Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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The Surface Finish Effect on the Creep Corrosion in PCB
Creep corrosion normally happens in the end system,PCB,connectors and components are widely noted due to the exposure of
high sulfur environments under elevated humidity. In this study,the majo
.. read more
Detailed Analysis of Impedance and Loss versus Frequency for Transmission Lines Made From Flexible Circuit Materials
With the emergence of high speed,controlled impedance circuits requiring increasingly tight tolerances,there is a realization among designers and fabricators that more precise data is needed th
.. read more
Thermal Characteristics of PCB Laminates used in High Frequency Applications
As technology advances,understanding thermal management issues of high frequency PCB’s increases. There are many different aspects to consider for PCB thermal management. This paper will invest
.. read more
The Application of Spherical Bend Testing to Predict Safe Working Manufacturing Process Strains
The increased temperatures associated with lead free processes have produced significant challenges for PWB laminates.
Newly developed laminates have different curing processes,are commonly fil
.. read more
Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission
Electronics assemblies with large flip-chip BGA packages can be prone to either pad cratering or brittle intermetallic (IMC)
failures under excessive PCB bending. Pad cratering cracks are not d
.. read more
PAD CRATERING
- What is Pad Cratering?
- Pad Craters
- Pad Cratering… Opens Circuits
- How is the Electronics Industry dealing with this Defect Mode?
- What does this have in common with a Pad Cratering solu
.. read more
Assembly and Reliability of 1704 I/O FCBGA and FPBGAs
Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space
.. read more
The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array
Accelerated temperature cycling was used to evaluate the thermal fatigue reliability for the case of backward compatible
assembly (mixed alloy,Pb-free BGA/SnPb paste) of a 3162 pin count,extrem
.. read more
Reliability of BGA Solder Joints after Re-Balling Process
Due to the obsolescence of SnPb BGA components,electronics manufacturers that use SnPb solder paste either have to use
lead-free BGAs and adjust the reflow process or re-ball these components w
.. read more
Warpage Issues and Assembly Challenges Using Coreless Package Substrate
Coreless technology in package substrate has been developed to satisfy the increasing demand of lighter,smaller and superior electrical performance regarding as the future trend in electronic a
.. read more
An Investigation into the Predictability of PCB Coplanarity for Room vs. Lead Free Assembly Temperatures
With the advent of larger packages and higher densities/pitch the Industry has been concerned with the co -planarity of both
the substrate package and the PCB motherboard. The iNEMI PCB Co-Plan
.. read more
Projection Moiré vs. Shadow Moiré for Warpage Measurement and Failure Analysis of Advanced Packages
There are three key industry trends that are driving the need for temperature-dependent warpage measurement: the trend toward finer-pitch devices,the emergence of lead-free processing,and chang
.. read more
Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure Pd- Layers
As a surface finish,electroless nickel / electroless palladium / immersion gold (ENEPIG) has received increased attention
for both packaging/IC-substrate and PWB applications. With a lower gold
.. read more
A Plasma Deposited Surface Finish for Printed Circuit Boards
This paper will discuss a new approach to the final finishing for the PCB industry which is based on the use of an ultra-thin
fluoropolymer film as a protective coating to preserve solderabilit
.. read more
Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish
We investigated the micro-void formation of solder joints after reliability tests such as preconditioning (precon) and thermal
cycle (TC) by varying the thickness of Palladium (Pd) in Electrole
.. read more
The Regulatory and Environment Status of Tetrabromobisphenol-A In Printed Wiring Boards
Tetrabromobisphenol-A (TBBPA) is the predominant flame retardant used in rigid FR-4 printed wiring boards (PWB). In
this application,the TBBPA is fully reacted into the epoxy resins that form t
.. read more
An Innovative High CTI RCC Material
Consumption electronic devices are becoming much smaller,lighter and multifunctional,and high CTI application has
already been not satisfied with double sided design and requested thinner & mul
.. read more
New Developments in PCB Laminates
There are few halogen free flame retardant laminates available and for those on the market currently,they are not considered mid loss and thermally stable. Theta circuit materials appear to be
.. read more
IPC Standards and Printed Electronics Monetization
Printed Electronics is considered by many international technologists to be a platform for manufacturing innovation. Its rich portfolio of advanced multi-functional nano-designed materials,scal
.. read more
Printed Electronics - Performance Requirements for Flexible Substrates
– Define Printed Electronics
– Provide general market
information & Applications
– Provide performance
information on a wide variety
of thermoplastic films
– Provide processing
considerations f
.. read more
Advances in Conductive Inks across Multiple Applications and Deposition Platforms
Printed Electronics is generally defined as the patterning of electronic materials,in solution form,onto flexible substrates,omitting any use of the photolithography,etching,and plating steps c
.. read more
Existing and Emerging Opportunities in Printed Electronics For Printers
• Summary of some new and existing technologies for printed electronics outside of traditional membrane switch manufacturing
• Discussion of requirements for understanding the technology of the
.. read more
Printable Materials and Devices
Printing technologies provide a simple solution to build electronic circuits on low cost flexible substrates. Materials will play an important role for developing advanced printable technology.
