Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Effect of Permittivity and Dissipation Factor of Solder Mask Upon Measured Loss
Existing coated microstrip trace impedance estimation usually uses the dielectric constant (Dk) of solder mask ink measured at 1 MHz from its datasheet. Or,some printed circuit board (PCB) manu
.. read more
The Role of Organic Amines in Soldering Materials
The transition from eutectic tin-lead to lead-free soldering in electronic assembly,mandatedby the RoHS legislation, has brought great pressure and challenge to solder mater
.. read more
Dispelling the Black Magic of Solder Paste
Solder paste has long been viewed as “black magic”. This “black magic” can easily be dispelled through a solder paste evaluation. Unfortunately,solder paste evaluation can be a challenge for el
.. read more
Can Age and Storage Conditions Affect the SIR Performance of a No-Clean Solder Paste Flux Residue?
The SMT assembly world,especially within the commercial electronics realm,is dominated by no-clean solder paste technology. A solder paste flux residue that does not require removal is very att
.. read more
A Study on Using Solid State Relay (SSR) in Automatic Test Equipment
Reed relay is widely used in Automatic Test Equipment (ATE) for its high speed,low cost and wide availabilities. However,being mechanical relays,they have their share of limitations and this pa
.. read more
Make the Right Design Choices in Load Switching and Simulation in a High Current and Mechatronic Functional Test
In a typical mechatronic manufacturing functional test setup,actual load simulations are usually done by connecting the DUT outputs to power or ground in order to establish either a high or low
.. read more
Characterization of Solder Defects in Package on Packages with AXI Systems for Inspection Quality Improvement
As a part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls,we have conducted inspection of 3 level POP package by using a new AXI that capable of 3D-C
.. read more
Embedding Passive and Active Components: PCB Design and Fabrication Process Variations
Embedding components within the PC board structure is not a new concept. Until recently,however,most embedded component PC board applications adapted only passive elements. The early component
.. read more
What is needed to Successfully Introduce "Device Embedding Technology" in Design and Manufacturing of PCBs and PCBAs to Add Value...
The embedding of components in electronic interconnection structures has been carried out for more than 30 years. It is regarded as the “poor men’s silicon device”. Different technologies have
.. read more
Important Considerations in the Design of Solderless Electronic Assemblies
Soldering has been a key process step in the manufacture of electronic assemblies since the earliest days of the electronics industry,it is also one of the most challenging processes to control
.. read more
Press Fit Technology Roadmap and Control Parameters for a High Performance Process
Press-fit technology is a proven and widely used and accepted interconnection method for joining electronics assemblies. Printed Circuit Board Assembly Systems and typical functional subassembl
.. read more
EMI-Caused EOS Sources in Automated Equipment
Electrical overstress causes damage to sensitive components,including latent damage. A significant source of EOS is high-frequency noise in automated manufacturing equipment. This paper analys
.. read more
A Case Study on Evaluating Manual and Automated Heat Sink Assembly using FEA and Testing
Proper assembly of components is critical in the manufacturing industry as it affects functionality and reliability. In a heat sink assembly,a detailed manual process is often utilized. However
.. read more
Effective Methods to Get Volatile Compounds Out of Reflow Process
Although reflow ovens may not have been dramatically changed during the last decade the reflow process changes step by step. With the introduction of lead-free soldering not only operation tem
.. read more
Materials Compatibility and Aging for Flux and Cleaner Combinations
A materials study of high reliability electronics cleaning is presented here. In Phase 1,mixed type substrates underwent a condensed contaminants application to view a worst-case scenario for
.. read more
Understanding the Effect of Process Changes and Flux Chemistry on Mid-Chip Solder Balling
This paper documents the experimental work performed to further understand the impact on mid-chip solder balling from both the manufacturing process and the flux chemistry. Mid-chip solder ball
.. read more
Nanocopper Based Paste for Solid Copper Via Fill
This paper discusses a nano copper based paste for use in via filling. The company manufactures nano copper and disperses the coated nano copper into a paste in combination with micron copper.
.. read more
Circuit Technology Crossovers Where PCBs and Printed Electronics Meet
Printed Circuit Boards (PCBs) and Printed Electronics (PE) both describe conductor/substrate combinations that makeconnections. Both PCB and PE technologies have been in use for a long time in
.. read more
Options for Assembly using High Temperature Interconnection Technologies
There is considerable interest in finding and replacing lead based solder alloys in high power environments and for existing high temperature operating environments. The high power electronics
.. read more
Solder Joint Embrittlement Mechanisms,Solutions and Standards
The change to lead-free solders in electronic assemblies created a need to replace tin-lead solderable termination finishes with materials such as pure tin or soft gold,on electronic component
.. read more
Sample Preparation for Mitigating Tin Whiskers in alternative Lead-Free Alloys
With the impending deadline for RoHS II and the elimination of exemptions for lead bearing solders in electronics for mission critical electronics,the issue of tin whiskers remains unresolved.
