Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Challenges Associated with Non-Clean Liquid Flux Selection to Meet Industry Standards
The selection of a liquid flux for use in wave soldering operations is extremely critical to both the manufacturing assembly process and the long term reliability of electronic assemblies. As i
.. read more
Divergence in Test Results Using IPC Standard SIR and Ionic Contamination Measurements
Controlled humidity and temperature controlled surface insulation resistance (SIR) measurements of flux covered test vehicles,subject to a direct current (D.C.) bias voltage are recognized by a
.. read more
A Novel Solution for No-Clean Flux Not Fully Dried Under Component Terminations
The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly
.. read more
Development of Halogen Free,Low Loss Copper-Clad Laminates Containing a Novel Phosphonate Oligomer
With the rapid development of the information industry,increasing attention is being paid to the dielectric performance of base materials including copper-clad laminates (CCL) and prepregs. In
.. read more
Unique Implementation of a 15 Layer,Unboned/Looseleaf,Bookbinder Rigid Flex with Backdrill and LGA Interconnect
While flex and rigid flex (IPC-6013 Types 1 through 4i[1]) have always been important in 3D packaging to help resolve space constraints and meet other design requirements,the continued push for
.. read more
Smart Factory at Fuyong
The highly-automated and connection-driven methods in Electronics Manufacturing is a more and more important topic in the industry today. Advances in modern manufacturing technologies make fact
.. read more
Will the "Internet of Manufacturing" Really Affect Business?
With technology these days,we often find solutions without a problem,rather than the other way around. The concept of the “Internet of Manufacturing” (IoM),combined with the evolution toward au
.. read more
IPC-1782 Standard for Traceability Supporting Counterfeit Components
Traceability has grown from being a specialized need for certain safety critical segments of the industry,to now being a recognized value-add tool for the industry as a whole. The perception of
.. read more
2.5D and 3D Semiconductor Package Technology: Evolution and Innovation
The electronics industry is experiencing a renaissance in semiconductor package technology. A growing number of innovative 3D package assembly methodologies have evolved to enable the electroni
.. read more
Low Profile Embedded Magnetics for RF Communication Systems
Portable electronics demand that inductors and transformers be implemented in low profile surface mount packages. In communication systems,magnetic components are used for impedance matching,vo
.. read more
NSOP Reduction for QFN RFIC Packages
Wire bonded packages using conventional copper leadframe have been used in industry for quite some time. The growth of portable and wireless products is driving the miniaturization of packages
.. read more
Challenges on ENEPIG Finished PCBs: Gold Ball Bonding and Pad Metal Lift
As a surface finish for PCBs,Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with
.. read more
An Investigation into the Use of Nano-Coated Stencils to Improve Solder Paste Printing with Small Aperture Area Ratios
Certain types of nano-coated stencils dramatically improve the transfer efficiency of solder paste during paste printing. These nano-coatings also refine the solder paste brick shape giving imp
.. read more
Comparison of Site Printing Performance for Rework - Adhesive Backed Plastic versus Mini Metal Stencils
Ever since there has been a widespread usage of surface mount parts,the trend of continued shrinkage of devices with ever finer pitches has continued to challenge PCB assemblers for the rework
.. read more
Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow - Results of an Industry Round-Robin
The risk associated with whisker growth from pure tin solderable terminations is fully mitigated when all of the pure tin is dissolved into tin-lead solder during SMT reflow. In order to take f
.. read more
To Quantify a Wetting Balance Curve
Wetting balance testing has been an industry standard for evaluating the solderability of final finishes on printed circuit boards (PCB) for many years. A Wetting Balance Curve showing Force as
.. read more
Additive Manufacturing in a Supply Chain Solution Provider Environment
Additive Manufacturing has recently been brought into the spotlight as an alternative manufacturing method. While there are many different additive manufacturing technologies,the two that will
.. read more
21st Century PCB FAB Factory Design Which Eliminates Regional Cost Advantages
Over fifteen years has passed since North America and Europe ceased being the center of worldwide PCB fabrication,and were supplanted by a Far East market with low cost labor,more relaxed envir
.. read more
RoHS Substance Measurements in Complex Products
With the wide breadth of component types used in complex electronic equipment,implementation of the European Union Restriction of Hazardous Substances 2011/65/EU/ (RoHS) is a challenge. A low v
.. read more
PCB Cleanliness Assessment Methodologies - A Comparative Study
PCB manufacturers use a wide variety of solder pastes and fluxes including No-Clean,RMA and OA,both leaded and lead-free within their processes. As part of the manufacturing process,components
.. read more
Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate
Due to the ongoing trend towards miniaturization of power components,the need for increased thermal conductivity of solder joints in SMT processes gains more and more importance. Therefore,the
.. read more
Controlling Voiding Mechanisms in the Reflow Soldering Process
While a significant level of voiding can be tolerated in solder joints where electrical conductivity is the main requirement,voiding at any level severely compromises thermal conductivity. For
.. read more
Novel Thermally Conductive Low Pressure Overmold Materials as a Solution for Thermal Management
The dissipation of heat from a power die,such as those used to drive the increasingly popular LED arrays,has traditionally been achieved by use of a thermal interface material (TIM) and a metal
.. read more
Can Lower Temperature Solderable Adhesive Replace SAC Paste
The electronic industry is currently very interested in low temperature soldering processes,such as using Sn/Bi alloy,to improve process yield,eliminate the head-in-pillow effect,and enhance re
.. read more
Thermal Profile Variation and PCB Reliability
When designing PCBs,solder paste selection is critical. Once a specific paste type and supplier are identified,the manufacturing process is developed and refined. Critical to the quality of the
.. read more