Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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A New Lamination Method: Heating the Laminates Through Metal Separators Equipped with Electrical Heating Medium
Prepregs used in the PCB industry possess various properties and need to be handled with care to maintain
identical chemo -rheological properties to yield dimensionally stable laminates. A prep
.. weiterlesen
New Positive Working Dry Film Resist
We will present a new positive working dry film resist system that is suitable for high accuracy use. The new positive working dry film resist is composed of base polymers with active hydrogen
.. weiterlesen
New State-of-Art Dry Film Technology for Fine Lines in High Yield
Dry film photoresist to produce highly integrated and advanced PWBs has been developed to meet more demanding
fine line requirements.
Advantages for volume production of fine features below 50?
.. weiterlesen
Next Generation Pb-free Immersion Finishes,Methodologies used to Determine Coating Thickness and the Impact of Thickness Variations and Rework on Soldering
The next generation of surface finish coatings to replace HASL are now being installed by various PWB manufacturers and have been implemented by many OEMs. Coating thickness requirements are p
.. weiterlesen
Novel Base Material for Microvias in PWBs by Using Unique Glass Fiber
The rapid developments of IT equipment are placing increased demands on printed wiring boards (PWBs) in terms of high efficiency,high-density and lightweight. Industry experience has proven tha
.. weiterlesen
Optical Interconnection Technology on the Printed Circuit Board Level
An optical interconnection technology for multi-layer printed circuit boards is presented. The application of this technology enables onboard data rates of several Gbps whereas at the same time
.. weiterlesen
Optical Packaging and Interconnection - A New Wave?
The market for optical communication equipment and components has grown significantly since the early 1980s with growth rates exceeding 50% annually in the late 1990s. Although demand has dropp
.. weiterlesen
PWB Final Surface Treatment Process and Film Characteristics that Satisfy Lead-free Solder Mounting
Because of environmental concerns,elimination of lead from electronic components has been recently encouraged,and as a result,lead-free solders are frequently adopted for solder mounting. The O
.. weiterlesen
PCB Laser Technology for Rigid and Flex HDI - Via Formation,Structuring,Routing
A new versatile laser technology is available that is capable of working with both rigid and flexible boards using only one laser source. This system is based on a THG-UV laser (355 nm) and vec
.. weiterlesen
Processing Thin Core Capacitor Materials
Processing thin core capacitor materials can be challenging,particularly those with non-reinforced dielectric less than 0.001” thick. Several processing steps require special attention to ensur
.. weiterlesen
Reengineered Conductive Polymers - The PTH Alternative to Electroless Copper for HDI Mass Production
In many areas conductive polymers have already gained full acceptance as a reliable and qualitatively outstanding metallization process and as a true competitor for electroless Cu. In the paper
.. weiterlesen
Solid Solder Deposit (SSDs),For Advanced Packaging Applications
Solid Solder Deposit (SSD) technology was developed in the early and mid-1990's to improve first pass yields in the manufacture of electronic devices. As the trend towards finer pitch surface m
.. weiterlesen
Strategy for Deriving Maximum Profits by Inventory Minimization
Inventory has been a hotly debated topic in many organizations. Since inventory is directly visible in company financials,there is a high degree of sensitivity to excessive inventory levels in
.. weiterlesen
Tapping the Hidden Potential for Quality Improvement and Cost Reduction in PCB Manufacturing
Automation,change and complexity have become the normal working environment in the PCB market. With this change has come the realization that high tech manufacturing,technological innovation an
.. weiterlesen
TDR and VNA Techniques for PCB Characterization
A uniform transmission line is described electrically by a characteristic impedance and a time delay. From the length of the line and the time delay,the effective dielectric constant can be ext
.. weiterlesen
Test Setup,Procedures and Patterns for Conductive Anodic Filament (CAF) and Electrochemical Migration (ECM) Testing
Reliability assessment of Printed Wiring Boards and Assemblies using High Humidity at elevated temperatures has been done for a number of years. Many companies,including the IPC have published
.. weiterlesen
Thermal Reliability of Printed Wiring Boards: What's Coming From the OEM?
