Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Head-on-Pillow Defect Detection - X-ray Inspection Limitations
Both the number and the variants of Ball Grid Array packages (BGAs) are tending to increase on network Printed Board Assemblies (PBAs)with sizes ranging from a few mm die size Wafer Level Pack
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New High-Speed 3D Surface Imaging Technology in Electronics Manufacturing Applications
This paper introduces line confocal technology that was recently developed to characterize 3D features of various surface and material types at sub-micron resolution. It enables automatic micro
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Mixed Metal Oxide "MMO" Insoluble Anode System for Enhanced Operational Acid Copper Plating of Printed Wire Boards "PWB"
Advances in the printed wire board industry toward miniaturization,finer traces and HDI technology,smaller through-holes and microvias have placed higher demands on board design,manufacturabili
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Advanced Cu Electroplating Process for Any Layer Via Fill Applications with Thin Surface Copper
Advances in the printed wire board industry toward miniaturization,finer traces and HDI technology,smaller through-holes and microvias have placed higher demands on board design,manufacturabili
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Via Fill and Through Hole Plating Process with Enhanced TH Microdistribution
The increased demand for electronic devices in recent years has led to an extensive research in the field to meet the requirements of the industry. Electrolytic copper has been an important tec
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From Leaded to Leadless SMD (DFN) Packages. Enabling Automatic Optical Inspection (AOI) for Leadless (DFN) Packages Via Side Wettable Flanks
Leadless semiconductor plastic packages (QFN) is a growing package category in terms of market share and diversity. This is also valid for low pin count semiconductors (e.g.: transistors and di
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Novel Approach to Void Reduction Using Microflux Coated Solder Preforms for QFN/BTC Packages that Generate Heat
The requirement to reconsider traditional soldering methods is becoming more relevant as the demand for bottom terminated components (QFN/BTC) increases. Thermal pads under said components are
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Cleaning Flux Residue Under Leadless Components Using Objective Evidence to Determine Cleaning Performance
Cleanliness is a product of design,including component density,standoff height and the cleaning equipment’s ability to deliver the cleaning agent to the source of residue. The presence of manuf
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Evaluation of Novel Thermosetting Stretchable Conductive Inks and Substrates for "Stretchtronics" Applications
Cleanliness is a product of design,including component density,standoff height and the cleaning equipment’s ability to deliver the cleaning agent to the source of residue. The presence of manuf
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Washability of E-Textile Materials
E-textiles,also known as electronic textiles,smart textiles,smart clothing,smart garments,or smart fabrics,are fabrics with electronic components and sensors embedded in them. Key components of
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Overview of XR in a Manufacturing Environment
The Augmented Reality and Virtual Reality market is expected to cross $44 billion by the year 2025 according to various industry experts. This exciting new technology is not exactly new,but has
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Full Material Declarations: Removing Barriers to Environmental Data Reporting
Since the European Directives,RoHS (Restriction of Hazardous Substances) and REACH (Registration,Evaluation,Authorization and Restriction of Chemicals),entered into force in 2006-7,the number o
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Reaching Across Data Silos in the Electronics Supply Chain to Achieve Parts-Per-Billion Quality Levels
With the dramatic increase in connected devices in the IoT era,it is becoming imperative to do much more to ensure the quality of all electronic components,especially for devices in mission-cri
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Identifying and Combatting Counterfeiters
This paper explores the process of identifying and evaluatingpotential counterfeit parts. The military customer is aware that counterfeit parts are a problem and hascreated Defense Federal Acqu
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Identifying and Combatting Counterfeiters
This paper explores the process of identifying and evaluatingpotential counterfeit parts. The military customer is aware that counterfeit parts are a problem and hascreated Defense Federal Acqu
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Investigation of Cutting Quality and Mitigation Methods for Laser Depaneling of Printed Circuit Boards
There are numerous techniques to singulate printed circuit boards after assembly including break-out,routing,wheel cutting and now laser cutting. Lasers have several desirable advantages such a
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How Detrimental Production Concerns Related to Solder Mask Residues Can be Countered by Simple Operational Adaptations
The symbiotic relationship between solder masks and selective finishes is not new. The soldermask application is one of the key considerations to ensure a successful application of a selective
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Thermal Capabilities of Solder Masks and Other Coating Materials - How High Can We Go?
This paper focuses on three different coating material groups which were formulated to operate under high thermal stress and are applied at printed circuit board manufacturing level. While used
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Effects of Temperature Uniformity on Package Warpage
Knowing how package warpage changes over temperature is a critical variable in order to assemble reliable surface mount attached technology. Component and component or component and board surfa
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Bond Strength Optimization of Silicone Thermally Conductive Adhesives for Heatsink Attachment
Silicone thermal interface materials (TIM) are used to bond heatsinks on many critical components in server card assemblies in typical industry systems. Silicone TIMs have excellent high temper
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Fill the Void IV: Elimination of Inter-Via Voiding
Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to “Fill the Void.
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Voids in SMT Solder Joints - Myths Revisited
Since the introduction of lead-free soldering technology,voids in solder joints have been a topic of intensive investigations and discussions. One issue of detailed investigations is the format
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Residue Analysis of Masking Alternatives for Advanced Electronics
Prior to any conformal or chemically vapor deposited coating process,specific areas and components-often called “keep out zones”-on the printed circuit board (PCB) assembly are generally masked
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The Effect of a Nitrogen Reflow Environment on the Electrical Reliability of Rosin Based No-Clean Solder Paste Flux Residues
Rosin-based no-clean solder pastes are the most widely used solder pastes in the world and dominate consumer electronics assembly. The most common rosin-based no-clean solder paste reflow envir
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Correlations of Salt Composition and Surface Insulation Resistance Results
Sixteen simple inorganic salts were separately dissolved in water to a specific concentration,applied to separate Surface Insulation Resistance (SIR) coupons,dried and then the coupons were sub
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