Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Programming Considerations in Complex Wave Form Pulse Reverse Plating: Part 1,Developing the Tool
With the advent of more flexible versions of pulse-reverse plating technologies,and with the ability to program more of the waveform parameters,comes an increased number of options facing the u
.. weiterlesen
Folded-Flex and Stacked CSP,the 3D Solution for SiP Applications
The multiple die chip-scale package technology (identified as the ?Z™) is a truly innovative,folded-flex stacked packaging technology. The concept has already been proven in a collaborative dev
.. weiterlesen
Programming Considerations in Complex Wave Form Pulse Reverse Plating: Part 1,Developing the Tool
With the advent of more flexible versions of pulse-reverse plating technologies,and with the ability to program more of the waveform parameters,comes an increased number of options facing the u
.. weiterlesen
Overcoming Technical and Business Issues Associated with System in Package Adoption
In today's world of electronics the keywords are smaller,faster and cheaper. With more and more circuitry going onto existing circuit boards,the designers are searching for ways to contain this
.. weiterlesen
Advanced Packaging Using Liquid Crystalline Polymer (LCP) Substrates
Liquid crystalline polymer (LCP) substrates offer a number of advantages for high-density packaging. These properties include high temperature capability (>250oC),low coefficient of thermal exp
.. weiterlesen
The Era of the 3-D System In Package (SIP) will be Ushered in by Japanese Mobile Phones
It is becoming impossible to realize the latest mobile phones and other mobile equipment without Chip Size Packages (CSP) and other high-density semiconductor package technology. At present,the
.. weiterlesen
Yield Enhancement in BGA Substrates and Packaging
The growing use of high density interconnect (HDI) substrates in the microelectronics packaging industry has brought along a broad range of yield issues. Many of these issues are associated wit
.. weiterlesen
The Evolution of Any Layer IVH Structure PWB
With the advent of digitisation,networking,broadband telecommunication,and miniaturization in electronic set products,electronic devices are essentially required to deliver high electrical and
.. weiterlesen
Copper Foil Technology for High-Frequency Applications
Advances in information/communications technology are transforming the Internet from a medium for searching for information into a medium for providing and receiving various types of informatio
.. weiterlesen
Material Properties of LCP Film and its Broad Applications in IT-Related Devices
All-aromatic polyester,one of the super engineering plastics,is highly regarded as a base material of electronic circuit for its environmental compatibility,moisture resistance,dimensional stab
.. weiterlesen
PTFE based Solutions for the Future of High Speed Digital
A growing need is developing in the high-speed digital arena (backpanels,motherboards,line cards etc) for materials offering sufficient signal integrity for applications up to 10 Gbps. One solu
.. weiterlesen
Manufacturing and Reliability Evaluation of a Lead-Free Electronics Network Card
Lead-free manufacturing is becoming an industry initiative for environmental and legislative reasons. Lead-Free processing is rather new to the industry and the development of a successful asse
.. weiterlesen
Design of Experiments to Assess the Solderability of Various Printed Wiring Board Finishes
There are two main driving forces that are causing the electronics industry to take a look at alternatives to hot air solder leveling (HASL) as a surface finish for printed wiring boards (PWB).
.. weiterlesen
Where Crystal Planes Meet: Contribution to the Understanding of the Tin Whisker Growth Process
The texture of a tin deposit has been described as a key factor influencing whisker growth. Based on X-ray diffraction (XRD) and whisker growth data,this paper intends to show one possible mech
.. weiterlesen
Microstructural Evolution and Damage Mechanisms in Pb-Free Solder Joints During Extended -40 Degrees C to 125 Degrees C Thermal Cycles
A comparative study of package-to-board interconnections of a 1.27mm pitch BGA package using two Pb-free alloys and Sn-Pb solder in extended –40 to 125°C thermal cycling is described. The micro
.. weiterlesen
Reliability and Failure Analysis of Lead-Free Solder Joints
This paper provides a comparison of the air-to-air thermal cyclic reliability and associated failure modes of second level interconnects in lead-free,1.27 mm pitch,256 I/O BGA devices with eute
.. weiterlesen
Accelerating Plating Cycles and Reducing Costs: Improving the Plating of High Aspect Ratio Holes & Blind Vias
This paper describes a new technology for speeding the initiation and uniformity of electroplating deposits that does
not depend on modifying the chemistry or physical environment of the platin
.. weiterlesen
Advanced Laminate and Prepreg for PWBs with Embedded Components
The technology for embedding components in PWBs will change the process how PWB are fabricated over the next
few years. At the present time,polymer thick film is the most frequently used materi