Several of the major OEMs are introducing a variety of thermal reliability requirements for printed wiring boards as a result of increasing demands during assembly. These increasing demands man
.. weiterlesen
Three Reasons Why You Should Design Your Next Product With Laser Drilled Micro-Vias
If in designing your next product you are interested in cost reduction,reliability improvement,and increased electrical performance,then you should be considering using laser-drilled vias. Not
.. weiterlesen
Transmission Line Basics,Why Use 'Em At All
It is not often understood that when electrical signals travel along a wire or trace --- they reflect. Always! We intuitively understand that when we send audio waves across a room,a field or a
.. weiterlesen
Trimming and Printing of Embedded Resistors Using Demand-Mode Ink-Jet Technology and Conductive Polymer
This paper presents a method both to enhance the yield of embedded resistor processes and to print embedded resistors using drop-on-demand ink-jet device capable of dispensing a precise volume
.. weiterlesen
The Use of Insoluble,Mixed Metal Oxide Coated Titanium Anodes to Improve Quality and Decrease Plating Times for Circuit Boards
Copper plating in the printed circuit board industry has traditionally used soluble copper anodes in a vertical configuration. Newer,high speed,horizontal plating lines utilize insoluble anodes
.. weiterlesen
Use of Modulated Current Technology for High Performance Pulse Reverse Plating
Among the many advantages of Periodical Pulse Reverse (PPR) technology,improvement in throwing power and plating thickness uniformity are the most obvious. Traditionally,the biggest drawback of
.. weiterlesen
Use of Ultrasonic Agitation for Copper Electroplating,Application to High Aspect Ratio Blind Via Interconnections
Using conventional PWB copper electroplating techniques (DC bath chemistry with air agitation),non-uniform deposition inside blind via features may arise when the vias have diameters less than
.. weiterlesen
Using Personal Digital Assistants from Alaska to Zanzibar the Dielectric Constant and Dissipation Factors of Non-Woven Aramid/FR4 Laminates For a...
Permittivity and dissipation factor (Dk and Df) are effects of polarization of different components of the dielectric substrate material when subjected to an electrical field. Reliable design o
.. weiterlesen
Vertical,Continuous Plating Equipment for Printed Circuit Boards
New vertical continuous plating equipment has been developed while taking into consideration production and environmental requirements. The vertical continuous plating equipment conveys printed
.. weiterlesen
X-Y Scaling Compensation Technology for Fine-Line PCB Imaging with High-Precision Alignment
As imaging requirements continue to move towards finer resolution,accurate layer-to-layer alignment becomes an increasingly important factor that influences product yield. One of the major cont
.. weiterlesen
New Process for Advanced Packages (PBGA,CBGA,CSP,and New MLF,LLP,and LGA)
The latest types of components launched by the leading component manufacturers have increased the need for process control in rework. These packages are referred to by the generic name Land Gri
.. weiterlesen
AOI Performance in the EMS Environment: A Two Year Review
Automated Optical Inspection (AOI) equipment has become an option for electronics manufacturers who are considering how to improve performance on the production line. During the last few years
.. weiterlesen
Application Assessment of High Throughput Flip Chip Assembly for a High Lead-Eutectic Solder Cap Interconnect System Using No-Flow Underfill Materials
Flip Chip on Board (FCOB) is one of the most quickly growing segments in advanced electronic packaging. In many cases,assembly processes are not capable of providing the high throughputs needed
.. weiterlesen
Assembly of Flip Chips Utilizing Wafer Applied Underfill
Wafer-applied underfills are key to the widespread acceptance of flip chip technology. This NIST-ATP funded consortium is developing the materials and processes for achieving a wafer-applied un
.. weiterlesen
A New Lamination Method: Heating the Laminates Through Metal Separators Equipped with Electrical Heating Medium
Prepregs used in the PCB industry possess various properties and need to be handled with care to maintain
identical chemo -rheological properties to yield dimensionally stable laminates. A prep
.. weiterlesen
New Positive Working Dry Film Resist
We will present a new positive working dry film resist system that is suitable for high accuracy use. The new positive working dry film resist is composed of base polymers with active hydrogen
.. weiterlesen
New State-of-Art Dry Film Technology for Fine Lines in High Yield
Dry film photoresist to produce highly integrated and advanced PWBs has been developed to meet more demanding
fine line requirements.
