Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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The Advanced NiAu-Process for Second Image Technology
Designs of new electronic products show a significant drive for smaller and more complex PWBs. This continuing trend of miniaturization affects components in the same way as for the connecting
.. weiterlesen
Beyond Periodic Pulse Reverse
According to Michael Shernerof of Scientific American (Jan. 2002) technology has advanced more in the past one century than in the previous one hundred centuries. Yet it seems from a technical
.. weiterlesen
Board Finishes for the EMS Provider
Some new alternative PWB surface finishes have been entering the industry over the past few years. In order for any
new board surface finish to be accepted for general use,it must be approved b
.. weiterlesen
Breaking the Information Bottleneck in Printed Circuit Board Engineering Teams: The Promise of New Software Innovation
This paper addresses the challenges of pre-production engineering,why the engineering department is viewed as a
bottleneck in many PCB companies,and how a dedicated software system breaks the i
.. weiterlesen
Component Damage from Printed Circuit Board Loading
Electronic components are being used in increasingly more severe shock environments. This combined with an
industry trend of increased component reliability to help reduce electronic system dow
.. weiterlesen
Conductive Anodic Filament Growth Failure
With increasing focus on reliability and miniaturized designs,Conductive Anodic Filament (CAF) as failure
mechanism is gaining a lot of attention. Smaller geometries make the printed circuit bo
.. weiterlesen
Conductive Anodic Filament Resistant FR-4 Substrates
As the trend to increased interconnection density continues,conductive printed circuit board features become closer and closer together. It is now common to see 3 mil lines and spaces on local
.. weiterlesen
Controlled Surface Etching Process for Fine Line/Space Circuits
The design rule of PWBs and substrates for plastic packages is moving towards higher density as semiconductor
chip design evolves into increasingly finer lines. First,it was studied how fine th
.. weiterlesen
Cost Effects of Pulse Plating Reversal Current
Direct Current plating in acid copper baths containing organic supplements shows us that during electrolysis,these organic additives are attracted by the copper anode and being adsorbed on its
.. weiterlesen
Cost-Effective Laminate Materials Made by Continuous Lamination Using Thermosetting Polymer Alloys (TPA) for Microwave and High Speed Applications
Utilizing continuous lamination techniques,new materials are being developed to meet demanding market
requirements. Laminates produced using Thermosetting Polymer Alloys (TPA) are cost effectiv
.. weiterlesen
Defining Accelerated Test Requirements for PWBs: A Physics-Based Approach
Typically thermal cycle test requirements for printed wiring boards (PWBs) are somewhat arbitrarily established for
a particular product. Many programs simply default to a standard test without
.. weiterlesen
Design Considerations Affecting the Measured Capacitance of Embedded Singulated Capacitors
The physical placement of embedded singulated capacitors in relation to one another and to other board structures could have an impact on the measured capacitance of individual capacitors. For
.. weiterlesen
Developmental Halogen-Free High Performance Dielectric Substrates (with Different Reinforcement Supports) for the PCB/HDI and High-Frequency Applications
This paper presents a comparison of several resin systems on different support reinforcements including on
Thermount®1 (or NWA),E-Glass (or E),and NE-Glass2 (SITM) (or NE). The resin systems co
.. weiterlesen
Digital Printing Systems for Printed Circuit Board Legends
The development of digital printing systems for printed circuit board legends (a.k.a. nomenclature,indent or letter
screening) is a major technological leap. Legend marking on printed circuit b
.. weiterlesen
Direct Laser Drillable Ultra Thin Copper Foils for Advanced PCB Manufacture
The demand for small packaging for portable electronic equipment and reduced chip form factor with higher interconnect fan-out,is driving printed circuit substrate technology rapidly forward. T
.. weiterlesen
Dry Film Resist Stripping from Overplated Lines
The ideal outer layer has a uniform circuit height throughout the board. This is a challenge to produce with pattern
plating,because the plated metal height depends on the current density,which
.. weiterlesen
The Effect of Etch Taper,Prepreg and Resin Flow of the Value of the Differential Impedance
Many printed circuit board manufacturers report that the measured value of the differential impedance is a few ohms greater than the calculated value when the substrate is FR4. There may be sev
.. weiterlesen
Electrically Mediated Pulse Reverse Copper Plating of Electronic Interconnects without Brighteners/Levelers
This paper describes a process for plating of interconnects for advanced electronic modules. In contrast to traditional
chemical mediation of plating processes,this process is electrically medi
.. weiterlesen
Electrochemical Migration Testing Results - Evaluating PWB Design,Manufacturing Process,and Laminate Material Impacts on CAF Resistance
Various requirements have developed for printed wiring boards regarding the minimum spacing between features.
