Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Successful Material Compliance Reporting Strategies for the Electronic Industry
Growing material regulations compel electronics manufacturers to rethink product compliance. Can a company state with confidence every substance in the final product has been identified,and fro
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Reliability of Ball Grid Arrays Converted from Pb-free to Tin-Lead by Robotic Hot Solder Dip (RHSD). Multiple Reball Trial and Test Results
Pb-free Ball Grid Arrays (BGA) present unacceptable reliability risks for defense and space programs,but what are the options when SnPb devices are no longer available? BGA manufacturers expres
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Advanced Rework Applications in a Shrinking World
As electronic assemblies continue to shrink in size,component population densities are increasing. Design engineers are forced to utilize all available board real estate and continuously push t
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Water Soluble Solder Paste,Wet Behind the Ears or Wave of the Future?
Water soluble lead-free solder paste is widely used in today’s SMT processes,but the industry is slowly moving away from water soluble solder pastes in favor of no-clean solder pastes. This shi
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Paste Jetting Within a Solder Paste Inspection Process
In the electronics industry,consumer demand drives a large portion of product innovations. Consumers want greater functionality and power,while maintaining a small footprint. Due to this demand
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The Impact of Reduced Solder Alloy Powder Size on Solder Paste Print Performance
From the Apple Watch and body cameras for law enforcement to virtual reality hardware and autonomous transportation,the opportunities for electronics to improve our lives are limited only by ou
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Development of a Consistent and Reliable Thermal Conductivity Measurement Method,Adapted to Typical Composite Materials Used in the PCB Industry
Most of today’s printed circuit board base materials are anisotropic and it is not possible to use a simple method to measure thermal conductivity along the different axis,especially when a goo
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High Throw Electroless Copper - Enabling new Opportunities for IC Substrates and HDI Manufacturing
Two new electroless copper baths have been developed to cope with upcoming miniaturization challenges in the high-end IC substrate segment as well as in the evolving HDI board market. The main
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Material Effects of Laser Energy When Processing Circuit Board Substrates during Depaneling
Using modern laser systems for the depanelization of circuit boards can create some challenges for the production engineer when it is compared to traditional mechanical singulation methods. Und
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Nondestructive Inspection of Underfill Layers Stacked up in Ceramics-Organics-Ceramics Packages with Scanning Acoustic Tomography (SAT)
Ceramics packages are being used in the electronics industry to operate the devices in harsh environments. In this paper we report a study on acoustic imaging technology for nondestructively in
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Defect Features Detected by Acoustic Emission for Flip-Chip CGA/FCBGA/PBGA/FPGBA Packages and Assemblies
C-mode scanning acoustic microscopy (C-SAM) is a non-destructive inspection technique showing the internal features of a specimen by ultrasound. The C-SAM is the preferred method for finding “a
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AXI Voiding Detection on High Power Transistor
High Power Transistors contain materials and structure that pose unique challenges to AXI technologies. The work discusses traditional AXI imaging and processing techniques and their limitation
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Elimination of Wave Soldering Process
Wave soldering of pin through hole devices has been around for a very long time. It is a process that everyone says will go away and each year it is still being used. In the industry,wave solde
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Design Improvements for Selective Soldering Assemblies
Selective soldering,along with pin-in-paste reflow and press fit,is the primary assembly method for through-hole components. The reflow process is limited by component dimensions and heat resis
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How to Use the Right Flux for the Selective Soldering Application
The selective soldering application requires a combination of performance attributes that traditional liquid fluxes designed for wave soldering applications cannot fulfill. First,the flux depos
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Thermo-Electric Cooler Module Reliability Improvements for CT Detector Subsystem
Thermo-electric coolers (TEC's) are becoming increasingly popular in the medical device industry,where design space is limited and high heat transfer capacity is needed. For a Computed Tomograp
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A Structured Approach for Failure Analysis and Root Cause Determination for a Complex System Involving Printed Wiring Assemblies
Determining the root cause of a failure in a complex system is a demanding task that requires a structured and disciplined approach. From engaging the appropriate subject-matter experts,to veri
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Round Robin of High Frequency Test Methods by IPC-D24C Task Group
Currently there is no industry standard test method for measuring dielectric properties of circuit board materials at frequencies greater than about 10 GHz. Various materials vendors and test l
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High Frequency RF Electrical Performance Effects of Plated through Hole Vias
Plated Though Hole (PTH) vias are common in the PCB industry,however their impact on electrical performance can sometimes be unclear. The confusion can be due to several different issues. Some
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An Interesting Approach to Yield Improvement for the Solder Paste Printing and Reflow Process
Whilst many companies invest time,effort and cost into up front work to fix snags which would lead to issues with yield during production,this paper shows the efforts of the company who looks t
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Tiny With a Big Impact: True of False? Impact of the Component Complexity on the assembly process. Miniaturized Components (01005,03015...) in the Mix with so-called Standard Components (BGA,LED,Pin-in-Paste)
The electronics markets place widely varying demands on products,thus necessitating a great deal of complexity with regard to board design and connector technology. A nearly inexhaustible multi
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Board Warpage During Reflow Soldering - Need for Board Support?
In the high temperatures during board assembly reflow soldering,the base material becomes soft and there is a severe risk for permanent warpage. There are many parameters that could affect boar
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Board Warpage During Reflow Soldering - Need for Board Support?
In the high temperatures during board assembly reflow soldering,the base material becomes soft and there is a severe risk for permanent warpage. There are many parameters that could affect boar
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Combining Six Sigma Tools with Lean Performance Measurement to Sustain Continuous Improvement Activities
Sustaining the results of any continuous improvement effort can be challenging. With Lean improvement,constant monitoring,coaching and tweaking is often required to keep the "old ways" from cre
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Lean Six Sigma Approach to New Product Development
In this rapidly moving electronics market,fast to market with new products is what separates top performing companies from average companies. A survey conducted by Arthur D. Little (ADL) [1] re
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