Advantages for volume production of fine features below 50?
.. weiterlesen
Next Generation Pb-free Immersion Finishes,Methodologies used to Determine Coating Thickness and the Impact of Thickness Variations and Rework on Soldering
The next generation of surface finish coatings to replace HASL are now being installed by various PWB manufacturers and have been implemented by many OEMs. Coating thickness requirements are p
.. weiterlesen
Novel Base Material for Microvias in PWBs by Using Unique Glass Fiber
The rapid developments of IT equipment are placing increased demands on printed wiring boards (PWBs) in terms of high efficiency,high-density and lightweight. Industry experience has proven tha
.. weiterlesen
Optical Interconnection Technology on the Printed Circuit Board Level
An optical interconnection technology for multi-layer printed circuit boards is presented. The application of this technology enables onboard data rates of several Gbps whereas at the same time
.. weiterlesen
Optical Packaging and Interconnection - A New Wave?
The market for optical communication equipment and components has grown significantly since the early 1980s with growth rates exceeding 50% annually in the late 1990s. Although demand has dropp
.. weiterlesen
PWB Final Surface Treatment Process and Film Characteristics that Satisfy Lead-free Solder Mounting
Because of environmental concerns,elimination of lead from electronic components has been recently encouraged,and as a result,lead-free solders are frequently adopted for solder mounting. The O
.. weiterlesen
PCB Laser Technology for Rigid and Flex HDI - Via Formation,Structuring,Routing
A new versatile laser technology is available that is capable of working with both rigid and flexible boards using only one laser source. This system is based on a THG-UV laser (355 nm) and vec
.. weiterlesen
Processing Thin Core Capacitor Materials
Processing thin core capacitor materials can be challenging,particularly those with non-reinforced dielectric less than 0.001” thick. Several processing steps require special attention to ensur
.. weiterlesen
Reengineered Conductive Polymers - The PTH Alternative to Electroless Copper for HDI Mass Production
In many areas conductive polymers have already gained full acceptance as a reliable and qualitatively outstanding metallization process and as a true competitor for electroless Cu. In the paper
.. weiterlesen
Solid Solder Deposit (SSDs),For Advanced Packaging Applications
Solid Solder Deposit (SSD) technology was developed in the early and mid-1990's to improve first pass yields in the manufacture of electronic devices. As the trend towards finer pitch surface m
.. weiterlesen
Strategy for Deriving Maximum Profits by Inventory Minimization
Inventory has been a hotly debated topic in many organizations. Since inventory is directly visible in company financials,there is a high degree of sensitivity to excessive inventory levels in
.. weiterlesen
Tapping the Hidden Potential for Quality Improvement and Cost Reduction in PCB Manufacturing
Automation,change and complexity have become the normal working environment in the PCB market. With this change has come the realization that high tech manufacturing,technological innovation an
.. weiterlesen
TDR and VNA Techniques for PCB Characterization
A uniform transmission line is described electrically by a characteristic impedance and a time delay. From the length of the line and the time delay,the effective dielectric constant can be ext
.. weiterlesen
Test Setup,Procedures and Patterns for Conductive Anodic Filament (CAF) and Electrochemical Migration (ECM) Testing
Reliability assessment of Printed Wiring Boards and Assemblies using High Humidity at elevated temperatures has been done for a number of years. Many companies,including the IPC have published
.. weiterlesen
Thermal Reliability of Printed Wiring Boards: What's Coming From the OEM?
