Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Semi-Additive Process for Variant Polyimide Substrates in Ultra-Fine Flexible Circuitry
Ultra-fine flexible circuitry has been more and more applied in electronic devices due to their fast innovation and the increasing demand on miniaturization,light weight and flexibility in some
.. read more
Minimizing Signal Degradation in Flexible PCB Microstrip and Stripline Transmission Lines That Use Cross-Hatched Return Planes
In restricted-space applications,flexible PCBs must be able to fold with especially small bend radii. This in turn requires the return planes associated with microstrip and stripline transmissi
.. read more
Water Resistant,Sprayable and Dippable Nano-Coatings for Printed Circuit Assemblies
The electronics industry could benefit greatly from low cost,easy to apply coatings that can be applied to almost any PCBA surface in order to provide effective and practical water (damage) res
.. read more
Development of a High Temperature Protective Coating to Enable Organic Printed Circuit Boards to Operate at Higher Temperatures
Reliable operation of electronics at higher temperatures requires a combination of performance improvements in components,interconnects and substrates. Ceramic based substrate options can be co
.. read more
Analyzing a Printed Circuit Board Weave Exposure Condition and its Effects on Printed Wiring Assembly Functional Performance
Printed Circuit Board (PCB) weave texture and weave exposure are conditions that may appear similar if appropriate inspection techniques are not applied in a manner that can differentiate betwe
.. read more
Acoustic Detection of Pad Craters in Mechanical Shock and Transient Bend Tests
Printed circuit assemblies have become more susceptible to a failure mode known as “pad cratering” due to the implementation of several material restrictions. Pad cratering is defined as mechan
.. read more
Soldering and Plating for Tin-Lead and Lead-Free Connection Reliability
Aerospace Defense High Performance (ADHP) electronics products primarily use tin-lead solders,but electrical and electronic component finishes (i.e.,platings) increasingly are designed for lead
.. read more
Zero-Fault Production in Soldering Processes: Quality Management Based on Quality Assurance
A production process free from defects,with every production step being reproducible and traceable,is the target of quality assurance in electronics production worldwide. In many cases manual r
.. read more
Advanced Non-Pressure Silver Sinter Process by Infrared
In Power Electronics,increasing attention are drawn to silver sinter materials as an attractive interconnect material for its properties and also as a lead replacement solution. New property de
.. read more
Investigation of the Assembly Process of m03015 and a Brief Look at m0201 Components
Components are still shrinking in the SMT world and the next evolution of the passive components are the m03015 (009005) and m0201 (008004). Today it is seen that the 01005 component is still r
.. read more
Volume Repeatability for Non-Contact Jet Printing of Solder Paste
Solder paste is one of the most common materials used in surface mount technology (SMT) processes. Typical methods for applying solder paste to devices are needle dispensing or screen printing,
.. read more
Implementing Two-Component Conformal Coatings into Production
Conformal coating formulators are developing two-component solutions that improve protection,adhesion,and cure speed. Multi-component coatings are not new to the industry. Some of the oldest co
.. read more
Innovative Plasmacoatings for High Volume Conformal Coating of Electronics
Plasma is considered to be the 4th state of matter. Decomposed molecules interact with all exposed surfaces of the material,even the inner surfaces of open cell structures. In low pressure plas
.. read more
Comparison of Finite Elements Based Thermal Shock Test Reliability Assessment with a Specimen Based Test Approach
When it comes to reliability assessment of an electronic system,consisting of several components,such as an assembled printed circuit board (PCBA),this often turns out to be a challenging task.
.. read more
Enhancing Printed Circuit Board Layout Using Thermo-Mechanical Analysis
The use of high performance electronic assemblies in harsh environments subject solder interconnects to complex loading conditions that are primarily driven by the behavior of circuit card asse
.. read more
Using Lean Six Sigma to Optimize Critical Inputs on Solder Paste Printing
Solder paste printing is the first step in the surface mount manufacturing process for PCBA assembly. When the solder paste printing process is uncontrolled,defects can be produced,which may no
.. read more
Optimization of Stencil Apertures to Compensate for Scooping During Printing
This study investigates the scooping effect during solder paste printing as a function of aperture width,aperture length and squeegee pressure. The percent of the theoretical volume deposited d
.. read more
Advanced Flexible Substrate Technology for Improved Accuracy,Definition,and Conductivity of Screen Printed Conductors
One of the major concerns with screen printing of low temperature curing polymer thick film (PTF) pastes onto common flexible PET substrate materials is the overwhelming spread of the paste bey
.. read more
Screen Making for Printed Electronics - Specification and Tolerancing
Six decades of legacy experience makes the specification and production of screens and masks to produce repeatable precision results mostly an exercise in matching engineering needs with known
.. read more
Semi-Additive Process for Low Loss Build-Up Material in High Frequency Signal Transmission Substrates
Higher functionality,higher performance and higher reliability with smaller real estate are the mantras of any electronic device and the future guarantees more of the same. In order to achieve
.. read more
Understanding Circuit Material Performance Concerns for PCBs at Millimeter-Wave Frequencies
Millimeter-wave (mmWave) frequency applications are becoming more common. There are applications utilizing PCB technology at 60 GHz,77 GHz and many other mmWave frequencies. When designing a PC
.. read more
Flowers of Sulfur Creep Corrosion Testing of Populated Printed Circuit Boards
Creep corrosion testing of printed circuit boards (PCBs) using a specially designed flowers of sulfur chamber has been developed by an iNEMI technical committee. The iNEMI test is based on a ch
.. read more
Electrochemical Methods to Measure the Corrosion Potential of Flux Residues
Reliability Expectations of Highly Dense Electronic Assemblies is commonly validated using Ion Chromatography and Surface Insulation Resistance. Surface Insulation Resistance tests resistance d
.. read more
Relative Humidity Dependence of Creep Corrosion on Organic-Acid Flux Soldered Printed Circuit Boards
Creep corrosion on printed circuit boards (PCBs) is the corrosion of copper metallization and the spreading of the copper corrosion products across the PCB surfaces to the extent that they may
.. read more
Ultra-Low Voiding Halogen-Free No-Clean Lead-Free Solder Paste for Large Pads
The miniaturization trend is driving industry to adopting low standoff components. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electr
.. read more