Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
The Effects of Human-Induced Contamination on PCB Assembly Electrical Reliability
With the ever-present pressure toward miniaturization in electronic devices,smaller distances between traces and component terminations are likely to increase the devices’ sensitivity to contam
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Capillary IC – A New Platform for High Throughput or High Resolution Separations of Ionic Compounds
High pressure capillary IC allows you to:
Lower operational costs – water,waste,consumables
“Always Ready”
Improved system and analytical performance
Convenience
Rush samples
Enables high-resol
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Cleanliness Assessment for Class III Lead-Free No-Clean Assemblies
For mission critical electronics or Class III products,such as those used within the military,aerospace and medical industries,highest electronic reliability is a requirement as failure is not
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CO2 Clean Manufacturing Technology for Electronic Device Fabrication
CO2 technology offers electronic device manufacturers a robust platform for a variety of precision cleaning and machining
applications. Surface and substrate contamination such as flux residues
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Electrical Test Conditions & Considerations
When testing PCBs it can be quite confusing as to what method to use,parameters are necessary for the Performance Class and what cost to associate in the build to way against the long term reli
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Hi Pot Dielectric Breakdown Automated Verification How-To
The Printed Circuit Board (PCB) builds get ever more complex. With this the layer counts climb but the overall thickness remains the same. From this the cores of the build are reduced and the d
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Two Print Stencils Systems
The Two print stencils process has been a very useful tool in SMT Assembly and Package Assembly. It is also useful in Assemblies that require mixed technologies; including SMT / Through Hole,SM
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Profiled Squeegee Blade: Rewrites the Rules for Angle of Attack
For centuries,the squeegee blade has been used throughout many applications for depositing viscous materials through screens and stencils to transfer images on to substrates,from cloth material
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Evaluating the Accuracy of a Nondestructive Thermo Couple Attach Method for Area Array Package Profiling
The oven recipe,which consists of the reflow oven zone temperature settings and the speed of the conveyor,will determine a specific time-temperature profile for a given PCB assembly. In order t
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Military Applications of Flexible Circuits
1.Conventional Flex
2.Basic Materials
3.Failure Modes
4.HDI Flex
Summary,conventional builds
Cautions in Design
•Average or above Design Expertise Required
–PTH to close to edge of part
–Panel
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Direct Determination of Phosphorus Content in Electroless Nickel Plating Using X-ray Fluorescence (XRF) Spectroscopy
Electroless plating processes are popular because of their performance,reliability and cost effectiveness. The process combines unique deposit properties such as uniform plating build up regard
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Via Filling: Challenges for the Chemistry in the Plating Process
Copper filling of laser drilled blind micro vias (BMV´s) is now the standard production method for high density interconnects. Copper filled BMV´s are used as solder bump sites for IC packaging
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Sources in A Production Line (SMT) and Solutions against ESD (Electrostatic Discharge) - Requirements Today and In The Future
The structures of electronic components become smaller and smaller. 5 volts or smaller voltage of an electrostatic charge are enough to damage or change the structures in small electronic compo
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Big Ideas on Miniaturisation
The next generation miniaturised SMT devices waiting to make their mark will require the assembly community to re think their processes and toolsets. The feature sizes that are involved in this
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Low Surface Energy Coatings,Rewrites the Area Ratio Rules
Paste release characteristics are driven by the Area Ratio formula,which is based upon conventional stencil foil materials such as a variety of stainless steel alloys,nickel,etc. The surface en
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Printing and Assembly Challenges for QFN Devices
Although QFN devices present a challenge to the SMT assembly process with proper stencil design,proper stencil technology selection (Laser,Electroform,Nano-Coat),and proper PCB solder mask layo
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Reliability Performance of Very Thin Printed Circuit Boards with regard to Different any-Layer Manufacturing Technologies
The next generation of smart phones will demand very thin multi-layer boards to reduce the product thickness again. This paper shows three different manufacturing approaches,which can be used f
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Controlling Moisture During Inner Layer Processing
•Two primary failure modes from trapped moisture:
•Premature resin decomposition from incomplete resin cross-linking.
•Explosive vaporization during high temperature thermal exposure.
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Micro Trace Resistive Technology
Micro Trace Resistor Technology allows thin film resistors to be built within a printed circuit trace that is less than 100 microns wide. Using standard subtractive printed circuit board proces
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Effect of Toughening and E-Glass Sizing on Fracture Toughness and Delamination in High Thermal Stability Electrical Laminates
In this work we report results of the fracture toughness of a high thermal stability resin system toughened by The Dow Chemical Company proprietary particulate-type toughening material. Results
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QFN Voiding Control Via Solder Mask Patterning On Thermal Pad
•Voiding of QFN a concern due to large thermal pad,low standoff,and many thermal via
•Divided thermal pad preferred,with SMD better than NSMD
•This work focus on systematic study on effect of S
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Fluxless Die Attach by Activated Forming Gas
Eutectic god-tin (Au80Sn20) is widely used as the die-attach material for making radio-frequency (RF) and microwave devices. The metallic bonding is typically achieved by soldering using a gold
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Building HDI Structures using Thin Films and Low Temperature Sintering Paste
Circuit complexity and density requirements continue to push PCB fabrication capability limits. Component pitch and routing requirements are continually becoming more aggressive and difficult t
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Exploring the High Temperature Reliability Limits for Silicone Adhesives
The thermal stability of silicone polymers,fluids and resins has been well documented and studied extensively. The high temperature performance of silicone adhesives and sealants used for elect
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Plasma Polymerization: A Versatile and Attractive Process for Conformal Coating
The use of plasma processing in the manufacture of electronics is growing as we discover more and more applications for this technology. It is now common for plasma etching and cleaning to be u
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