.. weiterlesen
Programming Considerations in Complex Wave Form Pulse Reverse Plating: Part 1,Developing the Tool
With the advent of more flexible versions of pulse-reverse plating technologies,and with the ability to program more of the waveform parameters,comes an increased number of options facing the u
.. weiterlesen
Folded-Flex and Stacked CSP,the 3D Solution for SiP Applications
The multiple die chip-scale package technology (identified as the ?Z™) is a truly innovative,folded-flex stacked packaging technology. The concept has already been proven in a collaborative dev
.. weiterlesen
Programming Considerations in Complex Wave Form Pulse Reverse Plating: Part 1,Developing the Tool
With the advent of more flexible versions of pulse-reverse plating technologies,and with the ability to program more of the waveform parameters,comes an increased number of options facing the u
.. weiterlesen
Overcoming Technical and Business Issues Associated with System in Package Adoption
In today's world of electronics the keywords are smaller,faster and cheaper. With more and more circuitry going onto existing circuit boards,the designers are searching for ways to contain this
.. weiterlesen
Advanced Packaging Using Liquid Crystalline Polymer (LCP) Substrates
Liquid crystalline polymer (LCP) substrates offer a number of advantages for high-density packaging. These properties include high temperature capability (>250oC),low coefficient of thermal exp
.. weiterlesen
The Era of the 3-D System In Package (SIP) will be Ushered in by Japanese Mobile Phones
It is becoming impossible to realize the latest mobile phones and other mobile equipment without Chip Size Packages (CSP) and other high-density semiconductor package technology. At present,the
.. weiterlesen
Yield Enhancement in BGA Substrates and Packaging
The growing use of high density interconnect (HDI) substrates in the microelectronics packaging industry has brought along a broad range of yield issues. Many of these issues are associated wit
.. weiterlesen
The Evolution of Any Layer IVH Structure PWB
With the advent of digitisation,networking,broadband telecommunication,and miniaturization in electronic set products,electronic devices are essentially required to deliver high electrical and
.. weiterlesen
Copper Foil Technology for High-Frequency Applications
Advances in information/communications technology are transforming the Internet from a medium for searching for information into a medium for providing and receiving various types of informatio
.. weiterlesen
Material Properties of LCP Film and its Broad Applications in IT-Related Devices
All-aromatic polyester,one of the super engineering plastics,is highly regarded as a base material of electronic circuit for its environmental compatibility,moisture resistance,dimensional stab
.. weiterlesen
PTFE based Solutions for the Future of High Speed Digital
A growing need is developing in the high-speed digital arena (backpanels,motherboards,line cards etc) for materials offering sufficient signal integrity for applications up to 10 Gbps. One solu
.. weiterlesen
Manufacturing and Reliability Evaluation of a Lead-Free Electronics Network Card
Lead-free manufacturing is becoming an industry initiative for environmental and legislative reasons. Lead-Free processing is rather new to the industry and the development of a successful asse
.. weiterlesen
Design of Experiments to Assess the Solderability of Various Printed Wiring Board Finishes
There are two main driving forces that are causing the electronics industry to take a look at alternatives to hot air solder leveling (HASL) as a surface finish for printed wiring boards (PWB).
.. weiterlesen
Where Crystal Planes Meet: Contribution to the Understanding of the Tin Whisker Growth Process
The texture of a tin deposit has been described as a key factor influencing whisker growth. Based on X-ray diffraction (XRD) and whisker growth data,this paper intends to show one possible mech
.. weiterlesen
Microstructural Evolution and Damage Mechanisms in Pb-Free Solder Joints During Extended -40 Degrees C to 125 Degrees C Thermal Cycles
A comparative study of package-to-board interconnections of a 1.27mm pitch BGA package using two Pb-free alloys and Sn-Pb solder in extended –40 to 125°C thermal cycling is described. The micro
.. weiterlesen
Reliability and Failure Analysis of Lead-Free Solder Joints
This paper provides a comparison of the air-to-air thermal cyclic reliability and associated failure modes of second level interconnects in lead-free,1.27 mm pitch,256 I/O BGA devices with eute
.. weiterlesen
Accelerating Plating Cycles and Reducing Costs: Improving the Plating of High Aspect Ratio Holes & Blind Vias
This paper describes a new technology for speeding the initiation and uniformity of electroplating deposits that does
not depend on modifying the chemistry or physical environment of the platin
.. weiterlesen
Advanced Laminate and Prepreg for PWBs with Embedded Components
The technology for embedding components in PWBs will change the process how PWB are fabricated over the next
few years. At the present time,polymer thick film is the most frequently used materi
.. weiterlesen