Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Printed Circuit Board Fabrication Processes and Their Effects on Fine Copper Barrel Cracks
The onset of copper barrel cracks is typically induced by the presence of manufacturing defects. In the absence of discernible manufacturing defects,the causes of copper barrel cracks in printe
.. read more
An Examination of Glass-fiber and Epoxy Interface Degradation in Printed Circuit Boards
Conductive filament formation or CAF typically occurs in two steps: degradation of the resin/glass fiber bond followed by an electrochemical reaction. Bond degradation provides a path along whi
.. read more
New Requirements for Sir- Measurement
During the last period of newly assembled electrical devices (pcbs),new component types like LGA and QFN were also qualified as well as smaller passive components with reliability requirements
.. read more
Reliability Assessment of No-clean and Water-soluble Solder Pastes Part II
Looking back twenty-five years ago,the solder pastes residues had to be cleaned after reflow due to their corrosive nature; two ways of cleaning were possible,either with solvent or by using wa
.. read more
Reliability Assessment of No-clean and Water-soluble Solder Pastes Part II
Looking back twenty-five years ago,the solder pastes residues had to be cleaned after reflow due to their corrosive nature; two ways of cleaning were possible,either with solvent or by using wa
.. read more
The Effect of Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues
An estimated 80% of all SMT assembly in the world is performed with a no-clean soldering process,largely due to the
predominance of consumer-type electronics. The continuing trend of increasing
.. read more
Low Cost High Reliability Assembly of POP with Novel Epoxy Flux on Solder Paste
A novel epoxy flux was developed with good compatibility with no-clean solder pastes,which imparts high reliability for BGA assembly at a low cost. This compatibility with solder pastes is achi
.. read more
An Investigation into Printing Miniaturised Devices for the Automotive and Industrial Manufacturing Sectors
The electronics market is divided into many segments each having its own challenges; but one theme that connects the electronics community together is a need for higher yield with lower costs.
.. read more
Enclosed Media Printing as an Alternative to Metal Blades
Fine pitch/fine feature solder paste printing in PCB assembly has become increasingly difficult as board geometries have become ever more compact. The printing process itself,traditionally the
.. read more
Cost Comparison of Complex PCB fabrication Using Traditional Sequential Lamination Methods versus Interconnect with Conductive Paste
As feature sizes are driven to be smaller,the cost of PCB fabrication is driven higher. In particular,sequential lamination of complex circuit boards is a time consuming and expensive process.
.. read more
Effect of Microwave Plasma Surface Treatement for Improved Adhesion Strength of Direct Copper Plating on Polterafluoroethylene (PTFE)
The purpose of this study is to investigate the effect of plasma surface modification to improve adhesion strength between polytetrafluoroethylene (PTFE) and directly plated electroless copper.
.. read more
Harnessing Technology for the Warfighter
Mr. Craig Herndon & Mr. Roger Smith will be discussing the Navy’s assignment as the DoD Executive Agent for Printed Circuit Board (PrCB) Technology and its role in ensuring that viable military
.. read more
From Off-Shoring to On-Shoring to Regional Strategy
Since the late 1990s,the globalization of the electronics industry has put North American and European manufacturers in competition with manufacturers in China and other low-labor-cost areas.
.. read more
The Return to Regionalization for Electronics Manufacturing
One of the more notable trends in the data on electronics manufacturing over the past several years has been a return to regionalization. Defined as building in region for region,this trend is
.. read more
Position Accuracy Machines for Selective Soldering Fine Pitch Components
The drive towards fine pitch technology also affects the soldering processes. Selective soldering is a reliable soldering process for THT (through hole) connectors and offers a wide process win
.. read more
Study of Various PCBA Surface Finishes
In this study various printed circuit board surface finishes were evaluated,including: organic solderability preservative (OSP),plasma finish (PF),immersion silver (IAg),electroless nickel / im
.. read more
Reliability Screening of Lower Melting Point Pb-Free Alloys Containing Bi
This paper is the second of two papers discussing the companies Lower Melt Alloy program. The first paper was presented at IPC APEX2013. The program explores the manufacturability and reliabili
.. read more
Voiding and Drop Test Performance of Lead-Free Low Melting and Medium Melting Mixed Alloy BGA Assembly
Low melting 57Bi42Sn1Ag (BiSnAg) was explored for replacing SAC solders as a low-cost solution. In this study,BGAs with SAC105,SAC305,and BiSnAg balls were assembled with SAC105,SAC305 or 57Bi4
.. read more
HALT Testing of Backward Soldered BGAs on a Military Product
The move to lead free (Pb-free) electronics by the commercial industry has resulted in an increasing number of ball grid array components (BGAs) which are only available with Pb-free solder bal
.. read more
Sample Preparation for Mitigating Tin Whiskers in Alternative Lead-Free Alloys
As lead-free alloys shift into high reliability electronics,the issue of tin whisker growth remains a primary concern among those in the industry. Current research shows that there is no perfec
.. read more
Gold Stud Bump Flip Chip Bonding on Molded Interconnect Devices
A molded interconnect device (MID) is an injection molded thermoplastic substrate which incorporates a conductive circuit pattern and integrates both mechanical and electrical functions. The th
.. read more
Packaging Technology and Design Challenge for Fine Pitch Micro-Bump Cu-Pillar and BOT (Direct Bond on Substrate-Trace) Using TCNCP (Thermal Compression...
