Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Electrostatic Discharge (ESD),Factory Issues,Measurement Methods and Product Quality – Roadmaps and Solutions for 2025 to 2030
The number of failures caused by electrostatic discharges (ESD) has been increasing for some time now. So,it is necessary for everyone,who handles electrostatic sensitive devices (ESDS),to know
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Specialized Materials for Printed Electronics
In the area of Printed Electronics,there are a number of functional materials that can include conductors,Semi-conductors,dielectrics,barriers,and adhesives. There are also a smaller subset of
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The Total Environmental Solution For Any-Layer HDI Production
Copper Via-Fill application in acid copper plating of PWB is experiencing a significant growth due to the booming of smartphone and tablet PC. With this growth,the PC board demand of HDI comple
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The Perfect Copper Surface
In order to provide the functionality in today’s electronics,printed circuit boards are approaching the complexity of semiconductors. For flexible circuits with 1 mil lines and spaces,this mean
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Final Finish Specifications Review IPC Plating Sub-committee 4-14
An IPC specification is a consensus document that specifies attributes relevant to the plated surface. Plating specifications are designed to be applicable to a wide range of products types. A
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Signal Transmission Loss due to Copper Surface Roughness in
Higher-speed signal transmission is increasingly required on a printed circuit board to handle massive data in electronic systems. So,signal transmission loss of copper wiring on a printed circ
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Beyond 0402M Placement: Process Considerations for 03015M Microchip Mounting
The printed circuit board assembly industry has long embraced the “Smaller,Lighter,Faster” mantra for electronic devices,especially in our ubiquitous mobile devices. As manufacturers increase s
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Miniaturization with Help of Reduced Component to Component Spacing
Miniaturization and the integration of a growing number of functions in portable electronic devices require an extremely high packaging density for the active and passive components. There are
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Challenges of Manufacturing with Printed Circuit Board Cavities
Cavity technology in a Printed Circuit Board (PCB) has existed for many years. The methodology to create the cavity in the PCB has evolved over time as technologies have advanced and the manufa
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Alternative Concepts for High Speed,High Frequency and Signal Integration into the PCB
Transmission of data is a major driver in the electronics industry. Higher data volumes,high speed data transfer and short time signal transmission have to be realized to meet these requirement
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Printing of Solder Paste – A Quality Assurance Methodology
Solder paste printing is known to be one of the most difficult processes to quality assure in electronic manufacturing. The challenge increases as the technology development moves toward a mix
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Jetting Strategies for mBGAs a question of give and take...
The demands on volume delivery and positioning accuracy for solder paste deposits are increasing as the size and complexity of circuits continue to develop in the electronics industry. Accordin
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Implementing Embedded Component from Concept-To-Manufacturing
The utilization of embedded components has increased across many applications in various industries,and with rapid emergence of technologies and the need to secure IP,new methodologies are bein
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Embedded Components: A Comparative Analysis of Reliability Part II
In light of new process and product technologies in the field of embedded components,questions arise with respect to advantages and potential disadvantages to standard SMT component placement w
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Reliability of Embedded Planar Capacitors: A Review
Embedded capacitors offer board designers the ability to address the demands of high switching speeds and high I/O count packages while stemming the proliferation of minute decoupling capacitor
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Tin Whisker Risk Management by Conformal Coating
The objective of this study is to evaluate conformal coatings for mitigation of tin whisker growth. The conformal coatings chosen for the experiment are acrylic,polyurethane and parylene. The c
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Testing Printed Circuit Boards for Creep Corrosion in Flowers of Sulfur Chamber
The iNEMI technical subcommittee on creep corrosion is developing a flowers-of-sulfur (FOS) based qualification test for creep corrosion on printed-circuit boards (PCBs). The test setup consist
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Effectiveness of Conformal Coat to Prevent Corrosion of Nickel-palladium-gold-finished Terminals
Nickel-palladium-gold-finished terminals are susceptible to creep corrosion. Excessive creep corrosion can result in device failure due to insulation resistance loss between adjacent terminals.
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The Effect of Radiation Losses on High Frequency PCB Performance
This paper is an extension of an IPC paper [1] presented last year which addressed microwave insertion loss of common PCB transmission line circuits. Insertion loss of these circuits is made up
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Insertion Loss Reduction through Non-Roughening Inner-Layer Surface Treatments
As channel speeds approach 25 Gbps,near the expected maximum bandwidth for traditional copper-based PCBs,every available tool to minimize total insertion loss in the board material system will
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Solder Paste Stencil Design for Optimal QFN Yield and Reliability
The use of bottom terminated components (BTC) has become widespread,specifically the use of Quad Flat No-lead (QFN) packages. The small outline and low height of this package type,improved elec
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Reliability Study of Bottom Terminated Components
Bottom terminated components (BTC) are leadless components where terminations are protectively plated on the underside of the package. They are all slightly different and have different names,s
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AXI Applications with BTC and Connectors in Flextronics
Bottom Termination surface mount Components (BTC) are extremely popular because of their low cost,low stand-off height and excellent thermal and electrical properties. In this manufacturing are
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