Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Assembly Challenges of Bottom Terminated Components
Bottom terminated component (BTC) assembly has rapidly increased in recent years. This type of package is attractive due to its low cost and good functional performance (improved signal speeds
.. read more
Pb-Free Selective Wave Solder Guidelines for Thermally Challenging PCBs
As the use of lead-free alloys has increased in electronic assemblies,much work has been done to develop Design for Manufacturability (DFM) guidelines for the new materials. However,there are s
.. read more
Hot nitrogen for wave soldering
- Hot nitrogen technology for local inerting system of wave
soldering machines has proved to give significant advantages with Tin Lead or Lead free solders:
- Better heat transfer on the PCBs,e
.. read more
Step Stress Testing of Solid Tantalum Capacitors
Solid tantalum capacitors were introduced to the market more than five decades ago and continue to be widely used. Reliability issues arise when tantalum capacitors are exposed to excessive the
.. read more
Flip Chip Package Qualification of RF-IC Packages
Quad Flat Pack No Leads (QFNs) are thermally enhanced plastic packages that use conventional copper leadframe with wire bonded interconnects. . These leadless components provide an advanced pac
.. read more
Effect of Chemical and Processing Parameters on Hole Filling Characteristics of Copper Electroplating
Miniaturization and increased functionality demands of electronics have substantially decreased the sizes of electronic features that need to be plated. The circuit density of printed circuit d
.. read more
New Challenges for Higher Aspect Ratio: Filling Through holes and Blind Micro Vias with Copper by Reverse Pulse Plating
This paper presents systematic investigations on complete Through Hole filling for cores by a Cu electroplating process as an alternative to the common paste plugging process. This electro plat
.. read more
PTH Core-to-Core Interconnect Using Sintered Conductive Pastes
The market for high-layer-count printed circuit boards (PCB) containing blind and buried vias was once relatively small,and
focused on specialized applications in the military and high end comp
.. read more
iNEMI HFR-Free Signal Integrity Project: An Investigation to Identify Degradation of Electrical Signals in HFR-Free PCB Materials
Recent environmental concerns over the safety of the halogenated flame retardants (HFR) used in commonplace FR4 printed
circuit boards (PCB) have prompted market demand for HFR-free computer sy
.. read more
iNEMI HFR-Free PCB Materials Team Project: An Investigation to Identify Technology Limitations Involved in Transitioning to HFR-Free PCB Materials
In response to a growing concern within the Electronic Industry to the transition to Halogen-Free laminates (HFR-Free)
within the Client Market space (Desktop and Notebook computers) iNEMI init
.. read more
Choosing a Low-Cost Alternative to Sac Alloys for PCB Assembly
Developing low-cost alternatives to near-eutectic SAC alloys for Pb-free assembly is crucial to continue producing affordable electronics products. Metals prices,especially silver,have been on
.. read more
Drop Test Performance of Bga Assembly Using Sac105ti Solder Spheres
Board-level drop test performance was evaluated and compared for the following four different solder combinations in
BGA/CSP assembly: 1) SnPb paste with SnPb balls,2) SnPb paste with SAC105Ti
.. read more
Low Cycle Fatigue Behaviour of Multi-joint Sample in Mechanical Testing
This paper explores the behaviour of a copper test vehicle with multiple reflowed solder joints,which has direct relevance to ball grid arrays (BGA) and high density interconnect structures. Th
.. read more
An Evaluation of the Insulation Resistance and Surface Contamination of Printed Circuit Board Assemblies
The overall effectiveness of 20 circuit board assembly processes,made up of 4 solder/flux combinations and 6 cleaning processes was investigated by using in-situ surface insulation resistance m
.. read more
Correlation of Sir,Halide/Halogen,and Copper Mirror Tests
With the advent of RoHS and WEEE and the concern of some companies to eliminate halogen-containing compounds from their products,it is vital to have an understanding of halogen compounds and ho
.. read more
Effect of Silicone Conformal Coating on Surface Insulation Resistance (SIR) For Printed Circuit Board Assemblies.
Conformal coatings are considered a method of providing corrosion protection to electrical assemblies used in high-humidity or harsh environments. They are applied to PCBs for various reasons:
.. read more
Testing – Understanding the Proper Testing Processes and Requirements for Electronics,Electronic Components and Printed Circuit Boards
As the need for electronics,electronic components and printed circuit boards becomes more important; the testing of products for these industries becomes a critical component. New materials,new
.. read more
Overcoming Logistic,Economic and Technical Challenges to Implementing Functional Test in High Mix / High Volume Production Environments
Functional circuit test (FCT) of circuit boards and end products in a high volume (>1000 units per day) production environment presents challenging technical,logistic and cost obstacles that ar
.. read more
IPC 9252A Electrical Test Considerations & Military Specifications versus Electrical Test (Know Your Specifications,Revisions and Amendments)
The PCB industry has advanced significantly in the recent millennium. OEM specifications and requirements have also advanced due to the maturing technologies. With this the requirements of Elec
.. read more
Newest ED-Copper Foils for Low Loss / High Speed PCBs and for IC-Packaging
The latest status of new ED copper foil developments is presented: ultra-flat profile for high speed digital boards and ultra-thin foil for finest pitch applications.