The companies writing this paper have jointly developed Copper (Cu) Pillar micro-bump and TCNCP(Thermal Compression with Non-Conductive Paste) technology over the last two+ years. The Cu Pillar
.. read more
Study on Solder Joint Reliability of Fine Pitch CSP
Nowadays,consumer electronic product is characterized with miniature,portable,light and high performance,especially for 3G mobile products. More and more fine pitch CSPs (0.4mm) come forth as t
.. read more
Stereo Vision Based Automated Solder Ball Height Detection
Solder ball height inspection is essential to the detection of potential connectivity issues in semi-conductor units. Current ball height inspection tools such as laser profiling,fringe project
.. read more
Implementing Robust Bead Probe Test Processes into Standard Pb-Free Assembly
Increasing system integration and component densities continue to significantly reduce the opportunity to access nets using standard test points. Over time the size of test points has been dras
.. read more
Boundary-Scan Project Phase 3:Investigation into Challenges of using .BSDL Files
The number one issue identified by the 2009 iNEMI Boundary-Scan survey was problems with obtaining correct and compliant boundary-scan description language (.bsdl) files from the semiconductor
.. read more
Boundary-Scan Project Phase 3: Investigation into Challenges of using .BSDL Files
The number one issue identified by the 2009 iNEMI Boundary-Scan survey was problems with obtaining correct and compliant boundary-scan description language (.bsdl) files from the semiconductor
.. read more
Board-Assist Built-In Self-Test (BA-BIST),Short-Term and Long-Term Strategies for Use Case Standardization
This iNEMI program's focus is on a “Chip” Built-in Self-Test (BIST) study and its promotion for board and system-level applications. In this case,This study has 2 strategic focus areas – short
.. read more
Good Product Quality Comes From Good Design for Test Strategies
Product quality can be improved through proper application of design for test (DFT) strategies. With today’s shrinking product sizes and increasing functionality,it is difficult to get good tes
.. read more
Printed Circuit Board Fabrication Processes and Their Effects on Fine Copper Barrel Cracks
The onset of copper barrel cracks is typically induced by the presence of manufacturing defects. In the absence of discernible manufacturing defects,the causes of copper barrel cracks in printe
.. read more
An Examination of Glass-fiber and Epoxy Interface Degradation in Printed Circuit Boards
Conductive filament formation or CAF typically occurs in two steps: degradation of the resin/glass fiber bond followed by an electrochemical reaction. Bond degradation provides a path along whi
.. read more
New Requirements for Sir- Measurement
During the last period of newly assembled electrical devices (pcbs),new component types like LGA and QFN were also qualified as well as smaller passive components with reliability requirements
.. read more
Reliability Assessment of No-clean and Water-soluble Solder Pastes Part II
Looking back twenty-five years ago,the solder pastes residues had to be cleaned after reflow due to their corrosive nature; two ways of cleaning were possible,either with solvent or by using wa
.. read more
Reliability Assessment of No-clean and Water-soluble Solder Pastes Part II
Looking back twenty-five years ago,the solder pastes residues had to be cleaned after reflow due to their corrosive nature; two ways of cleaning were possible,either with solvent or by using wa
.. read more
The Effect of Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues
An estimated 80% of all SMT assembly in the world is performed with a no-clean soldering process,largely due to the
predominance of consumer-type electronics. The continuing trend of increasing
.. read more
Low Cost High Reliability Assembly of POP with Novel Epoxy Flux on Solder Paste
A novel epoxy flux was developed with good compatibility with no-clean solder pastes,which imparts high reliability for BGA assembly at a low cost. This compatibility with solder pastes is achi
.. read more
An Investigation into Printing Miniaturised Devices for the Automotive and Industrial Manufacturing Sectors
The electronics market is divided into many segments each having its own challenges; but one theme that connects the electronics community together is a need for higher yield with lower costs.
.. read more
Enclosed Media Printing as an Alternative to Metal Blades
Fine pitch/fine feature solder paste printing in PCB assembly has become increasingly difficult as board geometries have become ever more compact. The printing process itself,traditionally the
.. read more
Cost Comparison of Complex PCB fabrication Using Traditional Sequential Lamination Methods versus Interconnect with Conductive Paste
As feature sizes are driven to be smaller,the cost of PCB fabrication is driven higher. In particular,sequential lamination of complex circuit boards is a time consuming and expensive process.
