Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Display
Challenges of Manufacturing with Printed Circuit Board Cavities
Cavity technology in a Printed Circuit Board (PCB) has existed for many years. The methodology to create the cavity in the PCB has evolved over time as technologies have advanced and the manufa
.. read more
Alternative Concepts for High Speed,High Frequency and Signal Integration into the PCB
Transmission of data is a major driver in the electronics industry. Higher data volumes,high speed data transfer and short time signal transmission have to be realized to meet these requirement
.. read more
Printing of Solder Paste – A Quality Assurance Methodology
Solder paste printing is known to be one of the most difficult processes to quality assure in electronic manufacturing. The challenge increases as the technology development moves toward a mix
.. read more
Jetting Strategies for mBGAs a question of give and take...
The demands on volume delivery and positioning accuracy for solder paste deposits are increasing as the size and complexity of circuits continue to develop in the electronics industry. Accordin
.. read more
Implementing Embedded Component from Concept-To-Manufacturing
The utilization of embedded components has increased across many applications in various industries,and with rapid emergence of technologies and the need to secure IP,new methodologies are bein
.. read more
Embedded Components: A Comparative Analysis of Reliability Part II
In light of new process and product technologies in the field of embedded components,questions arise with respect to advantages and potential disadvantages to standard SMT component placement w
.. read more
Reliability of Embedded Planar Capacitors: A Review
Embedded capacitors offer board designers the ability to address the demands of high switching speeds and high I/O count packages while stemming the proliferation of minute decoupling capacitor
.. read more
Tin Whisker Risk Management by Conformal Coating
The objective of this study is to evaluate conformal coatings for mitigation of tin whisker growth. The conformal coatings chosen for the experiment are acrylic,polyurethane and parylene. The c
.. read more
Testing Printed Circuit Boards for Creep Corrosion in Flowers of Sulfur Chamber
The iNEMI technical subcommittee on creep corrosion is developing a flowers-of-sulfur (FOS) based qualification test for creep corrosion on printed-circuit boards (PCBs). The test setup consist
.. read more
Effectiveness of Conformal Coat to Prevent Corrosion of Nickel-palladium-gold-finished Terminals
Nickel-palladium-gold-finished terminals are susceptible to creep corrosion. Excessive creep corrosion can result in device failure due to insulation resistance loss between adjacent terminals.
.. read more
The Effect of Radiation Losses on High Frequency PCB Performance
This paper is an extension of an IPC paper [1] presented last year which addressed microwave insertion loss of common PCB transmission line circuits. Insertion loss of these circuits is made up
.. read more
Insertion Loss Reduction through Non-Roughening Inner-Layer Surface Treatments
As channel speeds approach 25 Gbps,near the expected maximum bandwidth for traditional copper-based PCBs,every available tool to minimize total insertion loss in the board material system will
.. read more
Solder Paste Stencil Design for Optimal QFN Yield and Reliability
The use of bottom terminated components (BTC) has become widespread,specifically the use of Quad Flat No-lead (QFN) packages. The small outline and low height of this package type,improved elec
.. read more
Reliability Study of Bottom Terminated Components
Bottom terminated components (BTC) are leadless components where terminations are protectively plated on the underside of the package. They are all slightly different and have different names,s
.. read more
AXI Applications with BTC and Connectors in Flextronics
Bottom Termination surface mount Components (BTC) are extremely popular because of their low cost,low stand-off height and excellent thermal and electrical properties. In this manufacturing are
.. read more
Color Logical Analysis Approach for LED Testing in Manufacturing
Complexity of test development for LED test and long LED test execution time in production are big challenges faced by the PCB manufacturing industry. This paper introduces a parallel multi-cha
.. read more
Reduce Design Time and Product Lifecycle Costs with Functional Blocks Common to Designs and Test Fixtures
This paper proposes an integrated design and test strategy which uses functional design blocks common to both designs and test fixtures,with the aim of saving time and money. Benefits of this s
.. read more
SJIT,Solder Joint Integrity Test,To Find Latent Defects in Printed Wiring Board
To find defects of solder joint in printed wiring board assembly,quite a few test methods have been developed so far.