.. read more
pH Neutral Cleaning Agents - Market Expectation & Field Performance
With regard to precision cleaning applications within electronics manufacturing,pH neutral product development was a major breakthrough in recent years. The impetus for this development resulte
.. read more
Duo-Solvent Cleaning Process Development for Removing Flux Residue from Class 3 Hardware
Packaging trends enable disruptive technologies. The miniaturization of components reduces the distance between conductive paths. Cleanliness of electronic hardware based on the service exposur
.. read more
Assembly Cleanliness and Whisker Formation
This paper describes the results of a whisker formation study on SAC305 assemblies,evaluating the effects of cleanliness and lead-frame materials in room temperature/high humidity (25°C/85%RH)
.. read more
Electroplated Copper Filling of Through Holes on Varying Substrate Thickness
This paper discusses a through hole copper filling process for application to high density interconnects constructions and IC substrates. The process consists two acid copper plating cycles. Th
.. read more
CVS Control of a Via Fill Acid Copper Electroplating Baths
Due to the increasing demands placed on acid copper plating solutions to perform via fill plating of blind micro vias it is critical that the plating additives be monitored precisely. This pape
.. read more
Corrosion Resistant Servers for Free-Air Cooling Data Centers
The demand for compute capability is growing rapidly fueling the ever rising consumption of power by data centers the worldwide. This growth in power consumption presents a challenge to data ce
.. read more
Characterization,Prevention and Removal of Particulate Matter on Printed Circuit Boards
Particulate matter contamination is known to become wet and therefore ionically conductive and corrosive if the humidity in the environment rises above the deliquescence relative humidity (DRH)
.. read more
Dissolution of Metal Foils in Common Beverages
How susceptible are the metals used in modern electronics manufacturing to corrosion by common beverages? This is a question of interest,especially to manufacturers,retailers and to a certain e
.. read more
High Frequency Dk and Df Test Methods Comparison High Density User Group (HDP) Project
The High Density Packaging (HDP) user group has completed a project to evaluate the majority of viable Dk (Dielectric Constant)/Df (Dissipation Factor) and delay/loss electrical test methods,wi
.. read more
Effect of Permittivity and Dissipation Factor of Solder Mask Upon Measured Loss
Existing coated microstrip trace impedance estimation usually uses the dielectric constant (Dk) of solder mask ink measured at 1 MHz from its datasheet. Or,some printed circuit board (PCB) manu
.. read more
The Role of Organic Amines in Soldering Materials
The transition from eutectic tin-lead to lead-free soldering in electronic assembly,mandatedby the RoHS legislation, has brought great pressure and challenge to solder mater
.. read more
Dispelling the Black Magic of Solder Paste
Solder paste has long been viewed as “black magic”. This “black magic” can easily be dispelled through a solder paste evaluation. Unfortunately,solder paste evaluation can be a challenge for el
.. read more
Can Age and Storage Conditions Affect the SIR Performance of a No-Clean Solder Paste Flux Residue?
The SMT assembly world,especially within the commercial electronics realm,is dominated by no-clean solder paste technology. A solder paste flux residue that does not require removal is very att
.. read more
A Study on Using Solid State Relay (SSR) in Automatic Test Equipment
Reed relay is widely used in Automatic Test Equipment (ATE) for its high speed,low cost and wide availabilities. However,being mechanical relays,they have their share of limitations and this pa
.. read more
Make the Right Design Choices in Load Switching and Simulation in a High Current and Mechatronic Functional Test
In a typical mechatronic manufacturing functional test setup,actual load simulations are usually done by connecting the DUT outputs to power or ground in order to establish either a high or low
.. read more
Characterization of Solder Defects in Package on Packages with AXI Systems for Inspection Quality Improvement
As a part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls,we have conducted inspection of 3 level POP package by using a new AXI that capable of 3D-C
.. read more
Embedding Passive and Active Components: PCB Design and Fabrication Process Variations
Embedding components within the PC board structure is not a new concept. Until recently,however,most embedded component PC board applications adapted only passive elements. The early component
.. read more
What is needed to Successfully Introduce "Device Embedding Technology" in Design and Manufacturing of PCBs and PCBAs to Add Value...
