Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Fill the Void II: An Investigation into Methods of Reducing Voiding
Voids in solder joints plague many electronics manufacturers. Do you have voids in your life? We have good news for you,there are many excellent ways to “Fill the Void.” This paper is a continu
.. read more
Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction
Bottom terminated components,or BTCs,have been rapidly incorporated into PCB designs because of their low cost,small footprint and overall reliability. The combination of leadless terminations
.. read more
3D Printed Electronics for Printed Circuit Structures
Printed electronics is a familiar term that is taking on more meaning as the technology matures. Flexible electronics is sometimes referred to as a subset of this and the printing approach is o
.. read more
Analysis of the Design Variables of Thermoforming Process on the Performance of Printed Electronic Traces
One specific market space of interest to emerging printed electronics is In Mold Label (IML) technology. IML is used in many consumer products and white good applications. When combined with el
.. read more
Durable Conductive Inks and SMD Attachment for Robust Printed Electronics
Polymer Thick Film (PTF)-based printed electronics (aka Printed Electronics) has improved in durability over the last few decades and is now a proven alternative to copper circuitry in many app
.. read more
High Throw DC Acid Copper Formulation for Vertical Continuous Electroplating Process
Electronics industry has grown immensely over the last few decades owing to the rapid growth of consumer electronics in the modern world. New formulations are essential to fit the needs of manu
.. read more
Laser-Based Methodology for the Application of Glass as a Dielectric and Cu Pattern Carrier for Printed Circuit Boards
Glass offers a number of advantages as a dielectric material,such as a low coefficient of thermal expansion (CTE),high dimensional stability,high thermal conductivity and suitable dielectric co
.. read more
Status and Outlooks of Flip Chip Technology
Status of flip chip technology such as wafer bumping,package substrate,flip chip assembly,and underfill will be reviewed in this study. Emphasis is placed on the latest developments of these ar
.. read more
Using Condensation Testing with Surface Insulation Resistance Measurements for QFN Reliability Assessment
Quad Flat Non-lead (QFN) packages are finding increased uses in high reliability applications due to their smaller footprints,improved thermal and electrical performance [1] and as such there i
.. read more
Understanding the Effect of Different Heating Cycles on Post-Soldering Flux Residues and the Impact on Electrical Performance
There are several industry-accepted methods for determining the reliability of flux residues after assembly. The recommended methods of test sample preparation do not always closely mimic the t
.. read more
Process Control of Ionic Contamination Achieving 6-Sigma Criteria in the Assembly of Electronic Circuits
Ionic contamination testing as a process control tool a newly developed testing protocol based on IPC-TM6502.3.25,was established to enable monitoring of ionic contamination within series produ
.. read more
Multilayer Ceramic Capacitors: Mitigating Rising Failure Rates
The multilayer ceramic capacitor (MLCC) has become a widely used electronics component both for surface mount and embedded PCB applications. The MLCC technologies have gone through a number of
.. read more
Assembly Reliability of TSOP/DFN PoP Stack Package
Numerous 3D stack packaging technologies have been implemented by industry for use in microelectronics memory applications. This paper presents a reliability evaluation of a particular package-
.. read more
Surface Mount Signed Warpage Case Study
Surface mount components are commonly evaluated for out-of-plane warpage levels across reflow temperatures. Decision making from these measurements is primarily based on signed warpage of a sin
.. read more
Process Optimization for Fine Feature Solder Paste Dispensing
With the rapid trend towards miniaturization in surface mount and MEMs lid-attach technology,it is becoming increasingly challenging to dispense solder paste in ultra-fine dot applications such
.. read more
Jetting of Isotropic Conductive Adhesives with Silver Coated Polymer Particles
The development of novel interconnection materials for production of electronics is of considerable interest to fulfill increasing demands on interconnect reliability in increasingly demanding
.. read more
Risk Mitigation in Hand Soldering
Soldering is the bonding of metallic surfaces via an intermetallic compound (IMC). The interaction between thermal energy delivery,flux chemistry,and solder chemistry creates the solder bond or
.. read more
An Investigation into Lead-Free Low Silver Cored Solder Wire for Electronics Manufacturing Applications
The electronics industry has widely adopted Sn-3.0Ag-0.5Cu solder alloys for lead-free reflow soldering applications and tin-copper based alloys for wave soldering applications. In automated so
.. read more
Rework Challenges for Leading Edge Components BGA,QFN,and LED in Today's Fast Moving Industry
The industry continues to face the challenges associated with BGA,QFN/BTC,and LED packages. The demand for more performance by consumers drives change,which results in greater component density
.. read more
AOI Capabilities Study with 03015 Component
Automated Optical Inspection (AOI) is advantageous in that it enables defects to be detected early in the manufacturing process,reducing the Cost of Repair as the AOI systems identify the speci
.. read more
Novel Pogo-Pin Socket Design for Automated Low Signal Linearity Testing of CT Detector Sensor