Copper surface roughness h
.. read more
Determination of Copper Foil Surface Roughness from Micro-section Photographs
Specification and control of surface roughness of copper conductors within printed circuit boards (PCBs) are increasingly desirable in multi-GHz designs as a part of signal-integrity failure an
.. read more
A Designed Experiment for the Influence of Copper Foils on Impedance,DC Line Resistance and Insertion Loss
For the last couple of years,the main concerns regarding the electrical performance of blank PCB boards were impedance and ohmic resistance. Just recently,the need to reduce insertion loss came
.. read more
Effect of Silicone Contamination on Assembly Processes
Silicone contamination is known to have a negative impact on assembly processes such as soldering,adhesive bonding,coating,and wire bonding. In particular,silicone is known to cause de-wetting
.. read more
Impact of Dust on Printed Circuit Assembly Reliability
Atmospheric dust consists of solids suspended in air. Dust is well known for its complex nature. It normally includes inorganic mineral materials,water soluble salts,organic materials,and a sma
.. read more
Coating Thickness Measurement of Thin Gold and Palladium Coatings on Printed Circuit Boards using X-Ray Fluorescence
- DD Detector is State of the Art
- Software: Addressing all measurement challenges; Measurement Results for Au,Pd and Ni(P),independent of substrate material
- Traceability and Reproducibility
.. read more
Direct Digital SM Printing Using Inkjet Technology
•What is Digital Printing
•Ink Jet Technology
•Printing SM using Ink Jet
- Highlights
- Zero clearance technology
- Product improvements
- PCB shops,end users and designers
.. read more
Application of the Advanced Activator Technology on Halogen-Free Lead-Free Solder Paste Development
The Surface Mount Technology (SMT) industry has been faced with several challenges in the past decades. Two of the most recent ones are RoHS compliant lead-free assembly and the adoption of fin
.. read more
The Effect of Powder Surface Area and Oxidation on the Voiding Performance of PoP Solder Pastes
With the miniaturization of components in the semiconductor industry,the need for specialized solder pastes with finer
powder mesh sizes for package-on-package (PoP) assemblies has become imper
.. read more
Assembly Challenges of Bottom Terminated Components
Bottom terminated component (BTC) assembly has rapidly increased in recent years. This type of package is attractive due to its low cost and good functional performance (improved signal speeds
.. read more
Pb-Free Selective Wave Solder Guidelines for Thermally Challenging PCBs
As the use of lead-free alloys has increased in electronic assemblies,much work has been done to develop Design for Manufacturability (DFM) guidelines for the new materials. However,there are s
.. read more
Hot nitrogen for wave soldering
- Hot nitrogen technology for local inerting system of wave
soldering machines has proved to give significant advantages with Tin Lead or Lead free solders:
- Better heat transfer on the PCBs,e
.. read more
Step Stress Testing of Solid Tantalum Capacitors
Solid tantalum capacitors were introduced to the market more than five decades ago and continue to be widely used. Reliability issues arise when tantalum capacitors are exposed to excessive the
.. read more
Flip Chip Package Qualification of RF-IC Packages
Quad Flat Pack No Leads (QFNs) are thermally enhanced plastic packages that use conventional copper leadframe with wire bonded interconnects. . These leadless components provide an advanced pac
.. read more
Effect of Chemical and Processing Parameters on Hole Filling Characteristics of Copper Electroplating
Miniaturization and increased functionality demands of electronics have substantially decreased the sizes of electronic features that need to be plated. The circuit density of printed circuit d
.. read more
New Challenges for Higher Aspect Ratio: Filling Through holes and Blind Micro Vias with Copper by Reverse Pulse Plating
This paper presents systematic investigations on complete Through Hole filling for cores by a Cu electroplating process as an alternative to the common paste plugging process. This electro plat
.. read more
PTH Core-to-Core Interconnect Using Sintered Conductive Pastes
The market for high-layer-count printed circuit boards (PCB) containing blind and buried vias was once relatively small,and
focused on specialized applications in the military and high end comp
.. read more
iNEMI HFR-Free Signal Integrity Project: An Investigation to Identify Degradation of Electrical Signals in HFR-Free PCB Materials
Recent environmental concerns over the safety of the halogenated flame retardants (HFR) used in commonplace FR4 printed
circuit boards (PCB) have prompted market demand for HFR-free computer sy
.. read more
iNEMI HFR-Free PCB Materials Team Project: An Investigation to Identify Technology Limitations Involved in Transitioning to HFR-Free PCB Materials
In response to a growing concern within the Electronic Industry to the transition to Halogen-Free laminates (HFR-Free)
within the Client Market space (Desktop and Notebook computers) iNEMI init
.. read more
Choosing a Low-Cost Alternative to Sac Alloys for PCB Assembly