Creepage distances per UL-60950 call out 1.2mm for voltages up to 50v,and call out
.. weiterlesen
Embedded Ceramic Resistors and Capacitors in PWB-Process and Design
Design and processing of ceramic resistors and capacitors fired onto copper foil and embedded into FR4 circuit
boards are presented and discussed. Evolution of design guidelines and processing
.. weiterlesen
Embedded Mezzanine Capacitor Technology for Printed Wiring Boards
A novel technology for embedding discrete capacitors in a mezzanine layer of an HDI PWB was developed and
implemented by Motorola in partnership with its PWB supply chain. The technology is bas
.. weiterlesen
Embedded Optical Fiber
The power attenuation of the optical fiber due to bends is investigated for the feasibility of the integration optical
fiber into PCBs.
.. weiterlesen
Embedded Passives Technology Implementation in RF Applications
Motorola has developed a suite of technologies for embedding resistors,inductors,and capacitors in HDI printed
wiring boards. This paper describes the technology and presents a case study demon
.. weiterlesen
Experimental and Numerical Assessment of Plated Via Reliability
This paper discusses two typical PTH failures – barrel cracking and post separation – induced by accelerated testing
or observed during manufacturing. Finite element models have been developed
.. weiterlesen
An FEA Study of Image Transfer in Printed Wiring Boards
A concern in the manufacture of laminate PWB’s is the transfer of interior circuit patterns to the surface of the
board. This can lead to difficulties in forming the external circuitry. Typical
.. weiterlesen
Full-Wave Electromagnetic Simulation of PWB Structures
Because high performance products are limited in speed by packaging and interconnections,signal integrity analysis
and PWB simulation become nowadays very pressing and key issues. Taking into a
.. weiterlesen
HID's Technology Influence on Signal Integrity
Highs Density Interconnects (HDI) printed circuits are now being designed in ever increasing quantities. HDI brings
some interesting new solutions to age-old signal integrity (SI) concerns,and
.. weiterlesen
Implementation of Embedded Resistor Trimming for PWB Manufacturing
In the Printed Wiring Board (PWB) industry,the growing demand for a higher number of circuit components to be
contained in smaller circuit areas requires that some of the passive components (re
.. weiterlesen
Improving Yield and Profitability with Laser Drilled Blind Microvias
Laser drilling has clearly captured the technology lead in the formation of HDI microvias with a 78% ownership,1
currently dominating over photo defined,plasma etched and mechanically drilled m
.. weiterlesen
The Influence of Fluid Dynamics on Plating Electrolyte for the Successful Production of Blind Micro-Vias: Laboratory Investigations Leading to Optimized...
Successful copper plating of blind micro-vias is very strongly dependant on the effective mass transport of copper
ions into the vias. This mass transport limitation is demonstrated by a rough
.. weiterlesen
The Advanced NiAu-Process for Second Image Technology
Designs of new electronic products show a significant drive for smaller and more complex PWBs. This continuing trend of miniaturization affects components in the same way as for the connecting
.. weiterlesen
Beyond Periodic Pulse Reverse
According to Michael Shernerof of Scientific American (Jan. 2002) technology has advanced more in the past one century than in the previous one hundred centuries. Yet it seems from a technical
.. weiterlesen
Board Finishes for the EMS Provider
Some new alternative PWB surface finishes have been entering the industry over the past few years. In order for any
new board surface finish to be accepted for general use,it must be approved b
.. weiterlesen
Breaking the Information Bottleneck in Printed Circuit Board Engineering Teams: The Promise of New Software Innovation
This paper addresses the challenges of pre-production engineering,why the engineering department is viewed as a
bottleneck in many PCB companies,and how a dedicated software system breaks the i
.. weiterlesen
Component Damage from Printed Circuit Board Loading
Electronic components are being used in increasingly more severe shock environments. This combined with an
industry trend of increased component reliability to help reduce electronic system dow
.. weiterlesen
Conductive Anodic Filament Growth Failure
With increasing focus on reliability and miniaturized designs,Conductive Anodic Filament (CAF) as failure
mechanism is gaining a lot of attention. Smaller geometries make the printed circuit bo
.. weiterlesen
Conductive Anodic Filament Resistant FR-4 Substrates
As the trend to increased interconnection density continues,conductive printed circuit board features become closer and closer together. It is now common to see 3 mil lines and spaces on local
.. weiterlesen
Controlled Surface Etching Process for Fine Line/Space Circuits
The design rule of PWBs and substrates for plastic packages is moving towards higher density as semiconductor
chip design evolves into increasingly finer lines. First,it was studied how fine th
.. weiterlesen
Cost Effects of Pulse Plating Reversal Current
Direct Current plating in acid copper baths containing organic supplements shows us that during electrolysis,these organic additives are attracted by the copper anode and being adsorbed on its
.. weiterlesen
Cost-Effective Laminate Materials Made by Continuous Lamination Using Thermosetting Polymer Alloys (TPA) for Microwave and High Speed Applications
Utilizing continuous lamination techniques,new materials are being developed to meet demanding market
requirements. Laminates produced using Thermosetting Polymer Alloys (TPA) are cost effectiv
