Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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High Speed Digital Imaging Using Gray Level with Micromirror Array
In recent years the PCB industry has increasingly turned to digital,or maskless,imaging techniques in order meet demands for tighter registration between layers. Many of these techniques,includ
.. read more
The Elimination of Whiskers from Electroplated Tin
After the implementation of RoHS and the discontinued use of lead bearing products and the introduction of lead free (LF)
solders,tin and its alloys have come to the forefront as the first choi
.. read more
3D Interconnection Technologies for Electronic Products: A Perspective View of Electronic Interconnection Technologies from Chip to System
3D is the shorthand term for the three dimensions of Cartesian coordinate space X,Y and Z. With that definition in mind,one will find with little or no stretching of the imagination,that the fi
.. read more
Improved Efficiency Using Root Cause Failure Analysis
A PCB fails final test. Why? Was it the solder paste? The screen printer? The PCB assembly machine? The reflow oven or none of the above?
Unplanned downtime is a costly fact of life. In order t
.. read more
Reducing Defects with Embedded Sensing Technology
Typical SMT production lines are a collection of disconnected machines performing various tasks. Errors can occur at any step during this process,but often go undetected until the PWB is comple
.. read more
Analysis on Combination of AOI and AVI machines
In PCB industry,AOI (Automated Optical Inspection) has been grown rapidly in past decades. It is now playing an important role in manufacturing process. Most manufacturers are now using AOI m
.. read more
WLCSP and Flip Chip Production Bumping using Electroless Ni/Au Plating and Wafer Level Solder Sphere Transfer Technologies
There are three main packaging technologies used by the semiconductor industry today to create solder bumps on wafers: paste printing,electroplating,or sphere dropping [1]. The choice between t
.. read more
Cost Effective and User Friendly Nitrogen Inerting Technology For Lead-Free Wave Soldering
It is well known that nitrogen inerting in wave soldering can significantly reduce dross formation and improve solder wetting. For lead-free wave soldering,the benefits of N2 inerting are even
.. read more
Case Study Comparing the Solderability of a Specific Pb Free No Clean Paste in Vapor Phase and Convection Reflow
To help address the environmental requirements driven by the European Union RoHS Directive,consumer applications have changed the solder alloys for the manufacturing of printed circuit board as
.. read more
A Novel Thermal Material for Multi-Layer Metal Core Printed Circuit Boards
Today,the metal core printed circuit board (MCPCB) business is booming thanks to the rising popularity of LED TV. The majority of MCPCB is single sided. However,the demand for multi-layer board
.. read more
Basics of (PCB) Thermal Management for LED Applications
The reader may wonder why „PCB? in the title is between quotes. The original objective of the paper was to lay a firm base for people who are involved in printed circuit board (PCB) design for
.. read more
Head-In-Pillow: Are we still Snoozing?
-BA flux: Water soluble BA flux has a higher HiP risk relative to NC BA flux,likely due to higher surface oxidation risks.
-Deflux: Washing process using water or DIW in combination with other
.. read more
Detection of Head-on-Pillow Defects Using 5DX Method
Base on our experience,HiP defect comes in various shapes and
forms. Some of the HiP looks like an ordinary open joint,while others have an eclipse profile. The tough ones to detect are those t
.. read more
Impregnation of Metal Complex into Epoxy Insulation Materials Using Supercritical Carbon Dioxide and Its Application for Copper Plating
Metal plating of epoxy polymer has been widely applied for industrial products for a long time,especially in the field of Printed Circuit Boards (PCB’s). This technique is one of the most impor
.. read more
Deposition of Thin Copper in Pre-formed Vias on Thin Flexible Base Materials
This paper reports on further developments for an innovative copper deposition technology that was presented two years ago at this conference. At that time,the innovative technology was describ
.. read more
A Combination Flame Retardant Curing Agent Material For Non-Halogen PCB Laminates
As interest continues in the development of non-halogen flame retardants for printed circuit boards,the requirements for robust thermal stability and lead-free solder compatibility also continu
.. read more
A Review of Halogen/Halide-Free Test Methods and Classifications for Soldering Materials in the Electronics Industry
Over the last few years,there has been an increase in the Evaluation and use of halogen-free soldering materials. In addition,
there has been increased scrutiny into the level of halogens and r
.. read more
Effects of Tin Whisker Formation on Nanocrystalline Copper
Spontaneously forming tin whiskers,which emerge unpredictably from pure tin surfaces,have regained prevalence as a topic within the electronics research community. This has resulted from the RO
.. read more
Effect of Gold Content on the Reliability of SnAgCu Solder Joints
Electroplated Ni/Au over Cu is a popular metallization for PCB finish as well as for component leads,especially wire-bondable high frequency packages,where the gold thickness requirement for wi
.. read more
Vapor phase and Convection Reflow: Comparison of Solder Paste Residue Chemical Reliability
Convection soldering remains the most common reflow process in electronic assembly,mostly in air,but sometimes using a nitrogen atmosphere to reduce oxidation.