Due to the arrayed nature of the Computed Tomography (CT) Detector,high density area array interconnect solutions are critical to the functionality of the CT detector module. Specifically,the d
.. read more
High Frequency Dk and Df Test Methods Comparison,High Density Packaging User Group (HDP) Project
The High Density Packaging (HDP) user group working on high frequency test methods,used for speeds above 2.0 GHz,is developing a way of comparing how sensitive each of the various high frequenc
.. read more
Influence of Copper Conductor Surface Treatment for High Reliability PCB on Electrical Properties and Reliability
Development of information and the telecommunications network has been outstanding in recent years,and it is required for the related equipment such as communication base stations,servers and r
.. read more
The Impact of New Generation Chemical Treatment Systems on High Frequency Signal Integrity,High Density Packaging User Group (HDP) Project
The High Density Packaging (HDP) User Group has completed a project evaluating the high frequency loss impacts of a variety of imaged core surface treatments (bond enhancement treatments,includ
.. read more
Use of High Purity Water to Eliminate Contamination and Achieve Cleanliness - A Discussion of Performance and Costs
PCB board manufacturers engage in a number of wet processes. Water is used ubiquitously in many of these processes for rinsing as well as bath make-up. The impacts of water quality on productio
.. read more
SIR Test Vehicles - Comparison from a Cleaning Perspective
PCB design has evolved greatly in recent years becoming ever more complex. Board density is increasing,component standoff heights are decreasing and long term reliability requirements are great
.. read more
Does Cleaning the PCB Before Conformal Coating Add Value
Cleanliness level of PCBs is becoming more and more critical given component miniaturization,component density,and manufacturing practices that include no-clean solder flux. The reliability of
.. read more
Application Methods and Thermal Mechanical Reliability of Polymeric Solder Joint Encapsulation Materials (SJEM) on SnAgCu Solder Joints
With each new generation,the complexity in the design of flip chip devices,as exemplified by thinner package stack-ups,larger device sizes,and multiple die configurations,is increasing signific
.. read more
An Investigation into the Durability of Stencil Coating Technologies
It is well documented that Nano coatings on SMT stencils offer many benefits to those assembling PWBs. With reduced standard deviation and improved transfer efficiency nano coatings can provide
.. read more
Evaluation,Selection and Qualification of Replacement Reworkable Underfill Materials
A study was performed to investigate,evaluate and qualify new reworkable underfill materials to be used primarily with ball grid arrays (BGAs),Leadless SMT devices,QFNs,connectors and passive d
.. read more
Fill the Void II: An Investigation into Methods of Reducing Voiding
Voids in solder joints plague many electronics manufacturers. Do you have voids in your life? We have good news for you,there are many excellent ways to “Fill the Void.” This paper is a continu
.. read more
Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction
Bottom terminated components,or BTCs,have been rapidly incorporated into PCB designs because of their low cost,small footprint and overall reliability. The combination of leadless terminations
.. read more
3D Printed Electronics for Printed Circuit Structures
Printed electronics is a familiar term that is taking on more meaning as the technology matures. Flexible electronics is sometimes referred to as a subset of this and the printing approach is o
.. read more
Analysis of the Design Variables of Thermoforming Process on the Performance of Printed Electronic Traces
One specific market space of interest to emerging printed electronics is In Mold Label (IML) technology. IML is used in many consumer products and white good applications. When combined with el
.. read more
Durable Conductive Inks and SMD Attachment for Robust Printed Electronics
Polymer Thick Film (PTF)-based printed electronics (aka Printed Electronics) has improved in durability over the last few decades and is now a proven alternative to copper circuitry in many app
.. read more
High Throw DC Acid Copper Formulation for Vertical Continuous Electroplating Process
Electronics industry has grown immensely over the last few decades owing to the rapid growth of consumer electronics in the modern world. New formulations are essential to fit the needs of manu
.. read more
Laser-Based Methodology for the Application of Glass as a Dielectric and Cu Pattern Carrier for Printed Circuit Boards
Glass offers a number of advantages as a dielectric material,such as a low coefficient of thermal expansion (CTE),high dimensional stability,high thermal conductivity and suitable dielectric co
.. read more
Status and Outlooks of Flip Chip Technology
Status of flip chip technology such as wafer bumping,package substrate,flip chip assembly,and underfill will be reviewed in this study. Emphasis is placed on the latest developments of these ar
.. read more
Using Condensation Testing with Surface Insulation Resistance Measurements for QFN Reliability Assessment
Quad Flat Non-lead (QFN) packages are finding increased uses in high reliability applications due to their smaller footprints,improved thermal and electrical performance [1] and as such there i
.. read more
Understanding the Effect of Different Heating Cycles on Post-Soldering Flux Residues and the Impact on Electrical Performance
There are several industry-accepted methods for determining the reliability of flux residues after assembly. The recommended methods of test sample preparation do not always closely mimic the t