.. read more
The Uncertainty of Surface Insulation Resistance/Electrochemical Migration Performance of Completed Assemblies
The breadth of materials and processes used in today’s electronic assemblies may make it impossible to predict SIR/ECM performance without adequate testing of material and process combinations.
.. read more
Authenticity Testing
Counterfeit and substandard parts and components have been a recurring theme in practically every market. For the last several years,the largest concern has been in the military and aerospace i
.. read more
Cleanliness Comparison – C3 Localized Versus Total Board Extractions
In this evaluation we will show an ionic residue comparison using Umpire 2 boards that were top and bottom surface mounted with standard reflow and selective wave soldered on the connector and
.. read more
Next Generation Test Methodologies and Analysis for Physical Layer Structures
Printed circuit board (PCB) material properties and surface roughness directly influence attenuation and NEXT/FEXT crosstalk signal integrity of high speed digital interconnect design. Balancin
.. read more
Cleaning Challenges in an HDI World
Electronic assembly innovations drive more performance using highly dense interconnects. Assembly residues may increase the risk of premature failure or improper functionality. The challenge fo
.. read more
Common Mistakes in Electronic Design
Board-level designers are constantly expected to cram more computational power,into a smaller space,at lower cost,and accomplish this task in less time and with fewer resources. In this rush to
.. read more
Analytical Procedures for Portable Lead-Free Alloy Test Data: State of Merge of iNEMI and SPVC Documents
The IPC Solder Products Value Council,in cooperation with iNEMI and a group of industry experts,has developed a protocol for testing the physical properties of lead free solder alloys. This pre
.. read more
The Surface Finish Effect on the Creep Corrosion in PCB
Creep corrosion normally happens in the end system,PCB,connectors and components are widely noted due to the exposure of
high sulfur environments under elevated humidity. In this study,the majo
.. read more
Detailed Analysis of Impedance and Loss versus Frequency for Transmission Lines Made From Flexible Circuit Materials
With the emergence of high speed,controlled impedance circuits requiring increasingly tight tolerances,there is a realization among designers and fabricators that more precise data is needed th
.. read more
Thermal Characteristics of PCB Laminates used in High Frequency Applications
As technology advances,understanding thermal management issues of high frequency PCB’s increases. There are many different aspects to consider for PCB thermal management. This paper will invest
.. read more
The Application of Spherical Bend Testing to Predict Safe Working Manufacturing Process Strains
The increased temperatures associated with lead free processes have produced significant challenges for PWB laminates.
Newly developed laminates have different curing processes,are commonly fil
.. read more
Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission
Electronics assemblies with large flip-chip BGA packages can be prone to either pad cratering or brittle intermetallic (IMC)
failures under excessive PCB bending. Pad cratering cracks are not d
.. read more
PAD CRATERING
- What is Pad Cratering?
- Pad Craters
- Pad Cratering… Opens Circuits
- How is the Electronics Industry dealing with this Defect Mode?