Several of the major OEMs are introducing a variety of thermal reliability requirements for printed wiring boards as a result of increasing demands during assembly. These increasing demands man
.. weiterlesen
Three Reasons Why You Should Design Your Next Product With Laser Drilled Micro-Vias
If in designing your next product you are interested in cost reduction,reliability improvement,and increased electrical performance,then you should be considering using laser-drilled vias. Not
.. weiterlesen
Transmission Line Basics,Why Use 'Em At All
It is not often understood that when electrical signals travel along a wire or trace --- they reflect. Always! We intuitively understand that when we send audio waves across a room,a field or a
.. weiterlesen
Trimming and Printing of Embedded Resistors Using Demand-Mode Ink-Jet Technology and Conductive Polymer
This paper presents a method both to enhance the yield of embedded resistor processes and to print embedded resistors using drop-on-demand ink-jet device capable of dispensing a precise volume
.. weiterlesen
The Use of Insoluble,Mixed Metal Oxide Coated Titanium Anodes to Improve Quality and Decrease Plating Times for Circuit Boards
Copper plating in the printed circuit board industry has traditionally used soluble copper anodes in a vertical configuration. Newer,high speed,horizontal plating lines utilize insoluble anodes
.. weiterlesen
Use of Modulated Current Technology for High Performance Pulse Reverse Plating
Among the many advantages of Periodical Pulse Reverse (PPR) technology,improvement in throwing power and plating thickness uniformity are the most obvious. Traditionally,the biggest drawback of
.. weiterlesen
Use of Ultrasonic Agitation for Copper Electroplating,Application to High Aspect Ratio Blind Via Interconnections
Using conventional PWB copper electroplating techniques (DC bath chemistry with air agitation),non-uniform deposition inside blind via features may arise when the vias have diameters less than
.. weiterlesen
Using Personal Digital Assistants from Alaska to Zanzibar the Dielectric Constant and Dissipation Factors of Non-Woven Aramid/FR4 Laminates For a...
Permittivity and dissipation factor (Dk and Df) are effects of polarization of different components of the dielectric substrate material when subjected to an electrical field. Reliable design o
.. weiterlesen
Vertical,Continuous Plating Equipment for Printed Circuit Boards
New vertical continuous plating equipment has been developed while taking into consideration production and environmental requirements. The vertical continuous plating equipment conveys printed
.. weiterlesen
X-Y Scaling Compensation Technology for Fine-Line PCB Imaging with High-Precision Alignment
As imaging requirements continue to move towards finer resolution,accurate layer-to-layer alignment becomes an increasingly important factor that influences product yield. One of the major cont
.. weiterlesen
New Process for Advanced Packages (PBGA,CBGA,CSP,and New MLF,LLP,and LGA)
The latest types of components launched by the leading component manufacturers have increased the need for process control in rework. These packages are referred to by the generic name Land Gri
.. weiterlesen
AOI Performance in the EMS Environment: A Two Year Review
Automated Optical Inspection (AOI) equipment has become an option for electronics manufacturers who are considering how to improve performance on the production line. During the last few years
.. weiterlesen
Application Assessment of High Throughput Flip Chip Assembly for a High Lead-Eutectic Solder Cap Interconnect System Using No-Flow Underfill Materials
Flip Chip on Board (FCOB) is one of the most quickly growing segments in advanced electronic packaging. In many cases,assembly processes are not capable of providing the high throughputs needed
.. weiterlesen
Assembly of Flip Chips Utilizing Wafer Applied Underfill
Wafer-applied underfills are key to the widespread acceptance of flip chip technology. This NIST-ATP funded consortium is developing the materials and processes for achieving a wafer-applied un
.. weiterlesen