.. read more
Process Control of Ionic Contamination Achieving 6-Sigma Criteria in the Assembly of Electronic Circuits
Ionic contamination testing as a process control tool a newly developed testing protocol based on IPC-TM6502.3.25,was established to enable monitoring of ionic contamination within series produ
.. read more
Multilayer Ceramic Capacitors: Mitigating Rising Failure Rates
The multilayer ceramic capacitor (MLCC) has become a widely used electronics component both for surface mount and embedded PCB applications. The MLCC technologies have gone through a number of
.. read more
Assembly Reliability of TSOP/DFN PoP Stack Package
Numerous 3D stack packaging technologies have been implemented by industry for use in microelectronics memory applications. This paper presents a reliability evaluation of a particular package-
.. read more
Surface Mount Signed Warpage Case Study
Surface mount components are commonly evaluated for out-of-plane warpage levels across reflow temperatures. Decision making from these measurements is primarily based on signed warpage of a sin
.. read more
Process Optimization for Fine Feature Solder Paste Dispensing
With the rapid trend towards miniaturization in surface mount and MEMs lid-attach technology,it is becoming increasingly challenging to dispense solder paste in ultra-fine dot applications such
.. read more
Jetting of Isotropic Conductive Adhesives with Silver Coated Polymer Particles
The development of novel interconnection materials for production of electronics is of considerable interest to fulfill increasing demands on interconnect reliability in increasingly demanding
.. read more
Risk Mitigation in Hand Soldering
Soldering is the bonding of metallic surfaces via an intermetallic compound (IMC). The interaction between thermal energy delivery,flux chemistry,and solder chemistry creates the solder bond or
.. read more
An Investigation into Lead-Free Low Silver Cored Solder Wire for Electronics Manufacturing Applications
The electronics industry has widely adopted Sn-3.0Ag-0.5Cu solder alloys for lead-free reflow soldering applications and tin-copper based alloys for wave soldering applications. In automated so
.. read more
Rework Challenges for Leading Edge Components BGA,QFN,and LED in Today's Fast Moving Industry
The industry continues to face the challenges associated with BGA,QFN/BTC,and LED packages. The demand for more performance by consumers drives change,which results in greater component density
.. read more
AOI Capabilities Study with 03015 Component
Automated Optical Inspection (AOI) is advantageous in that it enables defects to be detected early in the manufacturing process,reducing the Cost of Repair as the AOI systems identify the speci
.. read more
Novel Pogo-Pin Socket Design for Automated Low Signal Linearity Testing of CT Detector Sensor
Due to the arrayed nature of the Computed Tomography (CT) Detector,high density area array interconnect solutions are critical to the functionality of the CT detector module. Specifically,the d
.. read more
High Frequency Dk and Df Test Methods Comparison,High Density Packaging User Group (HDP) Project
The High Density Packaging (HDP) user group working on high frequency test methods,used for speeds above 2.0 GHz,is developing a way of comparing how sensitive each of the various high frequenc
.. read more
Influence of Copper Conductor Surface Treatment for High Reliability PCB on Electrical Properties and Reliability
Development of information and the telecommunications network has been outstanding in recent years,and it is required for the related equipment such as communication base stations,servers and r
.. read more
The Impact of New Generation Chemical Treatment Systems on High Frequency Signal Integrity,High Density Packaging User Group (HDP) Project
The High Density Packaging (HDP) User Group has completed a project evaluating the high frequency loss impacts of a variety of imaged core surface treatments (bond enhancement treatments,includ
.. read more
Use of High Purity Water to Eliminate Contamination and Achieve Cleanliness - A Discussion of Performance and Costs
PCB board manufacturers engage in a number of wet processes. Water is used ubiquitously in many of these processes for rinsing as well as bath make-up. The impacts of water quality on productio
.. read more
SIR Test Vehicles - Comparison from a Cleaning Perspective
PCB design has evolved greatly in recent years becoming ever more complex. Board density is increasing,component standoff heights are decreasing and long term reliability requirements are great
.. read more
Does Cleaning the PCB Before Conformal Coating Add Value
Cleanliness level of PCBs is becoming more and more critical given component miniaturization,component density,and manufacturing practices that include no-clean solder flux. The reliability of
.. read more
Application Methods and Thermal Mechanical Reliability of Polymeric Solder Joint Encapsulation Materials (SJEM) on SnAgCu Solder Joints
With each new generation,the complexity in the design of flip chip devices,as exemplified by thinner package stack-ups,larger device sizes,and multiple die configurations,is increasing signific
.. read more
An Investigation into the Durability of Stencil Coating Technologies
It is well documented that Nano coatings on SMT stencils offer many benefits to those assembling PWBs. With reduced standard deviation and improved transfer efficiency nano coatings can provide
.. read more
Evaluation,Selection and Qualification of Replacement Reworkable Underfill Materials
A study was performed to investigate,evaluate and qualify new reworkable underfill materials to be used primarily with ball grid arrays (BGAs),Leadless SMT devices,QFNs,connectors and passive d
.. read more