Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
IPC 2610 - Documentation Package
With the advent of CAD and CAM tools,the need arose for a more complete method of data transfer. As layer count
increased,the number of files increased. As trace size and spacing began to decre
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Principles for Implementing BGA and CSP Technology
As IC technology advances,electronic packaging for the ICs has had to advance as well. The package methodology has become technically more sophisticated and physically more complex. For many IC
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Designing Resistors to Embed
Embedding resistors right into the printed circuit board substrate is not new,but it is gaining momentum as a rapidly
emerging and pivotal technology for the PCB industry,perhaps preceded only
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PWB Design: Beyond Copper Interconnects
Two emerging board technologies,embedded passives and embedded optical waveguides,have the potential to change the way that printed wiring boards operate. No longer will interconnects be relega
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Materials Information for Flex Designers and Fabricators
A flexible circuit is more than just thin materials made into an interconnecting device. Understanding the characteristics of the materials and their properties versus circuit design type and r
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Performance and Printing of Pb-Free Solder Paste for 100-micron Pitch Geometries
Recent advances in chip technologies have prompted a rapid increase in the density of solder joints in electronic components. Further reductions in pitch are likely,leading to joint structures
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Flex Based 3D Package Innovations for Enabling Low Cost System Level Integration and Miniaturization
Hand-held communication and entertainment products continue to dominate the consumer markets worldwide and,with each generation,offering more and more features and/or capability. And even thoug
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Flexible Printed Boards
This paper describes flexible printed circuit boards,used as “Product Boards” or “Interposers”,chip mounting structures. Traditionally,flexible circuit boards are made with polyimide dielectric
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Flip Chip Processing Solutions as used in System in Package Applications
Dramatic changes are underway in the computer,telecommunication,automotive,and consumer electronics
industries. Changes that demand common and pervasive requirements for active assemblies such
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Cost-Effective Placement Machine Capability Analysis and Process Control
New component packaging formats create the need for greater production process stability,reproducibility and
precision. This leads to a growing demand for process control solutions.
As manufact
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Optimized System Design Through Industry Benchmarking of Fabrication Tolerances and Material Properties
Benchmarking of industry fabrication capability,feature tolerances and material property variation is essential to
aligning product requirements and industry capability. Statistical based chara
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A Case Study of an OEM's Program to Assess Supplier Capabilities,Technology Availability,and Reliability for Advanced Printed Circuit Boards
Teradyne,Inc. has been involved with Conductor Analysis Technologies,Inc. (CAT Inc.) for over 4 years and the
IPC D-36 Subcommittee for over 2 years. This paper describes the initial motivation
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Challenges in Bare Die Mounting
Traditionally,the evolution of advanced IC assemblies has been due to defense and aerospace applications,where
reliability,size and weight were at a premium,and cost was a secondary considerati
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Galvanic Compatibility of Immersion Gold and Immersion Silver Printed Wiring Board Finishes with Aluminum
Numerous industry studies have been performed examining the compatibility between new plating finishes and other metals
used in printed wiring assemblies. The transition to the new printed wiri
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