Capacitance method and IEEE 1149.1 or boundary scan method are often used t
.. read more
The use of an available Color Sensor for Burn-In of LED Products
In today’s world it is important that a product has sufficient accreditation that it can be enter many different market places. While accreditation can be a costly process,it is prudent to know
.. read more
Current and Emerging Gaps in Standards for Semiconductor Assembly Materials in the Era of 2.5D and 3D Dimensional Devices
What’s the Future of Interposers for Semiconductor IC Packaging?
.. read more
Methodology to Predict Mechanical Strength and Pad Cratering Failures under BGA Pads on Printed Circuit Boards
In the past few years,several papers,test methods and methodologies have been developed to estimate pad cratering under Ball Grid Array (BGA) pads in Printed Circuit Board Assemblies (PCBAs).
.. read more
Double Reflow-Induced Interfacial Failures in Pb-free Ball Grid Array Solder Joints
Assembly defects can effectively shorten reliability lifetimes in addition to lowering manufacturing yields or creating premature service failures. This paper describes and characterizes an unu
.. read more
Rework and Reliability of High I/O Column Grid Array Assemblies
Commercial-off-the-shelf column grid array packaging (COTS CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administ
.. read more
Advanced Rework Technology and Processes for Next Generation Large Area Arrays,01005,PoP and QFN Devices
BGA Rework is now largely mature,although new supplemental processes that provide improved process control such as
Solder Paste Dipping and Non-Contact Site Cleaning can now be integrated into
.. read more
EOS Exposure of Components in Soldering Process
This paper examines the nature; the consequences and the mitigation of electrical overstress (EOS) caused by electromagnetic interference (EMI),or electrical noise,on power lines and ground in
.. read more
Cleaning Of Assembled PCBs A Crucial Way of Enhancing Product Reliability and Avoiding Problems in the Field
Over the last years more and more International newspapers reported in Europe / USA and Japan: “Tunnel train got stuck under the Channel – thousands of people stranded “Recall of thousands of c
.. read more
High Reliability and Low Variability Results with Benchtop PCB Cleaning
The purpose of this study is to determine whether or not aerosol benchtop cleaning can consistently and reliably clean reworked boards. Different variables that play a role in the effectiveness
.. read more
Challenges of Manufacturing with Printed Circuit Board Cavities
Cavity technology in a Printed Circuit Board (PCB) has existed for many years. The methodology to create the cavity in the PCB has evolved over time as technologies have advanced and the manufa
.. read more
Alternative Concepts for High Speed,High Frequency and Signal Integration into the PCB
Transmission of data is a major driver in the electronics industry. Higher data volumes,high speed data transfer and short time signal transmission have to be realized to meet these requirement
.. read more
Printing of Solder Paste – A Quality Assurance Methodology
Solder paste printing is known to be one of the most difficult processes to quality assure in electronic manufacturing. The challenge increases as the technology development moves toward a mix
.. read more
Jetting Strategies for mBGAs a question of give and take...
The demands on volume delivery and positioning accuracy for solder paste deposits are increasing as the size and complexity of circuits continue to develop in the electronics industry. Accordin
.. read more
Implementing Embedded Component from Concept-To-Manufacturing
The utilization of embedded components has increased across many applications in various industries,and with rapid emergence of technologies and the need to secure IP,new methodologies are bein
.. read more
Embedded Components: A Comparative Analysis of Reliability Part II
In light of new process and product technologies in the field of embedded components,questions arise with respect to advantages and potential disadvantages to standard SMT component placement w
.. read more
Reliability of Embedded Planar Capacitors: A Review
Embedded capacitors offer board designers the ability to address the demands of high switching speeds and high I/O count packages while stemming the proliferation of minute decoupling capacitor
.. read more
Tin Whisker Risk Management by Conformal Coating
The objective of this study is to evaluate conformal coatings for mitigation of tin whisker growth. The conformal coatings chosen for the experiment are acrylic,polyurethane and parylene. The c
.. read more
Testing Printed Circuit Boards for Creep Corrosion in Flowers of Sulfur Chamber
The iNEMI technical subcommittee on creep corrosion is developing a flowers-of-sulfur (FOS) based qualification test for creep corrosion on printed-circuit boards (PCBs). The test setup consist
.. read more
Effectiveness of Conformal Coat to Prevent Corrosion of Nickel-palladium-gold-finished Terminals
Nickel-palladium-gold-finished terminals are susceptible to creep corrosion. Excessive creep corrosion can result in device failure due to insulation resistance loss between adjacent terminals.
