Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Advanced Printing for Microelectronic Packaging
Using micro-dispensing with exceptional volume control it is possible to print in 3D space a wide variety of materials and including solders,epoxies,conductive adhesives and ceramic filled poly
.. read more
Substrates: Polyester Film for the Flexible Electronics Industry
Polyester film substrates have been widely used in making flexible / printed electronic devices for over 30 years. However the early 2000’s brought about an explosion of interest in “additive”
.. read more
Digitally Printed Battery: Transitioning from a Traditional Coated Battery Design to a Digitally Printed Battery; Advantages,Challenges and Successes
The company is a producer of thin film batteries of less than 0.45mm in thickness. Battery operated devices have grown
smaller and smaller while energy demands have increased as the need for in
.. read more
Rework Challenges for Smart Phones and Tablets
Smart phones are complex,costly devices and therefore need to be reworked correctly the first time.
In order to meet the ever-growing demand for performance,the complexity of mobile devices has
.. read more
Semi Quantitative Method for Assessing the Reworkability of Different Underfills
The choice and optimisation of underfills to maximise process productivity and end product performance has been widely studied,and generated numerous performance criteria,flow time cure schedul
.. read more
Effects of Dielectric Material,Aspect Ratio and Copper Plating on Microvia Reliability
This paper documents test data on the effects of materials and processes on microvia structures. Thirteen sets of experiments were carried out to evaluate the effects of dielectric material,asp
.. read more
Simulation of the Influence of Manufacturing Quality on Thermomechanical Stress of Microvias
The advancement of area-array packages,such as flip chips and chip scale packages,has driven the adoption of high density interconnects (HDIs) that allow for an increased number of I/Os with a
.. read more
“Reliability of Stacked Microvia”
Reliability of Microvia has been a concern since microvias were introduced to our industry. This study was designed to understand the reliability of Type 1,Type 2,and Type 3 Microvias. Reliabil
.. read more
Predicting Fatigue of Solder Joints Subjected to High Number of Power Cycles
Solder joint reliability of SMT components connected to printed circuit boards is well documented. However,much of the
testing and data is related to high-strain energy thermal cycling experime
.. read more
Design for Reliability: Improving Reliability of Plastic Encapsulated Ocean Technology Products by Understanding Moisture Ingress through FEA Simulation
Remote sensing products designed for ocean environments sustain the harshness of cold oceans. The reliability of these telemetry devices needs to be very high to measure,collect and transmit da
.. read more
A Control-Chart Based Method for Solder Joint Crack Detection
Many researchers have used different failure criteria in the published solder joint reliability studies. Since the reported timeto-
failure would be different if different failure criteria were
.. read more
What is Kelvin Test?
The PCB industry is ever changing and adapting to new technologies. OEM specifications and requirements have also advanced due to these technologies. In some cases the OEMs are asking for a low
.. read more
Electrical Testing of Passive Components
Substrates have become more critical with regard to pitch and density in today’s designs with challenges for passive components in terms of surface placement. This negates the opportunity for h
.. read more
Preparing for Increased Electrostatic Discharge Device Sensitivity
With the push for ever improving performance on semiconductor component I/O interfaces,semiconductor components are being driven into a realm which makes them more sensitive to electrostatic di
.. read more
Electrostatic Discharge (ESD),Factory Issues,Measurement Methods and Product Quality – Roadmaps and Solutions for 2025 to 2030
The number of failures caused by electrostatic discharges (ESD) has been increasing for some time now. So,it is necessary for everyone,who handles electrostatic sensitive devices (ESDS),to know
.. read more
Specialized Materials for Printed Electronics
In the area of Printed Electronics,there are a number of functional materials that can include conductors,Semi-conductors,dielectrics,barriers,and adhesives. There are also a smaller subset of
.. read more
The Total Environmental Solution For Any-Layer HDI Production
Copper Via-Fill application in acid copper plating of PWB is experiencing a significant growth due to the booming of smartphone and tablet PC. With this growth,the PC board demand of HDI comple
.. read more
The Perfect Copper Surface
In order to provide the functionality in today’s electronics,printed circuit boards are approaching the complexity of semiconductors. For flexible circuits with 1 mil lines and spaces,this mean
.. read more
Final Finish Specifications Review IPC Plating Sub-committee 4-14
An IPC specification is a consensus document that specifies attributes relevant to the plated surface. Plating specifications are designed to be applicable to a wide range of products types. A
.. read more