- What does this have in common with a Pad Cratering solu
.. read more
Assembly and Reliability of 1704 I/O FCBGA and FPBGAs
Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space
.. read more
The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array
Accelerated temperature cycling was used to evaluate the thermal fatigue reliability for the case of backward compatible
assembly (mixed alloy,Pb-free BGA/SnPb paste) of a 3162 pin count,extrem
.. read more
Reliability of BGA Solder Joints after Re-Balling Process
Due to the obsolescence of SnPb BGA components,electronics manufacturers that use SnPb solder paste either have to use
lead-free BGAs and adjust the reflow process or re-ball these components w
.. read more
Warpage Issues and Assembly Challenges Using Coreless Package Substrate
Coreless technology in package substrate has been developed to satisfy the increasing demand of lighter,smaller and superior electrical performance regarding as the future trend in electronic a
.. read more
An Investigation into the Predictability of PCB Coplanarity for Room vs. Lead Free Assembly Temperatures
With the advent of larger packages and higher densities/pitch the Industry has been concerned with the co -planarity of both
the substrate package and the PCB motherboard. The iNEMI PCB Co-Plan
.. read more
Projection Moiré vs. Shadow Moiré for Warpage Measurement and Failure Analysis of Advanced Packages
There are three key industry trends that are driving the need for temperature-dependent warpage measurement: the trend toward finer-pitch devices,the emergence of lead-free processing,and chang
.. read more
Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure Pd- Layers
As a surface finish,electroless nickel / electroless palladium / immersion gold (ENEPIG) has received increased attention
for both packaging/IC-substrate and PWB applications. With a lower gold
.. read more
A Plasma Deposited Surface Finish for Printed Circuit Boards
This paper will discuss a new approach to the final finishing for the PCB industry which is based on the use of an ultra-thin
fluoropolymer film as a protective coating to preserve solderabilit
.. read more
Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish
We investigated the micro-void formation of solder joints after reliability tests such as preconditioning (precon) and thermal
cycle (TC) by varying the thickness of Palladium (Pd) in Electrole
.. read more
The Regulatory and Environment Status of Tetrabromobisphenol-A In Printed Wiring Boards
Tetrabromobisphenol-A (TBBPA) is the predominant flame retardant used in rigid FR-4 printed wiring boards (PWB). In
this application,the TBBPA is fully reacted into the epoxy resins that form t
.. read more
An Innovative High CTI RCC Material
Consumption electronic devices are becoming much smaller,lighter and multifunctional,and high CTI application has
already been not satisfied with double sided design and requested thinner & mul
.. read more
New Developments in PCB Laminates
There are few halogen free flame retardant laminates available and for those on the market currently,they are not considered mid loss and thermally stable. Theta circuit materials appear to be
.. read more
IPC Standards and Printed Electronics Monetization
Printed Electronics is considered by many international technologists to be a platform for manufacturing innovation. Its rich portfolio of advanced multi-functional nano-designed materials,scal
.. read more
Printed Electronics - Performance Requirements for Flexible Substrates
– Define Printed Electronics
– Provide general market
information & Applications
– Provide performance
information on a wide variety
of thermoplastic films
– Provide processing
considerations f
.. read more
Advances in Conductive Inks across Multiple Applications and Deposition Platforms
Printed Electronics is generally defined as the patterning of electronic materials,in solution form,onto flexible substrates,omitting any use of the photolithography,etching,and plating steps c
.. read more
Existing and Emerging Opportunities in Printed Electronics For Printers
• Summary of some new and existing technologies for printed electronics outside of traditional membrane switch manufacturing
• Discussion of requirements for understanding the technology of the
.. read more
Printable Materials and Devices
Printing technologies provide a simple solution to build electronic circuits on low cost flexible substrates. Materials will play an important role for developing advanced printable technology.
.. read more
The Uncertainty of Surface Insulation Resistance/Electrochemical Migration Performance of Completed Assemblies
The breadth of materials and processes used in today’s electronic assemblies may make it impossible to predict SIR/ECM performance without adequate testing of material and process combinations.
.. read more
Authenticity Testing
Counterfeit and substandard parts and components have been a recurring theme in practically every market. For the last several years,the largest concern has been in the military and aerospace i
.. read more
Cleanliness Comparison – C3 Localized Versus Total Board Extractions
In this evaluation we will show an ionic residue comparison using Umpire 2 boards that were top and bottom surface mounted with standard reflow and selective wave soldered on the connector and
.. read more
Next Generation Test Methodologies and Analysis for Physical Layer Structures
Printed circuit board (PCB) material properties and surface roughness directly influence attenuation and NEXT/FEXT crosstalk signal integrity of high speed digital interconnect design. Balancin
.. read more
Cleaning Challenges in an HDI World
Electronic assembly innovations drive more performance using highly dense interconnects. Assembly residues may increase the risk of premature failure or improper functionality. The challenge fo
.. read more
Common Mistakes in Electronic Design
Board-level designers are constantly expected to cram more computational power,into a smaller space,at lower cost,and accomplish this task in less time and with fewer resources. In this rush to
.. read more
Analytical Procedures for Portable Lead-Free Alloy Test Data: State of Merge of iNEMI and SPVC Documents
The IPC Solder Products Value Council,in cooperation with iNEMI and a group of industry experts,has developed a protocol for testing the physical properties of lead free solder alloys. This pre
.. read more