Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
A Robot’s Place in SMT
The SMT industry’s one constant is change. Standards are continually updated and components are miniaturized for space savings. In addition to the changes that come,the industry is also faced w
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Lead-Free Nanosolder Based Nanomaterials Assembly and Integration
Nanomaterials have shown great promise in various applications including nanoelectronics and devices. However,in order to achieve large-scale nanoelectronics assembly and manufacturing,the deve
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Embedded Fibers Enhance Nano-Scale Interconnections
While the density of chip-to-chip and chip-to-package component interconnections increases and their size decreases the ease
of manufacture and the interconnection reliability are being reduced
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NanoCopper Based Solder-free Electronic Assembly Material
The Advanced Technology Center of the Lockheed Martin Corporation has developed a nanotechnology enabled copper-based electrical interconnect material that can be processed around 200 °C. The r
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An Experimental Approach to Characterising CAF
The electrochemical short,Conductive Anodic Filamentation,that that can develop within a PCB can be difficult to diagnose and detect,and there are many material and process issues that can lead
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Printed Circuit Board Fabrication Processes and Their Effects on Fine Copper Barrel Cracks
The onset of copper barrel cracks is typically induced by the presence of manufacturing defects. In the absence of discernible manufacturing defects,the causes of copper barrel cracks in printe
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An Examination of Glass-fiber and Epoxy Interface Degradation in Printed Circuit Boards
Conductive filament formation or CAF typically occurs in two steps: degradation of the resin/glass fiber bond followed by an electrochemical reaction. Bond degradation provides a path along whi
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New Requirements for Sir- Measurement
During the last period of newly assembled electrical devices (pcbs),new component types like LGA and QFN were also qualified as well as smaller passive components with reliability requirements
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Reliability Assessment of No-clean and Water-soluble Solder Pastes Part II
Looking back twenty-five years ago,the solder pastes residues had to be cleaned after reflow due to their corrosive nature; two ways of cleaning were possible,either with solvent or by using wa
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Reliability Assessment of No-clean and Water-soluble Solder Pastes Part II
Looking back twenty-five years ago,the solder pastes residues had to be cleaned after reflow due to their corrosive nature; two ways of cleaning were possible,either with solvent or by using wa
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The Effect of Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues
An estimated 80% of all SMT assembly in the world is performed with a no-clean soldering process,largely due to the
predominance of consumer-type electronics. The continuing trend of increasing
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Low Cost High Reliability Assembly of POP with Novel Epoxy Flux on Solder Paste
A novel epoxy flux was developed with good compatibility with no-clean solder pastes,which imparts high reliability for BGA assembly at a low cost. This compatibility with solder pastes is achi
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An Investigation into Printing Miniaturised Devices for the Automotive and Industrial Manufacturing Sectors
The electronics market is divided into many segments each having its own challenges; but one theme that connects the electronics community together is a need for higher yield with lower costs.
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Enclosed Media Printing as an Alternative to Metal Blades
Fine pitch/fine feature solder paste printing in PCB assembly has become increasingly difficult as board geometries have become ever more compact. The printing process itself,traditionally the
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Cost Comparison of Complex PCB fabrication Using Traditional Sequential Lamination Methods versus Interconnect with Conductive Paste
As feature sizes are driven to be smaller,the cost of PCB fabrication is driven higher. In particular,sequential lamination of complex circuit boards is a time consuming and expensive process.
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Effect of Microwave Plasma Surface Treatement for Improved Adhesion Strength of Direct Copper Plating on Polterafluoroethylene (PTFE)
The purpose of this study is to investigate the effect of plasma surface modification to improve adhesion strength between polytetrafluoroethylene (PTFE) and directly plated electroless copper.
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Harnessing Technology for the Warfighter
Mr. Craig Herndon & Mr. Roger Smith will be discussing the Navy’s assignment as the DoD Executive Agent for Printed Circuit Board (PrCB) Technology and its role in ensuring that viable military
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From Off-Shoring to On-Shoring to Regional Strategy
Since the late 1990s,the globalization of the electronics industry has put North American and European manufacturers in competition with manufacturers in China and other low-labor-cost areas.
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The Return to Regionalization for Electronics Manufacturing
One of the more notable trends in the data on electronics manufacturing over the past several years has been a return to regionalization. Defined as building in region for region,this trend is
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Position Accuracy Machines for Selective Soldering Fine Pitch Components
The drive towards fine pitch technology also affects the soldering processes. Selective soldering is a reliable soldering process for THT (through hole) connectors and offers a wide process win
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Study of Various PCBA Surface Finishes
In this study various printed circuit board surface finishes were evaluated,including: organic solderability preservative (OSP),plasma finish (PF),immersion silver (IAg),electroless nickel / im
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Reliability Screening of Lower Melting Point Pb-Free Alloys Containing Bi
This paper is the second of two papers discussing the companies Lower Melt Alloy program. The first paper was presented at IPC APEX2013. The program explores the manufacturability and reliabili
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Voiding and Drop Test Performance of Lead-Free Low Melting and Medium Melting Mixed Alloy BGA Assembly
Low melting 57Bi42Sn1Ag (BiSnAg) was explored for replacing SAC solders as a low-cost solution. In this study,BGAs with SAC105,SAC305,and BiSnAg balls were assembled with SAC105,SAC305 or 57Bi4
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HALT Testing of Backward Soldered BGAs on a Military Product
The move to lead free (Pb-free) electronics by the commercial industry has resulted in an increasing number of ball grid array components (BGAs) which are only available with Pb-free solder bal
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