Signal Transmission Loss due to Copper Surface Roughness in
Higher-speed signal transmission is increasingly required on a printed circuit board to handle massive data in electronic systems. So,signal transmission loss of copper wiring on a printed circ
.. read more
Beyond 0402M Placement: Process Considerations for 03015M Microchip Mounting
The printed circuit board assembly industry has long embraced the “Smaller,Lighter,Faster” mantra for electronic devices,especially in our ubiquitous mobile devices. As manufacturers increase s
.. read more
Miniaturization with Help of Reduced Component to Component Spacing
Miniaturization and the integration of a growing number of functions in portable electronic devices require an extremely high packaging density for the active and passive components. There are
.. read more
Challenges of Manufacturing with Printed Circuit Board Cavities
Cavity technology in a Printed Circuit Board (PCB) has existed for many years. The methodology to create the cavity in the PCB has evolved over time as technologies have advanced and the manufa
.. read more
Alternative Concepts for High Speed,High Frequency and Signal Integration into the PCB
Transmission of data is a major driver in the electronics industry. Higher data volumes,high speed data transfer and short time signal transmission have to be realized to meet these requirement
.. read more
Printing of Solder Paste – A Quality Assurance Methodology
Solder paste printing is known to be one of the most difficult processes to quality assure in electronic manufacturing. The challenge increases as the technology development moves toward a mix
.. read more
Jetting Strategies for mBGAs a question of give and take...
The demands on volume delivery and positioning accuracy for solder paste deposits are increasing as the size and complexity of circuits continue to develop in the electronics industry. Accordin
.. read more
Implementing Embedded Component from Concept-To-Manufacturing
The utilization of embedded components has increased across many applications in various industries,and with rapid emergence of technologies and the need to secure IP,new methodologies are bein
.. read more
Advanced Printing for Microelectronic Packaging
Using micro-dispensing with exceptional volume control it is possible to print in 3D space a wide variety of materials and including solders,epoxies,conductive adhesives and ceramic filled poly
.. read more
Substrates: Polyester Film for the Flexible Electronics Industry
Polyester film substrates have been widely used in making flexible / printed electronic devices for over 30 years. However the early 2000’s brought about an explosion of interest in “additive”
.. read more
Digitally Printed Battery: Transitioning from a Traditional Coated Battery Design to a Digitally Printed Battery; Advantages,Challenges and Successes
The company is a producer of thin film batteries of less than 0.45mm in thickness. Battery operated devices have grown
smaller and smaller while energy demands have increased as the need for in
.. read more
Rework Challenges for Smart Phones and Tablets
Smart phones are complex,costly devices and therefore need to be reworked correctly the first time.
In order to meet the ever-growing demand for performance,the complexity of mobile devices has
.. read more
Semi Quantitative Method for Assessing the Reworkability of Different Underfills
The choice and optimisation of underfills to maximise process productivity and end product performance has been widely studied,and generated numerous performance criteria,flow time cure schedul
.. read more
Effects of Dielectric Material,Aspect Ratio and Copper Plating on Microvia Reliability
This paper documents test data on the effects of materials and processes on microvia structures. Thirteen sets of experiments were carried out to evaluate the effects of dielectric material,asp
.. read more
Simulation of the Influence of Manufacturing Quality on Thermomechanical Stress of Microvias
The advancement of area-array packages,such as flip chips and chip scale packages,has driven the adoption of high density interconnects (HDIs) that allow for an increased number of I/Os with a
.. read more
“Reliability of Stacked Microvia”
Reliability of Microvia has been a concern since microvias were introduced to our industry. This study was designed to understand the reliability of Type 1,Type 2,and Type 3 Microvias. Reliabil
.. read more
Predicting Fatigue of Solder Joints Subjected to High Number of Power Cycles
Solder joint reliability of SMT components connected to printed circuit boards is well documented. However,much of the
testing and data is related to high-strain energy thermal cycling experime
.. read more
Design for Reliability: Improving Reliability of Plastic Encapsulated Ocean Technology Products by Understanding Moisture Ingress through FEA Simulation
Remote sensing products designed for ocean environments sustain the harshness of cold oceans. The reliability of these telemetry devices needs to be very high to measure,collect and transmit da
.. read more
A Control-Chart Based Method for Solder Joint Crack Detection
Many researchers have used different failure criteria in the published solder joint reliability studies. Since the reported timeto-
failure would be different if different failure criteria were
.. read more
What is Kelvin Test?