.. read more
The Effect of Radiation Losses on High Frequency PCB Performance
This paper is an extension of an IPC paper [1] presented last year which addressed microwave insertion loss of common PCB transmission line circuits. Insertion loss of these circuits is made up
.. read more
Insertion Loss Reduction through Non-Roughening Inner-Layer Surface Treatments
As channel speeds approach 25 Gbps,near the expected maximum bandwidth for traditional copper-based PCBs,every available tool to minimize total insertion loss in the board material system will
.. read more
Solder Paste Stencil Design for Optimal QFN Yield and Reliability
The use of bottom terminated components (BTC) has become widespread,specifically the use of Quad Flat No-lead (QFN) packages. The small outline and low height of this package type,improved elec
.. read more
Reliability Study of Bottom Terminated Components
Bottom terminated components (BTC) are leadless components where terminations are protectively plated on the underside of the package. They are all slightly different and have different names,s
.. read more
AXI Applications with BTC and Connectors in Flextronics
Bottom Termination surface mount Components (BTC) are extremely popular because of their low cost,low stand-off height and excellent thermal and electrical properties. In this manufacturing are
.. read more
Color Logical Analysis Approach for LED Testing in Manufacturing
Complexity of test development for LED test and long LED test execution time in production are big challenges faced by the PCB manufacturing industry. This paper introduces a parallel multi-cha
.. read more
Reduce Design Time and Product Lifecycle Costs with Functional Blocks Common to Designs and Test Fixtures
This paper proposes an integrated design and test strategy which uses functional design blocks common to both designs and test fixtures,with the aim of saving time and money. Benefits of this s
.. read more
SJIT,Solder Joint Integrity Test,To Find Latent Defects in Printed Wiring Board
To find defects of solder joint in printed wiring board assembly,quite a few test methods have been developed so far.
Capacitance method and IEEE 1149.1 or boundary scan method are often used t
.. read more
The use of an available Color Sensor for Burn-In of LED Products
In today’s world it is important that a product has sufficient accreditation that it can be enter many different market places. While accreditation can be a costly process,it is prudent to know
.. read more
Current and Emerging Gaps in Standards for Semiconductor Assembly Materials in the Era of 2.5D and 3D Dimensional Devices
What’s the Future of Interposers for Semiconductor IC Packaging?
.. read more
Methodology to Predict Mechanical Strength and Pad Cratering Failures under BGA Pads on Printed Circuit Boards
In the past few years,several papers,test methods and methodologies have been developed to estimate pad cratering under Ball Grid Array (BGA) pads in Printed Circuit Board Assemblies (PCBAs).
.. read more
Double Reflow-Induced Interfacial Failures in Pb-free Ball Grid Array Solder Joints
Assembly defects can effectively shorten reliability lifetimes in addition to lowering manufacturing yields or creating premature service failures. This paper describes and characterizes an unu
.. read more
Rework and Reliability of High I/O Column Grid Array Assemblies
Commercial-off-the-shelf column grid array packaging (COTS CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administ
.. read more
Advanced Rework Technology and Processes for Next Generation Large Area Arrays,01005,PoP and QFN Devices
BGA Rework is now largely mature,although new supplemental processes that provide improved process control such as
Solder Paste Dipping and Non-Contact Site Cleaning can now be integrated into
.. read more
EOS Exposure of Components in Soldering Process
This paper examines the nature; the consequences and the mitigation of electrical overstress (EOS) caused by electromagnetic interference (EMI),or electrical noise,on power lines and ground in
.. read more
Cleaning Of Assembled PCBs A Crucial Way of Enhancing Product Reliability and Avoiding Problems in the Field
Over the last years more and more International newspapers reported in Europe / USA and Japan: “Tunnel train got stuck under the Channel – thousands of people stranded “Recall of thousands of c
.. read more
High Reliability and Low Variability Results with Benchtop PCB Cleaning
The purpose of this study is to determine whether or not aerosol benchtop cleaning can consistently and reliably clean reworked boards. Different variables that play a role in the effectiveness
.. read more