.. weiterlesen
Defining Accelerated Test Requirements for PWBs: A Physics-Based Approach
Typically thermal cycle test requirements for printed wiring boards (PWBs) are somewhat arbitrarily established for
a particular product. Many programs simply default to a standard test without
.. weiterlesen
Design Considerations Affecting the Measured Capacitance of Embedded Singulated Capacitors
The physical placement of embedded singulated capacitors in relation to one another and to other board structures could have an impact on the measured capacitance of individual capacitors. For
.. weiterlesen
Developmental Halogen-Free High Performance Dielectric Substrates (with Different Reinforcement Supports) for the PCB/HDI and High-Frequency Applications
This paper presents a comparison of several resin systems on different support reinforcements including on
Thermount®1 (or NWA),E-Glass (or E),and NE-Glass2 (SITM) (or NE). The resin systems co
.. weiterlesen
Digital Printing Systems for Printed Circuit Board Legends
The development of digital printing systems for printed circuit board legends (a.k.a. nomenclature,indent or letter
screening) is a major technological leap. Legend marking on printed circuit b
.. weiterlesen
Direct Laser Drillable Ultra Thin Copper Foils for Advanced PCB Manufacture
The demand for small packaging for portable electronic equipment and reduced chip form factor with higher interconnect fan-out,is driving printed circuit substrate technology rapidly forward. T
.. weiterlesen
Dry Film Resist Stripping from Overplated Lines
The ideal outer layer has a uniform circuit height throughout the board. This is a challenge to produce with pattern
plating,because the plated metal height depends on the current density,which
.. weiterlesen
The Effect of Etch Taper,Prepreg and Resin Flow of the Value of the Differential Impedance
Many printed circuit board manufacturers report that the measured value of the differential impedance is a few ohms greater than the calculated value when the substrate is FR4. There may be sev
.. weiterlesen
Electrically Mediated Pulse Reverse Copper Plating of Electronic Interconnects without Brighteners/Levelers
This paper describes a process for plating of interconnects for advanced electronic modules. In contrast to traditional
chemical mediation of plating processes,this process is electrically medi
.. weiterlesen
Electrochemical Migration Testing Results - Evaluating PWB Design,Manufacturing Process,and Laminate Material Impacts on CAF Resistance
Various requirements have developed for printed wiring boards regarding the minimum spacing between features.
Creepage distances per UL-60950 call out 1.2mm for voltages up to 50v,and call out
.. weiterlesen
Embedded Ceramic Resistors and Capacitors in PWB-Process and Design
Design and processing of ceramic resistors and capacitors fired onto copper foil and embedded into FR4 circuit
boards are presented and discussed. Evolution of design guidelines and processing
.. weiterlesen
Embedded Mezzanine Capacitor Technology for Printed Wiring Boards
A novel technology for embedding discrete capacitors in a mezzanine layer of an HDI PWB was developed and
implemented by Motorola in partnership with its PWB supply chain. The technology is bas
.. weiterlesen
Embedded Optical Fiber
The power attenuation of the optical fiber due to bends is investigated for the feasibility of the integration optical
fiber into PCBs.
.. weiterlesen
Embedded Passives Technology Implementation in RF Applications
Motorola has developed a suite of technologies for embedding resistors,inductors,and capacitors in HDI printed
wiring boards. This paper describes the technology and presents a case study demon
.. weiterlesen
Experimental and Numerical Assessment of Plated Via Reliability
This paper discusses two typical PTH failures – barrel cracking and post separation – induced by accelerated testing
or observed during manufacturing. Finite element models have been developed
.. weiterlesen
An FEA Study of Image Transfer in Printed Wiring Boards
A concern in the manufacture of laminate PWB’s is the transfer of interior circuit patterns to the surface of the
board. This can lead to difficulties in forming the external circuitry. Typical
.. weiterlesen
Full-Wave Electromagnetic Simulation of PWB Structures
Because high performance products are limited in speed by packaging and interconnections,signal integrity analysis
and PWB simulation become nowadays very pressing and key issues. Taking into a
.. weiterlesen
HID's Technology Influence on Signal Integrity
Highs Density Interconnects (HDI) printed circuits are now being designed in ever increasing quantities. HDI brings
some interesting new solutions to age-old signal integrity (SI) concerns,and
.. weiterlesen
Implementation of Embedded Resistor Trimming for PWB Manufacturing
In the Printed Wiring Board (PWB) industry,the growing demand for a higher number of circuit components to be
contained in smaller circuit areas requires that some of the passive components (re
.. weiterlesen
Improving Yield and Profitability with Laser Drilled Blind Microvias
Laser drilling has clearly captured the technology lead in the formation of HDI microvias with a 78% ownership,1
currently dominating over photo defined,plasma etched and mechanically drilled m
.. weiterlesen
The Influence of Fluid Dynamics on Plating Electrolyte for the Successful Production of Blind Micro-Vias: Laboratory Investigations Leading to Optimized...
Successful copper plating of blind micro-vias is very strongly dependant on the effective mass transport of copper
ions into the vias. This mass transport limitation is demonstrated by a rough
.. weiterlesen