.. read more
Effect of Microwave Plasma Surface Treatement for Improved Adhesion Strength of Direct Copper Plating on Polterafluoroethylene (PTFE)
The purpose of this study is to investigate the effect of plasma surface modification to improve adhesion strength between polytetrafluoroethylene (PTFE) and directly plated electroless copper.
.. read more
Harnessing Technology for the Warfighter
Mr. Craig Herndon & Mr. Roger Smith will be discussing the Navy’s assignment as the DoD Executive Agent for Printed Circuit Board (PrCB) Technology and its role in ensuring that viable military
.. read more
From Off-Shoring to On-Shoring to Regional Strategy
Since the late 1990s,the globalization of the electronics industry has put North American and European manufacturers in competition with manufacturers in China and other low-labor-cost areas.
.. read more
The Return to Regionalization for Electronics Manufacturing
One of the more notable trends in the data on electronics manufacturing over the past several years has been a return to regionalization. Defined as building in region for region,this trend is
.. read more
Position Accuracy Machines for Selective Soldering Fine Pitch Components
The drive towards fine pitch technology also affects the soldering processes. Selective soldering is a reliable soldering process for THT (through hole) connectors and offers a wide process win
.. read more
Study of Various PCBA Surface Finishes
In this study various printed circuit board surface finishes were evaluated,including: organic solderability preservative (OSP),plasma finish (PF),immersion silver (IAg),electroless nickel / im
.. read more
Reliability Screening of Lower Melting Point Pb-Free Alloys Containing Bi
This paper is the second of two papers discussing the companies Lower Melt Alloy program. The first paper was presented at IPC APEX2013. The program explores the manufacturability and reliabili
.. read more
Voiding and Drop Test Performance of Lead-Free Low Melting and Medium Melting Mixed Alloy BGA Assembly
Low melting 57Bi42Sn1Ag (BiSnAg) was explored for replacing SAC solders as a low-cost solution. In this study,BGAs with SAC105,SAC305,and BiSnAg balls were assembled with SAC105,SAC305 or 57Bi4
.. read more
HALT Testing of Backward Soldered BGAs on a Military Product
The move to lead free (Pb-free) electronics by the commercial industry has resulted in an increasing number of ball grid array components (BGAs) which are only available with Pb-free solder bal
.. read more
Sample Preparation for Mitigating Tin Whiskers in Alternative Lead-Free Alloys
As lead-free alloys shift into high reliability electronics,the issue of tin whisker growth remains a primary concern among those in the industry. Current research shows that there is no perfec
.. read more
Gold Stud Bump Flip Chip Bonding on Molded Interconnect Devices
A molded interconnect device (MID) is an injection molded thermoplastic substrate which incorporates a conductive circuit pattern and integrates both mechanical and electrical functions. The th
.. read more
Packaging Technology and Design Challenge for Fine Pitch Micro-Bump Cu-Pillar and BOT (Direct Bond on Substrate-Trace) Using TCNCP (Thermal Compression...
The companies writing this paper have jointly developed Copper (Cu) Pillar micro-bump and TCNCP(Thermal Compression with Non-Conductive Paste) technology over the last two+ years. The Cu Pillar
.. read more
Study on Solder Joint Reliability of Fine Pitch CSP
Nowadays,consumer electronic product is characterized with miniature,portable,light and high performance,especially for 3G mobile products. More and more fine pitch CSPs (0.4mm) come forth as t
.. read more
Stereo Vision Based Automated Solder Ball Height Detection
Solder ball height inspection is essential to the detection of potential connectivity issues in semi-conductor units. Current ball height inspection tools such as laser profiling,fringe project
.. read more
Implementing Robust Bead Probe Test Processes into Standard Pb-Free Assembly
Increasing system integration and component densities continue to significantly reduce the opportunity to access nets using standard test points. Over time the size of test points has been dras
.. read more
Boundary-Scan Project Phase 3:Investigation into Challenges of using .BSDL Files
The number one issue identified by the 2009 iNEMI Boundary-Scan survey was problems with obtaining correct and compliant boundary-scan description language (.bsdl) files from the semiconductor
.. read more
Boundary-Scan Project Phase 3: Investigation into Challenges of using .BSDL Files
The number one issue identified by the 2009 iNEMI Boundary-Scan survey was problems with obtaining correct and compliant boundary-scan description language (.bsdl) files from the semiconductor
.. read more
Board-Assist Built-In Self-Test (BA-BIST),Short-Term and Long-Term Strategies for Use Case Standardization
This iNEMI program's focus is on a “Chip” Built-in Self-Test (BIST) study and its promotion for board and system-level applications. In this case,This study has 2 strategic focus areas – short
.. read more
Good Product Quality Comes From Good Design for Test Strategies
Product quality can be improved through proper application of design for test (DFT) strategies. With today’s shrinking product sizes and increasing functionality,it is difficult to get good tes
.. read more