Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Flexible Circuit Materials for High Temperature Applications
Many opportunities exist for flexible circuits in high temperature applications (Automotive,Military,Aerospace,Oil and Gas). Flex circuits in these applications have been hindered by a lack of
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Analysis of Laminate Properties for Correlation to Pad Cratering
Pad cratering failure has emerged due to the transition from traditional SnPb to SnAgCu alloys in soldering of printed circuit assemblies. Pb-free-compatible laminate materials in the printed c
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Thermally,Electrically Conductive Adhesive Manages to Control Heat in PCBs
Thermal management is a critical element in the design and manufacturing of printed circuit boards (PCBs) for a wide range of applications. Quite simply,heat can be destructive. The more effect
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A System of Producing High-Powered RF Circuit Boards Employing a Low-CTE,Thermally Engineered Metalized Layer
The paper will propose to present a technology for the fabrication of Printed Circuit Boards (PCBs),used primarily in high-power RF/millimeter wave applications,which involves the use of a ther
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Polyphenylene Ether Macromonomers - Cyanate Ester Laminates
The electronics industry is driven by constant technological changes,which have brought improved innovative products to the marketplace. These advances have placed high demands on material perf
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A Signal Integrity Measuring Methodology in the Extraction of Wide Bandwidth Environmental Coefficients
In technology tendency,signal integrity performance gets more critical upon today’s higher signal transmission speed and quantity demand in every field of applications such as computer CPU and
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Measuring Copper Surface Roughness for High Speed Applications
This paper examines the use of Light Interferometry and the relevant parameters used to measure copper surface roughness before and after oxide alternative. Also discussed are the limitations a
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Development of a Robust 03015 Process
Modern consumer electronics are driving the adoption of smaller featured SMT devices such as 0.4 mm or smaller pitch CSP,and 01005’’ / 0402 metric discrete devices. Already roadmaps have been s
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Device Miniaturization - The Impact of a High Density SoC Direct Chip Attach on Surface Mount and PCB Technologies
To keep up with shrinking system volume requirements for the Internet of Things and wearable devices while maintaining maximum device functionality requires an integrated approach to SoC and Si
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Overview Miniaturization on Large Form factor PCBA
The world of electronics continues to increase functional densities on products. Many of the miniaturization technologies were developed for the consumer market with the smart phone specificall
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An Alternative Solvent with Low Global Warming Potential
In the past 20 yrs the solvent industry has gone through a great deal of change. In the early 1990s,CFC-113 and 1,1,1-trichloroethane were the workhorses of the industry. The Montreal Protocol
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HCFC-225 Phaseout—What Now?
On January 1,2015,nine months from APEX 2014,the production and use restrictions on HCFC-225 will be in effect throughout the United States. This phase out is encompassing in scope. This phase
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Concentration Monitoring & Closed Loop Control – Phase 2
Historically,the determination of the concentration of cleaning agent in high precision electronic cleaning baths has depended on any one of several possible measurable parameters. Refractive I
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Combination of Spray and Soak Improves Cleaning under Bottom Terminations
The functional reliability of electronic circuits determines the overall reliability of the product in which the final products are used. Market forces including more functionality in smaller c
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Method for the Manufacture of an Aluminum Substrate PCB and its Advantages
RoHS legislated restrictions on the materials used in electronics manufacture have imparted significant challenges on the electronics industry since their introduction in 2006. The greatest imp
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Optimizing the Insulated Metal Substrate Application with Proper Material Selection and Circuit Fabrication
The ever expanding growth in the use of insulated metal substrates (IMS) in power electronics requires a focus on material and mechanical configuration for each application. By optimizing the m
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Advanced Thermal Management Solutions on PCBs for High Power Applications
With increasing power loss of electrical components,thermal performance of an assembled device becomes one of the most important quality factors in electronic packaging. Due to the rapid advanc
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Print Performance Studies Comparing Electroform and Laser-Cut Stencils
There has been recent activity and interest in Laser-Cut Electroform blank foils as an alternative to normal Electroform stencils. The present study will investigate and compare the print perfo
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Quantifying Stencil Aperture Wall Quality
The goal of this study was to develop a method by which stencil aperture wall quality can be inspected,and the results quantified. Additionally,we hope to establish a correlation between the st
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Development,Testing and Implementation of SAMP-Based Stencil Nano Coatings
Stencil nanocoatings have demonstrated significant improvements in numerous aspects of solder paste printing,including print yield,transfer efficiency,print definition and under wipe requiremen
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Numerical Study on New Pin Pull Test for Pad Cratering Of PCB
Pad cratering is an important failure mode besides crack of solder joint as it’ll pass the regular test but have impact on the long term reliability of the product. A new pin pull test method w
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Pad Cratering Susceptibility Testing with Acoustic Emission
Pad cratering test methods have been under development with the emergence of this laminate fracture defect mechanism. In additional to ball shear,ball pull,and pin pull testing methods,the acou
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Novel Approaches for Minimizing Pad Cratering
With the electronic industry moving towards lead-free assembly,traditional SnPb-compatible laminates need to be replaced with lead-free compatible laminates that can withstand the higher reflow
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Why Generic Automation will Change the Electronics Manufacturing Services Industry
As the Electronic Manufacturing Services (EMS) industry makes a push to bring manufacturing back to the United States it is clear that automation is necessary in order to keep prices competitiv
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New Placement Technology for Rework Systems
In the fast developing electronic industry the demands for production equipment are changing rapidly as well. The industry is looking for both,stable production processes and automated procedur
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