On the other hand,vapor phase sol
.. read more
The Effects of Partially Activated No-Clean Flux Residues under Component Bodies and No-Clean Flux Residues Entrapped Under RF Cans on...
With the predominance of no-clean soldering processes and ever decreasing component standoff,the industry has had to consider the reliability of,what may be,partially activated or “gooey” flux
.. read more
Soldering Process Improvement of Critical SMT Connectors and for the Retention of Press-fit SFP Cages
As Original Design Manufacturers (ODM) adopt the use of finer pitch connectors,with increased pin count on PCB assemblies. It becomes challenging for Electronic Contract Manufacturing Services
.. read more
Solder Charge Grid Array: Advancements in the Technology of Surface Mount Area Array Solder Joint Attachment
Surface mount area arrays (SMAA) have been in existence for decades and are increasingly becoming more important as printed circuit board (PCB) assemblies become further complex with package mi
.. read more
A New Approach for Early Detection of PCB Pad Cratering Failures
Pad cratering refers to the initiation and propagation of fine cracks beneath BGA pads in organic substrates or printed circuit boards. These cracks,which usually initiate under the application
.. read more
Analysis of Electrochemical Migration Kinetics Using Electrochemical Impedance Spectroscopy
The propensity of printed circuit boards to electrochemical migration has been assessed traditionally by using surface insulation resistance technique with a DC bias on standard comb structures
.. read more
The Effects of Lead-Free Reflow on Conductive Anodic Filament (CAF) Performance of Materials
This paper details the results achieved by the High Density Packaging Users Group (HDPUG) Consortium investigating the hole-wall to hole-wall CAF performance of 20 different Pb-free printed wir
.. read more
PCB Design Perfection Starts in the Cad Library Part 1 – The 1608 (Eia 0603) Chip Component
The CAD library is the starting point that affects every process from PCB layout through PCB manufacturing and assembly. There are dozens of things to consider when creating a CAD library that
.. read more
PCB Design Principles for QFN and Other Bottom Termination Components
Although many of the QFN and bottom termination products are small in outline and utilize a plastic encapsulated copper
lead-frame structure they do not resemble the more traditional small outl
.. read more
DFM Rules for Smartphones: An Analysis of Yield on Extremely Dense Assemblies
Handheld portable products such as smartphones are trending toward smaller form factors while simultaneously increasing in functionality to keep up with consumer demands. This is achieved in pa
.. read more
A Revolutionary Printing Solution for Heterogeneous Surface Mount Assembly
As consumers the expectation of increased functionality within new products is a given. However there comes a time where this tireless demand for product efficiency starts to stretch the design
.. read more
High Speed Digital Imaging Using Gray Level with Micromirror Array
In recent years the PCB industry has increasingly turned to digital,or maskless,imaging techniques in order meet demands for tighter registration between layers. Many of these techniques,includ
.. read more
The Elimination of Whiskers from Electroplated Tin
After the implementation of RoHS and the discontinued use of lead bearing products and the introduction of lead free (LF)
solders,tin and its alloys have come to the forefront as the first choi
.. read more
3D Interconnection Technologies for Electronic Products: A Perspective View of Electronic Interconnection Technologies from Chip to System
3D is the shorthand term for the three dimensions of Cartesian coordinate space X,Y and Z. With that definition in mind,one will find with little or no stretching of the imagination,that the fi
.. read more
Improved Efficiency Using Root Cause Failure Analysis
A PCB fails final test. Why? Was it the solder paste? The screen printer? The PCB assembly machine? The reflow oven or none of the above?
Unplanned downtime is a costly fact of life. In order t
.. read more
Reducing Defects with Embedded Sensing Technology
Typical SMT production lines are a collection of disconnected machines performing various tasks. Errors can occur at any step during this process,but often go undetected until the PWB is comple
.. read more
Analysis on Combination of AOI and AVI machines
In PCB industry,AOI (Automated Optical Inspection) has been grown rapidly in past decades. It is now playing an important role in manufacturing process. Most manufacturers are now using AOI m
.. read more
WLCSP and Flip Chip Production Bumping using Electroless Ni/Au Plating and Wafer Level Solder Sphere Transfer Technologies
There are three main packaging technologies used by the semiconductor industry today to create solder bumps on wafers: paste printing,electroplating,or sphere dropping [1]. The choice between t
.. read more
Cost Effective and User Friendly Nitrogen Inerting Technology For Lead-Free Wave Soldering
It is well known that nitrogen inerting in wave soldering can significantly reduce dross formation and improve solder wetting. For lead-free wave soldering,the benefits of N2 inerting are even
.. read more
Case Study Comparing the Solderability of a Specific Pb Free No Clean Paste in Vapor Phase and Convection Reflow
To help address the environmental requirements driven by the European Union RoHS Directive,consumer applications have changed the solder alloys for the manufacturing of printed circuit board as
.. read more
A Novel Thermal Material for Multi-Layer Metal Core Printed Circuit Boards
Today,the metal core printed circuit board (MCPCB) business is booming thanks to the rising popularity of LED TV. The majority of MCPCB is single sided. However,the demand for multi-layer board
.. read more
Basics of (PCB) Thermal Management for LED Applications
The reader may wonder why „PCB? in the title is between quotes. The original objective of the paper was to lay a firm base for people who are involved in printed circuit board (PCB) design for
.. read more
Head-In-Pillow: Are we still Snoozing?
