Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
A Comparison of Registration Errors Amongst Suppliers of Printed Circuit boards
Misregistration of holes is the maximum amount of variation between the centerlines of all terminal pads within one plated through hole in a printed circuit board. The impacts of misregistratio
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SLP+
As the IoT market demands higher data rates and processing,the PCB technology is driving for smaller form factors,higher signal densities,and advanced material solutions. Miniaturization has be
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Embedded Inductors with Laser Machined Gap
This work presents the fabrication of embedded inductors and the experimental laser machining of gaps in the underlying ferrite structure. Design calculations are presented for a test coupon of
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Derivation of Equation on Thermal Life Prediction of Plated Through Hole for Printed Wiring Board
Printed wiring boards(PWBs) have recently been experiencing higher thermal stress in car electronics and high current equipment,etc. In this study, the effects of structural fa
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Thermo-mechanical Characterization of Next Generation Substrate Like Printed Circuit Board (SLP) Materials
Internet of Things (IoT) adoption pushes the boundaries of Printed Circuit Board (PCB) miniaturization and speed employing more hybrid stack-ups. The complexity of PCB stack up designs,material
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Examination of Glass/Epoxy Interfaces in Printed Circuit Boards
Most manufacturers of electronics grade glass fiber reinforcement used in today’s laminates apply treatments to enhance the bonding strength between the inorganic e-glass and the epoxy matrix w
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Investigating the Influence of Corner Radius within Rectangular Aperture Designs
The mobile and consumer market is the driving force of the electronics assembly sector,this sector historically has been associated with early adopters of leading edge surface mount technology
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Stencil Nano-Coatings - Do They Improve Repeatability and Uniformity in the Print Process
Over the past few years,studies have shown that Nano-coatings can improve solder paste release and reduce underside cleaning in the print process. Many of these studies have focused on print vo
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RoHS: 10 Years Later - IT Equipment Corrosion Issues Remain
The European Union RoHS directive took effect in 2006,and of the 6 restricted materials,the elimination of lead from electronic devices took the most development effort and had the worst degrad
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Round Robin Evaluation of iNEMI Creep Corrosion Qualification Test
Creep corrosion on printed circuit boards (PCBs) is the corrosion of copper metallization and the creeping of the copper corrosion products across the PCB surfaces to the extent that they may e
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Surviving 3K Thermal Cycles with Variable Void Levels
Electronics manufacturers are searching for new lead-free solders that can improve upon SAC305 voiding performance and that exceed the current thermal cycle performance of this solder in harsh
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Sn3.2Ag0.7Cu5.5Sb Solder Alloy with High Reliability Performance up to 175 C
A novel lead-free solder alloy 90.6Sn3.2Ag0.7Cu5.5Sb (SACSb),was developed targeted for high reliability with a wide service temperature capability. The alloy exhibited a melting temperature ra
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Practical Considerations for PCB Impedance Measurements
It is common for PCBs used for high frequency RF or high speed digital applications,to be tested for an impedance value prior to shipping the board. The controlled impedance board is typically
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Hybrid S-Parameters Behavior of Weak and Strong Edge-Coupled Differential Lines on PCBs
Imbalanced weakly and strongly edge-coupled differential pairs on printed circuit boards (PCBs),both microstrip (MS) and stripline (SL),are studied under different conditions using mixed-mode S
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Equivalent Capacitance Approach to Obtain Effective Roughness Dielectric Parameters for Copper Foils
Effective Roughness Dielectric (ERD) is a homogeneous lossy dielectric layer of certain thickness with effective (averaged) dielectric parameters. The ERD layer is used to model copper foil rou
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Study and Recommendation for Increasing PCB Surface Finish Shelf Life
Storage time allowed between bare printed circuit board manufacturing and assembly is quite limited. Based on an interpretation of IPC standards,shelf-life of the surface finish is the limiting
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Solder Joints Failure Under Low Strain-rate Cyclic Loading
Solder joint reliability has been a key issue for electronic assemblies and microelectronic packaging for many years. Many different factors can affect the solder joint reliability,such as pack
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A Novel Electroless Nickel Immersion Gold (ENIG) Surface Finish for Better Reliability of Electronic Assemblies
Conventional Electroless Nickel/Immersion Gold (ENIG) currently available in the market is prone to black-pad defects (hyper-corrosion related failures) associated with de-wetting of solder. EN
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Jet Printed Solder Paste and Cleaning Challenges
In case of broadband technology,component packages and other devices assembled on the PCBs are ever-shrinking,yet demands for quality,precision and reliability remain the same. Thus,how can man
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Monitoring the Cleaning Process using Industry 4.0 Methodology
Assemblers of printed circuit boards seek to provide their customers with high-quality products at the lowest possible cost. The total cost of production must take into account the complete pro
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X-ray Inspection of Radiation Sensitive Devices Recommended Best Practices for Preprogramed Managed NAND
Automated X-ray inspection post solder reflow is used to automatically analyze and detect structural defects including solder voids,opens,shorts,insufficient solder and other defects. These def
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Electric Field Control - EOS Mystery Solved
A new discovery of missing fundamental controls in electronic manufacturing is the cause for most Electric Overstress failures generated by PCB and cable discharge events. This discovery develo
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PCBA Redesigns Done in the Right Way
Electronic component end-of-life (EOL) and declining prices are more problematic to industrial than consumer electronic products. Industrial electronic products typically have long product life
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Improved Interoperability Between MCAD and ECAD Design Tools
During the design of printed wiring boards,our engineers exchange files between the MCAD and ECAD tools in order to synchronize boards and to validate the fulfillment of design requirements. Be
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Library Management for an Ever-Evolving Diverse EDA Tool Industry
Any company that designs PCBAs that has gone through the throws of an acquisition,CAD tool change or even an EMS company with a varied customer base has to deal with more than one EDA tool and
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