Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Hi Pot Dielectric Breakdown Automated Verification How-To
The Printed Circuit Board (PCB) builds get ever more complex. With this the layer counts climb but the overall thickness remains the same. From this the cores of the build are reduced and the d
.. read more
Two Print Stencils Systems
The Two print stencils process has been a very useful tool in SMT Assembly and Package Assembly. It is also useful in Assemblies that require mixed technologies; including SMT / Through Hole,SM
.. read more
Profiled Squeegee Blade: Rewrites the Rules for Angle of Attack
For centuries,the squeegee blade has been used throughout many applications for depositing viscous materials through screens and stencils to transfer images on to substrates,from cloth material
.. read more
Evaluating the Accuracy of a Nondestructive Thermo Couple Attach Method for Area Array Package Profiling
The oven recipe,which consists of the reflow oven zone temperature settings and the speed of the conveyor,will determine a specific time-temperature profile for a given PCB assembly. In order t
.. read more
Military Applications of Flexible Circuits
1.Conventional Flex
2.Basic Materials
3.Failure Modes
4.HDI Flex
Summary,conventional builds
Cautions in Design
•Average or above Design Expertise Required
–PTH to close to edge of part
–Panel
.. read more
Direct Determination of Phosphorus Content in Electroless Nickel Plating Using X-ray Fluorescence (XRF) Spectroscopy
Electroless plating processes are popular because of their performance,reliability and cost effectiveness. The process combines unique deposit properties such as uniform plating build up regard
.. read more
Via Filling: Challenges for the Chemistry in the Plating Process
Copper filling of laser drilled blind micro vias (BMV´s) is now the standard production method for high density interconnects. Copper filled BMV´s are used as solder bump sites for IC packaging
.. read more
Sources in A Production Line (SMT) and Solutions against ESD (Electrostatic Discharge) - Requirements Today and In The Future
The structures of electronic components become smaller and smaller. 5 volts or smaller voltage of an electrostatic charge are enough to damage or change the structures in small electronic compo
.. read more
Big Ideas on Miniaturisation
The next generation miniaturised SMT devices waiting to make their mark will require the assembly community to re think their processes and toolsets. The feature sizes that are involved in this
.. read more
Low Surface Energy Coatings,Rewrites the Area Ratio Rules
Paste release characteristics are driven by the Area Ratio formula,which is based upon conventional stencil foil materials such as a variety of stainless steel alloys,nickel,etc. The surface en
.. read more
Printing and Assembly Challenges for QFN Devices
Although QFN devices present a challenge to the SMT assembly process with proper stencil design,proper stencil technology selection (Laser,Electroform,Nano-Coat),and proper PCB solder mask layo
.. read more
Reliability Performance of Very Thin Printed Circuit Boards with regard to Different any-Layer Manufacturing Technologies
The next generation of smart phones will demand very thin multi-layer boards to reduce the product thickness again. This paper shows three different manufacturing approaches,which can be used f
.. read more
Controlling Moisture During Inner Layer Processing
•Two primary failure modes from trapped moisture:
•Premature resin decomposition from incomplete resin cross-linking.
•Explosive vaporization during high temperature thermal exposure.