-BA flux: Water soluble BA flux has a higher HiP risk relative to NC BA flux,likely due to higher surface oxidation risks.
-Deflux: Washing process using water or DIW in combination with other
.. read more
Detection of Head-on-Pillow Defects Using 5DX Method
Base on our experience,HiP defect comes in various shapes and
forms. Some of the HiP looks like an ordinary open joint,while others have an eclipse profile. The tough ones to detect are those t
.. read more
Impregnation of Metal Complex into Epoxy Insulation Materials Using Supercritical Carbon Dioxide and Its Application for Copper Plating
Metal plating of epoxy polymer has been widely applied for industrial products for a long time,especially in the field of Printed Circuit Boards (PCB’s). This technique is one of the most impor
.. read more
Deposition of Thin Copper in Pre-formed Vias on Thin Flexible Base Materials
This paper reports on further developments for an innovative copper deposition technology that was presented two years ago at this conference. At that time,the innovative technology was describ
.. read more
A Combination Flame Retardant Curing Agent Material For Non-Halogen PCB Laminates
As interest continues in the development of non-halogen flame retardants for printed circuit boards,the requirements for robust thermal stability and lead-free solder compatibility also continu
.. read more
A Review of Halogen/Halide-Free Test Methods and Classifications for Soldering Materials in the Electronics Industry
Over the last few years,there has been an increase in the Evaluation and use of halogen-free soldering materials. In addition,
there has been increased scrutiny into the level of halogens and r
.. read more
Effects of Tin Whisker Formation on Nanocrystalline Copper
Spontaneously forming tin whiskers,which emerge unpredictably from pure tin surfaces,have regained prevalence as a topic within the electronics research community. This has resulted from the RO
.. read more
Effect of Gold Content on the Reliability of SnAgCu Solder Joints
Electroplated Ni/Au over Cu is a popular metallization for PCB finish as well as for component leads,especially wire-bondable high frequency packages,where the gold thickness requirement for wi
.. read more
Vapor phase and Convection Reflow: Comparison of Solder Paste Residue Chemical Reliability
Convection soldering remains the most common reflow process in electronic assembly,mostly in air,but sometimes using a nitrogen atmosphere to reduce oxidation.
On the other hand,vapor phase sol
.. read more
The Effects of Partially Activated No-Clean Flux Residues under Component Bodies and No-Clean Flux Residues Entrapped Under RF Cans on...
With the predominance of no-clean soldering processes and ever decreasing component standoff,the industry has had to consider the reliability of,what may be,partially activated or “gooey” flux
.. read more
Soldering Process Improvement of Critical SMT Connectors and for the Retention of Press-fit SFP Cages
As Original Design Manufacturers (ODM) adopt the use of finer pitch connectors,with increased pin count on PCB assemblies. It becomes challenging for Electronic Contract Manufacturing Services
.. read more
Solder Charge Grid Array: Advancements in the Technology of Surface Mount Area Array Solder Joint Attachment
Surface mount area arrays (SMAA) have been in existence for decades and are increasingly becoming more important as printed circuit board (PCB) assemblies become further complex with package mi
.. read more
A New Approach for Early Detection of PCB Pad Cratering Failures
Pad cratering refers to the initiation and propagation of fine cracks beneath BGA pads in organic substrates or printed circuit boards. These cracks,which usually initiate under the application
.. read more
Analysis of Electrochemical Migration Kinetics Using Electrochemical Impedance Spectroscopy
The propensity of printed circuit boards to electrochemical migration has been assessed traditionally by using surface insulation resistance technique with a DC bias on standard comb structures
.. read more
The Effects of Lead-Free Reflow on Conductive Anodic Filament (CAF) Performance of Materials
This paper details the results achieved by the High Density Packaging Users Group (HDPUG) Consortium investigating the hole-wall to hole-wall CAF performance of 20 different Pb-free printed wir
.. read more
PCB Design Perfection Starts in the Cad Library Part 1 – The 1608 (Eia 0603) Chip Component
The CAD library is the starting point that affects every process from PCB layout through PCB manufacturing and assembly. There are dozens of things to consider when creating a CAD library that
.. read more
PCB Design Principles for QFN and Other Bottom Termination Components
Although many of the QFN and bottom termination products are small in outline and utilize a plastic encapsulated copper
lead-frame structure they do not resemble the more traditional small outl
.. read more
DFM Rules for Smartphones: An Analysis of Yield on Extremely Dense Assemblies
Handheld portable products such as smartphones are trending toward smaller form factors while simultaneously increasing in functionality to keep up with consumer demands. This is achieved in pa
.. read more
A Revolutionary Printing Solution for Heterogeneous Surface Mount Assembly
As consumers the expectation of increased functionality within new products is a given. However there comes a time where this tireless demand for product efficiency starts to stretch the design
.. read more