The embedding of components in electronic interconnection structures has been carried out for more than 30 years. It is regarded as the “poor men’s silicon device”. Different technologies have
.. read more
Important Considerations in the Design of Solderless Electronic Assemblies
Soldering has been a key process step in the manufacture of electronic assemblies since the earliest days of the electronics industry,it is also one of the most challenging processes to control
.. read more
Press Fit Technology Roadmap and Control Parameters for a High Performance Process
Press-fit technology is a proven and widely used and accepted interconnection method for joining electronics assemblies. Printed Circuit Board Assembly Systems and typical functional subassembl
.. read more
EMI-Caused EOS Sources in Automated Equipment
Electrical overstress causes damage to sensitive components,including latent damage. A significant source of EOS is high-frequency noise in automated manufacturing equipment. This paper analys
.. read more
A Case Study on Evaluating Manual and Automated Heat Sink Assembly using FEA and Testing
Proper assembly of components is critical in the manufacturing industry as it affects functionality and reliability. In a heat sink assembly,a detailed manual process is often utilized. However
.. read more
Effective Methods to Get Volatile Compounds Out of Reflow Process
Although reflow ovens may not have been dramatically changed during the last decade the reflow process changes step by step. With the introduction of lead-free soldering not only operation tem
.. read more
Materials Compatibility and Aging for Flux and Cleaner Combinations
A materials study of high reliability electronics cleaning is presented here. In Phase 1,mixed type substrates underwent a condensed contaminants application to view a worst-case scenario for
.. read more
Understanding the Effect of Process Changes and Flux Chemistry on Mid-Chip Solder Balling
This paper documents the experimental work performed to further understand the impact on mid-chip solder balling from both the manufacturing process and the flux chemistry. Mid-chip solder ball
.. read more
Nanocopper Based Paste for Solid Copper Via Fill
This paper discusses a nano copper based paste for use in via filling. The company manufactures nano copper and disperses the coated nano copper into a paste in combination with micron copper.
.. read more
Circuit Technology Crossovers Where PCBs and Printed Electronics Meet
Printed Circuit Boards (PCBs) and Printed Electronics (PE) both describe conductor/substrate combinations that makeconnections. Both PCB and PE technologies have been in use for a long time in
.. read more
Options for Assembly using High Temperature Interconnection Technologies
There is considerable interest in finding and replacing lead based solder alloys in high power environments and for existing high temperature operating environments. The high power electronics
.. read more
Solder Joint Embrittlement Mechanisms,Solutions and Standards
The change to lead-free solders in electronic assemblies created a need to replace tin-lead solderable termination finishes with materials such as pure tin or soft gold,on electronic component
.. read more
Sample Preparation for Mitigating Tin Whiskers in alternative Lead-Free Alloys
With the impending deadline for RoHS II and the elimination of exemptions for lead bearing solders in electronics for mission critical electronics,the issue of tin whiskers remains unresolved.
.. read more
pH Neutral Cleaning Agents - Market Expectation & Field Performance
With regard to precision cleaning applications within electronics manufacturing,pH neutral product development was a major breakthrough in recent years. The impetus for this development resulte
.. read more
Duo-Solvent Cleaning Process Development for Removing Flux Residue from Class 3 Hardware
Packaging trends enable disruptive technologies. The miniaturization of components reduces the distance between conductive paths. Cleanliness of electronic hardware based on the service exposur
.. read more
Assembly Cleanliness and Whisker Formation
This paper describes the results of a whisker formation study on SAC305 assemblies,evaluating the effects of cleanliness and lead-frame materials in room temperature/high humidity (25°C/85%RH)
.. read more
Electroplated Copper Filling of Through Holes on Varying Substrate Thickness
This paper discusses a through hole copper filling process for application to high density interconnects constructions and IC substrates. The process consists two acid copper plating cycles. Th
.. read more
CVS Control of a Via Fill Acid Copper Electroplating Baths
Due to the increasing demands placed on acid copper plating solutions to perform via fill plating of blind micro vias it is critical that the plating additives be monitored precisely. This pape
.. read more
Corrosion Resistant Servers for Free-Air Cooling Data Centers
The demand for compute capability is growing rapidly fueling the ever rising consumption of power by data centers the worldwide. This growth in power consumption presents a challenge to data ce
.. read more
Characterization,Prevention and Removal of Particulate Matter on Printed Circuit Boards
Particulate matter contamination is known to become wet and therefore ionically conductive and corrosive if the humidity in the environment rises above the deliquescence relative humidity (DRH)
.. read more
Dissolution of Metal Foils in Common Beverages
How susceptible are the metals used in modern electronics manufacturing to corrosion by common beverages? This is a question of interest,especially to manufacturers,retailers and to a certain e
.. read more
High Frequency Dk and Df Test Methods Comparison High Density User Group (HDP) Project
The High Density Packaging (HDP) user group has completed a project to evaluate the majority of viable Dk (Dielectric Constant)/Df (Dissipation Factor) and delay/loss electrical test methods,wi
.. read more