.. read more
Micro Trace Resistive Technology
Micro Trace Resistor Technology allows thin film resistors to be built within a printed circuit trace that is less than 100 microns wide. Using standard subtractive printed circuit board proces
.. read more
Effect of Toughening and E-Glass Sizing on Fracture Toughness and Delamination in High Thermal Stability Electrical Laminates
In this work we report results of the fracture toughness of a high thermal stability resin system toughened by The Dow Chemical Company proprietary particulate-type toughening material. Results
.. read more
QFN Voiding Control Via Solder Mask Patterning On Thermal Pad
•Voiding of QFN a concern due to large thermal pad,low standoff,and many thermal via
•Divided thermal pad preferred,with SMD better than NSMD
•This work focus on systematic study on effect of S
.. read more
Fluxless Die Attach by Activated Forming Gas
Eutectic god-tin (Au80Sn20) is widely used as the die-attach material for making radio-frequency (RF) and microwave devices. The metallic bonding is typically achieved by soldering using a gold
.. read more
Building HDI Structures using Thin Films and Low Temperature Sintering Paste
Circuit complexity and density requirements continue to push PCB fabrication capability limits. Component pitch and routing requirements are continually becoming more aggressive and difficult t
.. read more
Exploring the High Temperature Reliability Limits for Silicone Adhesives
The thermal stability of silicone polymers,fluids and resins has been well documented and studied extensively. The high temperature performance of silicone adhesives and sealants used for elect
.. read more
Plasma Polymerization: A Versatile and Attractive Process for Conformal Coating
The use of plasma processing in the manufacture of electronics is growing as we discover more and more applications for this technology. It is now common for plasma etching and cleaning to be u
.. read more
Mobile Electronics,How to Protect Internal Circuitry from A Harsh Environment
The portable electronics market has driven steep-slope growth for over a decade and continues to deliver amazing handheld electronic devices; manufacturers of these products are facing challeng
.. read more
Evaluating Corrosion Resistance of Ceramic Resistors: Mixed Flowing Gas versus Flower of Sulfur Tests
Multi-layer organic laminates which make up over 90% of the present types of interconnecting substrates in today’s electronics can develop a loss of insulation resistance between two biased con
.. read more
New High-Performance Organophosphorus Flame Retardant
A new non-halogen flame retardant has been developed and is useful for a variety of high performance applications. This
non-reactive phosphorus-based material satisfies fire safety needs for a
.. read more
Qualification of Solder Beading and Tombstoning in Passive Devices using Designed Experiments
Solder beading and tombstoning are observed increasingly with chip components as their size decreases. This is
even more crucial in today’s packaging,due to the high ratio of passive components
.. read more
Potential Global Warming Contribution from a Typical Electronics
Examination of historical data for a defunct electronics manufacturing plant in Ontario,Canada has allowed the
determination of the potential global warming contribution by the plant for the ye
.. read more
Cleaning in an HDI World
Electronic assembly innovations drive more performance using highly dense interconnects. Assembly residues may increase the risk of premature failure or improper functionality. The challenge fo
.. read more
QFN Flux Entrapment Case Study
The presentation will discuss the problems that many QFN users are dealing with by having flux trapped under the component that is still gooey and conductive and the effect on circuit performan
.. read more
Printing and Assembly Challenges for QFN Devices
QFN’s offer advantages in reducing size and weight and have excellent thermal and electrical Conductivity related to the ground plane. QFN’s also present printing and assembly challenges includ
.. read more
Hi Pot Dielectric Breakdown Automated Verification How-To
The Printed Circuit Board (PCB) builds get ever more complex. With this the layer counts climb but the overall thickness remains the same. From this the cores of the build are reduced and the d
.. read more
Two Print Stencils Systems
The Two print stencils process has been a very useful tool in SMT Assembly and Package Assembly. It is also useful in Assemblies that require mixed technologies; including SMT / Through Hole,SM
.. read more
Profiled Squeegee Blade: Rewrites the Rules for Angle of Attack
For centuries,the squeegee blade has been used throughout many applications for depositing viscous materials through screens and stencils to transfer images on to substrates,from cloth material
.. read more
Evaluating the Accuracy of a Nondestructive Thermo Couple Attach Method for Area Array Package Profiling
The oven recipe,which consists of the reflow oven zone temperature settings and the speed of the conveyor,will determine a specific time-temperature profile for a given PCB assembly. In order t
.. read more
Military Applications of Flexible Circuits
1.Conventional Flex
2.Basic Materials
3.Failure Modes
4.HDI Flex
Summary,conventional builds
Cautions in Design
•Average or above Design Expertise Required
–PTH to close to edge of part
–Panel
.. read more
Direct Determination of Phosphorus Content in Electroless Nickel Plating Using X-ray Fluorescence (XRF) Spectroscopy
Electroless plating processes are popular because of their performance,reliability and cost effectiveness. The process combines unique deposit properties such as uniform plating build up regard
.. read more
Via Filling: Challenges for the Chemistry in the Plating Process
Copper filling of laser drilled blind micro vias (BMV´s) is now the standard production method for high density interconnects. Copper filled BMV´s are used as solder bump sites for IC packaging
.. read more
Sources in A Production Line (SMT) and Solutions against ESD (Electrostatic Discharge) - Requirements Today and In The Future
The structures of electronic components become smaller and smaller. 5 volts or smaller voltage of an electrostatic charge are enough to damage or change the structures in small electronic compo
.. read more
Big Ideas on Miniaturisation
The next generation miniaturised SMT devices waiting to make their mark will require the assembly community to re think their processes and toolsets. The feature sizes that are involved in this
.. read more
Low Surface Energy Coatings,Rewrites the Area Ratio Rules
Paste release characteristics are driven by the Area Ratio formula,which is based upon conventional stencil foil materials such as a variety of stainless steel alloys,nickel,etc. The surface en
.. read more
Printing and Assembly Challenges for QFN Devices
Although QFN devices present a challenge to the SMT assembly process with proper stencil design,proper stencil technology selection (Laser,Electroform,Nano-Coat),and proper PCB solder mask layo
.. read more
Reliability Performance of Very Thin Printed Circuit Boards with regard to Different any-Layer Manufacturing Technologies
The next generation of smart phones will demand very thin multi-layer boards to reduce the product thickness again. This paper shows three different manufacturing approaches,which can be used f
.. read more
Controlling Moisture During Inner Layer Processing
•Two primary failure modes from trapped moisture:
•Premature resin decomposition from incomplete resin cross-linking.
