine Feature Prints
A technique that enhances the release of solder paste from stencils during the print process has been developed. The
technique is based on applying variable high frequency and low amplitude vib
.. weiterlesen
The Bumping of Wafer Level Packages
The relentless trend for smaller,lighter,cheaper consumer products continues to fuel the demand for new,smaller,
efficient electronic packages. In recent years wafer level packaging concepts ha
.. weiterlesen
Optimization Study for Solder Pastes Used in Wafer Bumping Applications
Solder paste for use in wafer bumping applications is becoming an extremely viable technology. Yields from solder
paste printing applications are approaching that of typical bumping technologie
.. weiterlesen
Optimizing the Supply Chain with Returnable Packaging: Solutions to Improve Profitability in the Electronics Industry
In the complex electronics industry,supply chain costs can have a major impact on a company’s profitability. Like
the industrial supply chain,where costs are estimated to account for as much as
.. weiterlesen
Stencil Printing Studies
Today’s SMT assemblies are being driven toward SMD’s with higher lead densities as well as smaller packages.
This places additional performance requirements on the printing process. The stencil
.. weiterlesen
Defining Solder Paste Performance via Novel Quantitative Methods
Quantitative solder paste performance or use testing enables material formulators to focus on and maximize key
material traits such as wettability and printability. These same material test met
.. weiterlesen
Print Process Characterization for Fine Pitch Area Array Packages using Taguchi Techniques
The trend in electronics packaging towards product miniaturization,has forced the industry to use fine pitch area
array packages instead of fine pitch leaded packages. These area array packages
.. weiterlesen
Qualification of Solder Beading and Tombstoning in Passive Devices using Designed Experiments
Solder beading and tombstoning are observed increasingly with chip components as their size decreases. This is
even more crucial in today’s packaging,due to the high ratio of passive components
.. weiterlesen
A Materials Based Solution for the Elimination of Tombstones
The drive for electronic devices to become lightweight,more portable,and posses increased functionality has driven
electronic components to smaller and smaller sizes. This decease in size does
.. weiterlesen
Evaluating the Use of Next Generation Reflow Profile Control for High Volume Electronics Manufacturing
In recent years,technological advances in electronics manufacturing have allowed high volume manufacturers to
significantly improve process control and documentation. Manufacturers have acceler
.. weiterlesen
Extending the Power of Boundary-Scan: System-Level Testing
Boundary-scan has achieved many of the goals envisioned by its original architects and today is in use in thousands
of production facilities around the world to test complex digital printed cir
.. weiterlesen
A Boundary-Scan Infrastructure for Linking Design and Manufacturing Test
This paper will discuss:
a. Boundary scan as a key test tool that enables the leveraged test approach
b. The advantages of standardizing and reusing design verification tests and PLD programs i
.. weiterlesen
Investigation of the Effectiveness of Automated X-ray Inspection Systems in a High Volume – Low Mix SMT Line
The advent of miniature surface mount components coupled with increasing lead counts has posed tremendous
challenges during assembly. This is especially true in an Electronics Manufacturing Ser
.. weiterlesen
Comparison of X-ray Inspection Systems for BGA/CCGA Quality Assurance and Crack Detection
For high reliability applications,the use of x-ray technique has become an additional inspection requirement for
quality control and detection of unique defects due to manufacturing of advanced
.. weiterlesen
A Case Study of In-Process Inspection Methods to Improve First Pass Yields
The electronics content of many consumer products has increased substantially over the past decade. Several of the
electronics added to the automobile control vehicle functions that have a dire
.. weiterlesen
Management of DPMO Metrics Reduces the Cost of PCB Assembly
Manufacturers can use DPMO metrics to reduce the cost of PCB assembly with fewer resources. DPMO data can be
used for predicting the fault spectrum on future products,quoting new business,setti
.. weiterlesen
Increasing Operating Margins in a Down Economy: Case Studies in SMT Production Monitoring Software & Applications
Shrinking profits and overcapacity have forced Electronics Manufacturers to squeeze every last penny out of Site
Operations. To reduce conversion costs in a short timeframe,some facilities have
.. weiterlesen
Manufacturing Process Management – Facilitating Stage 3 of Manufacturing Outsourcing
The slowdown in the electronics industry has allowed the management of electronics products manufacturers to
dedicate time to reconsider their manufacturing strategy. For most of these companie
.. weiterlesen
Increased Productivity in X-ray Inspection – The Role of ADR Technology
The economic environment in the electronics
industry has changed dramatically over the last two
years. The focus on the production floor has moved
from increasing capacity to improving the yiel
.. weiterlesen
Biologically Inspired Vision Makes for Smarter PCBA Manufacturing Technology - New Technologies Overcome Fundamental Limitations of Conventional Optical Inspection Methods
For test engineers and managers,automated optical
inspection (AOI) systems have emerged as a
countermeasure to the growing threats of lost
physical or electrical access to assembled PCB. AOI
sy
.. weiterlesen
2D Off-line X-ray Inspection in the SMT Production Line: Working Towards the Zero-Defect Goal
The goal of SMT production is a zero-defect process in which flawed materials never get to the customer; however,
in the ideal scenario,zero-defect production would mean that no flawed products
.. weiterlesen
Practical Implementation of Lead-Free Soldering The Experience of the Japanese Electronics Industry
With the US military now committed to the phasing
out of lead-containing solders via the Joint Group on
Pollution Prevention (JG-PP) the electronics industry
has moved beyond debate about wheth
.. weiterlesen
Robust Optimization of a Lead Free SMT Process
This paper will focus on Dr. Taguchi’s Robust Engineering methodology,measurement methods and experimental
results for the optimization of a lead free SMT process for use in an Automotive Elect
.. weiterlesen
Reduction of Hazardous Substances vs. Recycling
Much of the environmental emphasis is currently on elimination of undesirable elements and compounds such as
lead or halogens. The unintended consequences are huge in terms of diversion of reso
.. weiterlesen
Assessing Circuit Pack Design and Assembly for Environmental Performance and Sustainability
Circuit pack assembly involves the use of numerous materials and processes of environmental concern,including
electronic components and associated assembly operations. It is necessary to be abl
.. weiterlesen
Life-Cycle Comparison of Energy Use during the Application of Lead-Free Solders
The energy consumed during the reflow assembly of printed wiring board assemblies is expected to be environmentally
significant within the solder product life-cycle. Wide differences in the mel
.. weiterlesen
Solder Joint Thermal Fatigue Damage Evaluation by a Simplified Method
In the present study,a simplified analysis methodology is used to evaluate thermal fatigue damage of solder joints of
a leadless ceramic chip carrier (LCCC) or a leadless chip capacitor/resisto
.. weiterlesen
An Efficient Test Model to Study the Board Level Reliability For High I/O Flip Chip BGA Packages
With the increasing demands of complex functions in a single chipset or microprocessor,the development of large
size high I/O Flip Chip BGA (FCBGA) package becomes very important in recent year
.. weiterlesen
Solderability Testing Methodologies for BGA Packages
Solderability testing is carried out at the IC (Integrated Circuit) manufacturer’s end to evaluate the quality of the IC
package terminals in terms of solder wetting ability. Current industrial
.. weiterlesen
Implementation of High I/O Count 1mm Pitch BGA Technology
Electronic package size reduction and demand for increased functions within less board space make a challenge for
the PCB designer to find smaller footprint components that will out perform lar
.. weiterlesen