Developing low-cost alternatives to near-eutectic SAC alloys for Pb-free assembly is crucial to continue producing affordable electronics products. Metals prices,especially silver,have been on
.. read more
Drop Test Performance of Bga Assembly Using Sac105ti Solder Spheres
Board-level drop test performance was evaluated and compared for the following four different solder combinations in
BGA/CSP assembly: 1) SnPb paste with SnPb balls,2) SnPb paste with SAC105Ti
.. read more
Low Cycle Fatigue Behaviour of Multi-joint Sample in Mechanical Testing
This paper explores the behaviour of a copper test vehicle with multiple reflowed solder joints,which has direct relevance to ball grid arrays (BGA) and high density interconnect structures. Th
.. read more
An Evaluation of the Insulation Resistance and Surface Contamination of Printed Circuit Board Assemblies
The overall effectiveness of 20 circuit board assembly processes,made up of 4 solder/flux combinations and 6 cleaning processes was investigated by using in-situ surface insulation resistance m
.. read more
Correlation of Sir,Halide/Halogen,and Copper Mirror Tests
With the advent of RoHS and WEEE and the concern of some companies to eliminate halogen-containing compounds from their products,it is vital to have an understanding of halogen compounds and ho
.. read more
Effect of Silicone Conformal Coating on Surface Insulation Resistance (SIR) For Printed Circuit Board Assemblies.
Conformal coatings are considered a method of providing corrosion protection to electrical assemblies used in high-humidity or harsh environments. They are applied to PCBs for various reasons:
.. read more
Testing – Understanding the Proper Testing Processes and Requirements for Electronics,Electronic Components and Printed Circuit Boards
As the need for electronics,electronic components and printed circuit boards becomes more important; the testing of products for these industries becomes a critical component. New materials,new
.. read more
Overcoming Logistic,Economic and Technical Challenges to Implementing Functional Test in High Mix / High Volume Production Environments
Functional circuit test (FCT) of circuit boards and end products in a high volume (>1000 units per day) production environment presents challenging technical,logistic and cost obstacles that ar
.. read more
IPC 9252A Electrical Test Considerations & Military Specifications versus Electrical Test (Know Your Specifications,Revisions and Amendments)
The PCB industry has advanced significantly in the recent millennium. OEM specifications and requirements have also advanced due to the maturing technologies. With this the requirements of Elec
.. read more
Newest ED-Copper Foils for Low Loss / High Speed PCBs and for IC-Packaging
The latest status of new ED copper foil developments is presented: ultra-flat profile for high speed digital boards and ultra-thin foil for finest pitch applications.
Copper surface roughness h
.. read more
Determination of Copper Foil Surface Roughness from Micro-section Photographs
Specification and control of surface roughness of copper conductors within printed circuit boards (PCBs) are increasingly desirable in multi-GHz designs as a part of signal-integrity failure an
.. read more
A Designed Experiment for the Influence of Copper Foils on Impedance,DC Line Resistance and Insertion Loss
For the last couple of years,the main concerns regarding the electrical performance of blank PCB boards were impedance and ohmic resistance. Just recently,the need to reduce insertion loss came
.. read more
Effect of Silicone Contamination on Assembly Processes
Silicone contamination is known to have a negative impact on assembly processes such as soldering,adhesive bonding,coating,and wire bonding. In particular,silicone is known to cause de-wetting
.. read more
Impact of Dust on Printed Circuit Assembly Reliability
Atmospheric dust consists of solids suspended in air. Dust is well known for its complex nature. It normally includes inorganic mineral materials,water soluble salts,organic materials,and a sma
.. read more
Coating Thickness Measurement of Thin Gold and Palladium Coatings on Printed Circuit Boards using X-Ray Fluorescence
- DD Detector is State of the Art
- Software: Addressing all measurement challenges; Measurement Results for Au,Pd and Ni(P),independent of substrate material
- Traceability and Reproducibility
.. read more
Direct Digital SM Printing Using Inkjet Technology
•What is Digital Printing
•Ink Jet Technology
•Printing SM using Ink Jet
- Highlights
- Zero clearance technology
- Product improvements
- PCB shops,end users and designers
.. read more
Application of the Advanced Activator Technology on Halogen-Free Lead-Free Solder Paste Development
The Surface Mount Technology (SMT) industry has been faced with several challenges in the past decades. Two of the most recent ones are RoHS compliant lead-free assembly and the adoption of fin
.. read more
The Effect of Powder Surface Area and Oxidation on the Voiding Performance of PoP Solder Pastes
With the miniaturization of components in the semiconductor industry,the need for specialized solder pastes with finer
powder mesh sizes for package-on-package (PoP) assemblies has become imper
.. read more