•Explosive vaporization during high temperature thermal exposure.
.. read more
Micro Trace Resistive Technology
Micro Trace Resistor Technology allows thin film resistors to be built within a printed circuit trace that is less than 100 microns wide. Using standard subtractive printed circuit board proces
.. read more
Effect of Toughening and E-Glass Sizing on Fracture Toughness and Delamination in High Thermal Stability Electrical Laminates
In this work we report results of the fracture toughness of a high thermal stability resin system toughened by The Dow Chemical Company proprietary particulate-type toughening material. Results
.. read more
QFN Voiding Control Via Solder Mask Patterning On Thermal Pad
•Voiding of QFN a concern due to large thermal pad,low standoff,and many thermal via
•Divided thermal pad preferred,with SMD better than NSMD
•This work focus on systematic study on effect of S
.. read more
Fluxless Die Attach by Activated Forming Gas
Eutectic god-tin (Au80Sn20) is widely used as the die-attach material for making radio-frequency (RF) and microwave devices. The metallic bonding is typically achieved by soldering using a gold
.. read more
Building HDI Structures using Thin Films and Low Temperature Sintering Paste
Circuit complexity and density requirements continue to push PCB fabrication capability limits. Component pitch and routing requirements are continually becoming more aggressive and difficult t
.. read more
Exploring the High Temperature Reliability Limits for Silicone Adhesives
The thermal stability of silicone polymers,fluids and resins has been well documented and studied extensively. The high temperature performance of silicone adhesives and sealants used for elect
.. read more
Plasma Polymerization: A Versatile and Attractive Process for Conformal Coating
The use of plasma processing in the manufacture of electronics is growing as we discover more and more applications for this technology. It is now common for plasma etching and cleaning to be u
.. read more
Mobile Electronics,How to Protect Internal Circuitry from A Harsh Environment
The portable electronics market has driven steep-slope growth for over a decade and continues to deliver amazing handheld electronic devices; manufacturers of these products are facing challeng
.. read more
Evaluating Corrosion Resistance of Ceramic Resistors: Mixed Flowing Gas versus Flower of Sulfur Tests
Multi-layer organic laminates which make up over 90% of the present types of interconnecting substrates in today’s electronics can develop a loss of insulation resistance between two biased con
.. read more
New High-Performance Organophosphorus Flame Retardant
A new non-halogen flame retardant has been developed and is useful for a variety of high performance applications. This
non-reactive phosphorus-based material satisfies fire safety needs for a
.. read more
Qualification of Solder Beading and Tombstoning in Passive Devices using Designed Experiments
Solder beading and tombstoning are observed increasingly with chip components as their size decreases. This is
even more crucial in today’s packaging,due to the high ratio of passive components
.. read more
Potential Global Warming Contribution from a Typical Electronics
Examination of historical data for a defunct electronics manufacturing plant in Ontario,Canada has allowed the
determination of the potential global warming contribution by the plant for the ye
.. read more
Cleaning in an HDI World
Electronic assembly innovations drive more performance using highly dense interconnects. Assembly residues may increase the risk of premature failure or improper functionality. The challenge fo
.. read more
QFN Flux Entrapment Case Study
The presentation will discuss the problems that many QFN users are dealing with by having flux trapped under the component that is still gooey and conductive and the effect on circuit performan
.. read more
Printing and Assembly Challenges for QFN Devices
QFN’s offer advantages in reducing size and weight and have excellent thermal and electrical Conductivity related to the ground plane. QFN’s also present printing and assembly challenges includ
.. read more