The PCB industry is ever changing and adapting to new technologies. OEM specifications and requirements have also advanced due to these technologies. In some cases the OEMs are asking for a low
.. read more
Electrical Testing of Passive Components
Substrates have become more critical with regard to pitch and density in today’s designs with challenges for passive components in terms of surface placement. This negates the opportunity for h
.. read more
Preparing for Increased Electrostatic Discharge Device Sensitivity
With the push for ever improving performance on semiconductor component I/O interfaces,semiconductor components are being driven into a realm which makes them more sensitive to electrostatic di
.. read more
Electrostatic Discharge (ESD),Factory Issues,Measurement Methods and Product Quality – Roadmaps and Solutions for 2025 to 2030
The number of failures caused by electrostatic discharges (ESD) has been increasing for some time now. So,it is necessary for everyone,who handles electrostatic sensitive devices (ESDS),to know
.. read more
Specialized Materials for Printed Electronics
In the area of Printed Electronics,there are a number of functional materials that can include conductors,Semi-conductors,dielectrics,barriers,and adhesives. There are also a smaller subset of
.. read more
The Total Environmental Solution For Any-Layer HDI Production
Copper Via-Fill application in acid copper plating of PWB is experiencing a significant growth due to the booming of smartphone and tablet PC. With this growth,the PC board demand of HDI comple
.. read more
The Perfect Copper Surface
In order to provide the functionality in today’s electronics,printed circuit boards are approaching the complexity of semiconductors. For flexible circuits with 1 mil lines and spaces,this mean
.. read more
Final Finish Specifications Review IPC Plating Sub-committee 4-14
An IPC specification is a consensus document that specifies attributes relevant to the plated surface. Plating specifications are designed to be applicable to a wide range of products types. A
.. read more
Signal Transmission Loss due to Copper Surface Roughness in
Higher-speed signal transmission is increasingly required on a printed circuit board to handle massive data in electronic systems. So,signal transmission loss of copper wiring on a printed circ
.. read more
Beyond 0402M Placement: Process Considerations for 03015M Microchip Mounting
The printed circuit board assembly industry has long embraced the “Smaller,Lighter,Faster” mantra for electronic devices,especially in our ubiquitous mobile devices. As manufacturers increase s
.. read more
Miniaturization with Help of Reduced Component to Component Spacing
Miniaturization and the integration of a growing number of functions in portable electronic devices require an extremely high packaging density for the active and passive components. There are
.. read more
Challenges of Manufacturing with Printed Circuit Board Cavities
Cavity technology in a Printed Circuit Board (PCB) has existed for many years. The methodology to create the cavity in the PCB has evolved over time as technologies have advanced and the manufa
.. read more
Alternative Concepts for High Speed,High Frequency and Signal Integration into the PCB
Transmission of data is a major driver in the electronics industry. Higher data volumes,high speed data transfer and short time signal transmission have to be realized to meet these requirement
.. read more
Printing of Solder Paste – A Quality Assurance Methodology
Solder paste printing is known to be one of the most difficult processes to quality assure in electronic manufacturing. The challenge increases as the technology development moves toward a mix
.. read more
Jetting Strategies for mBGAs a question of give and take...
The demands on volume delivery and positioning accuracy for solder paste deposits are increasing as the size and complexity of circuits continue to develop in the electronics industry. Accordin
.. read more
Implementing Embedded Component from Concept-To-Manufacturing
The utilization of embedded components has increased across many applications in various industries,and with rapid emergence of technologies and the need to secure IP,new methodologies are bein
.. read more