Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Does Solder Particle Size Impact the Electrical Reliability of a No-Clean Solder Paste Flux Residue
No-clean soldering processes continue to dominate the electronics manufacturing world,especially amongst consumer-type electronics. For many years,type 3 was pretty much the “standard” solder p
.. read more
Solderability and Reliability Evolution of no-Clean Solder Fluxes for Selective Soldering
Flux consumption for wave soldering tends to decrease,mainly due to its gradual replacement by reflow soldering methods (i.e. pin-in-paste) in many electronics applications. However,in several
.. read more
Factors Affecting the Adhesion of Thin Film Copper on Polyimide
The use of copper foils laminated to polyimide (PI) as flexible printed circuit board precursor is a standard practice in the PCB industry. We have previously described [1] an approach to very
.. read more
Approaches to Commercializing New Nano-Electronic Materials
•Nano-electronics potential
•Barriers to entry – and opportunities
•Examples
–Nano-solder
–Capacitor materials
–Graphene
•Opportunities for rapid commercialization?
.. read more
Improved Maintenance and Reliability for Large Volume Underfill Processes
An ever-increasing number of electronics assembly applications are using flip chip packages that require large volume underfill. Large volume underfill is typically defined as being for a die s
.. read more
A Review of Jetting Technologies for Fluid Dispensing - Identifying the Features that Influence Productivity
As consumer products continue to reduce in price,pressure is placed upon the manufacturing of sub-components for improving cost. Back in the mid-1990s,jet valves for fluid dispensing in electro
.. read more
Utility of Dual Applicators for Non-Atomized Conformal Coating to Improve High-Volume Manufacturing Optimization
Electronics manufacturers protect their circuit boards with conformal coatings. Conformal coatings serve as a barrier from environmental hazards and internal shorts,tin whiskers,and corrosion a
.. read more
PCB Sourcing Using PCQR
In a global market,it is often difficult to determine the best PCB suppliers for your technology needs,while also achieving the lowest costs for your products. Considering each PCB supplier has
.. read more
Test Method Development for Detecting Pitting/Crevice Corrosion Formation on Electronic Assemblies
Pitting/Crevice corrosion on printed circuit boards has not been well studied in the industry. This mechanism has been seen at small solder mask openings near circuit traces on printed circuit
.. read more
Condensation Testing - A New Approach
Conformal coatings are applied to protect electronic assemblies from adventitious environmental factors,which include,for example,corrosive gases,corrosive fluids and high humidity. Whenever th
.. read more
Effect of Permittivity and Dissipation Factor of Solder Mask Upon Measured Loss
Existing coated microstrip trace impedance estimation usually uses the dielectric constant (Dk) of solder mask ink measured at 1 MHz from its datasheet. Or,some printed circuit board (PCB) manu
.. read more
The Role of Organic Amines in Soldering Materials
The transition from eutectic tin-lead to lead-free soldering in electronic assembly,mandatedby the RoHS legislation, has brought great pressure and challenge to solder mater
.. read more
Dispelling the Black Magic of Solder Paste
Solder paste has long been viewed as “black magic”. This “black magic” can easily be dispelled through a solder paste evaluation. Unfortunately,solder paste evaluation can be a challenge for el
.. read more
Can Age and Storage Conditions Affect the SIR Performance of a No-Clean Solder Paste Flux Residue?
The SMT assembly world,especially within the commercial electronics realm,is dominated by no-clean solder paste technology. A solder paste flux residue that does not require removal is very att
.. read more
A Study on Using Solid State Relay (SSR) in Automatic Test Equipment
Reed relay is widely used in Automatic Test Equipment (ATE) for its high speed,low cost and wide availabilities. However,being mechanical relays,they have their share of limitations and this pa
.. read more
Make the Right Design Choices in Load Switching and Simulation in a High Current and Mechatronic Functional Test
In a typical mechatronic manufacturing functional test setup,actual load simulations are usually done by connecting the DUT outputs to power or ground in order to establish either a high or low
.. read more
Characterization of Solder Defects in Package on Packages with AXI Systems for Inspection Quality Improvement
As a part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls,we have conducted inspection of 3 level POP package by using a new AXI that capable of 3D-C
.. read more
Embedding Passive and Active Components: PCB Design and Fabrication Process Variations
Embedding components within the PC board structure is not a new concept. Until recently,however,most embedded component PC board applications adapted only passive elements. The early component
.. read more
What is needed to Successfully Introduce "Device Embedding Technology" in Design and Manufacturing of PCBs and PCBAs to Add Value to Your Products?
The embedding of components in electronic interconnection structures has been carried out for more than 30 years. It is regarded as the “poor men’s silicon device”. Different technologies have
.. read more
Important Considerations in the Design of Solderless Electronic Assemblies
Soldering has been a key process step in the manufacture of electronic assemblies since the earliest days of the electronics industry,it is also one of the most challenging processes to control
.. read more
Press Fit Technology Roadmap and Control Parameters for a High Performance Process
Press-fit technology is a proven and widely used and accepted interconnection method for joining electronics assemblies. Printed Circuit Board Assembly Systems and typical functional subassembl
.. read more
EMI-Caused EOS Sources in Automated Equipment
Electrical overstress causes damage to sensitive components,including latent damage. A significant source of EOS is high-frequency noise in automated manufacturing equipment. This paper analys
.. read more
A Case Study on Evaluating Manual and Automated Heat Sink Assembly using FEA and Testing
Proper assembly of components is critical in the manufacturing industry as it affects functionality and reliability. In a heat sink assembly,a detailed manual process is often utilized. However
.. read more
Effective Methods to Get Volatile Compounds Out of Reflow Process
Although reflow ovens may not have been dramatically changed during the last decade the reflow process changes step by step. With the introduction of lead-free soldering not only operation tem
.. read more
Materials Compatibility and Aging for Flux and Cleaner Combinations
A materials study of high reliability electronics cleaning is presented here. In Phase 1,mixed type substrates underwent a condensed contaminants application to view a worst-case scenario for
.. read more