Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
The Study,Measurement,and Prevention of Tarnish on Immersion Silver Board Finishes
With increased environmental legislation against lead in the electronics industry1,circuit board manufacturers are
expecting chemical suppliers to formulate lead free alternatives with the same
.. read more
Event
IPC Fall Meetings 2003
Solderability of Sn/Cu Lead-Free Solder as a HASL Bare Board Final Finish
Sn/Cu lead-free solder is a good alternative to 63/37 solder for use in HASL processes. Solderability of Sn/Cu
surface exceeds that of 63/37 solder,nickel-gold,OSP,silver,and immersion tin both
.. read more
Event
IPC Fall Meetings 2003
Immersion Silver and Immersion Tin IPC Plating Committee 4-14 Industry Update
The development of two new industry specifications – IPC-4553 (immersion silver IAg) and IPC-4554 (immersion tin ISn)
are well under way. Following in a tradition started with the development o
.. read more
Event
IPC Fall Meetings 2003
What’s Wrong With My Surface Finish? An Evaluation of the Limitations of Common Surface Finishes
This paper will highlight the shortcomings of each of the commonly used surface finishes available on the market
today. The goal is to spark the industry interest,that it may double its efforts
.. read more
Event
IPC Fall Meetings 2003
Enhanced Embedded Passives Technology – From Distributed to Discrete
Embedded passives are entering a new phase of improved product capability and enhanced processes. Thinner,
higher capacitance embedded distributed capacitance (EDC) materials are coming to mark
.. read more
Event
IPC Fall Meetings 2003
Decoupling with Integrated Capacitors
Successive generations of ICs demand higher peak current levels and faster current rise times,challenging traditional surface
mount decoupling. The considerably lower parasitic inductance of in
.. read more
Event
IPC Fall Meetings 2003
Designing Ceramic Thick-Film Capacitors for Embedding in Printed Circuit Boards
This paper presents an emerging technology for embedding discrete ceramic thick-film capacitors directly into
printed circuit boards. Their use frees up surface real estate allowing for smaller
.. read more
Event
IPC Fall Meetings 2003
Size and Cost Modeling for Embedded Passives
Lower cost is frequently listed as the main driver for moving to embedded passives. Unfortunately,understanding
the true cost difference between a design using embedded passives and the same de
.. read more
Event
IPC Fall Meetings 2003
Stress Effects on Thin Film Nichrome Embedded Resistor Tolerance
Electronic devices with high performance are becoming smaller and lighter. The passive components required to
enable high performance consume premium space on the surface of the printed circuit
.. read more
Event
IPC Fall Meetings 2003
Buried Capacitance and the Evolution of Thin Laminates
Buried Capacitance1 (BC) laminates products have been in use in many high-speed applications for more than ten
years. BC products are a significant contributor to complex multi-layer printed ci
.. read more
Event
IPC Fall Meetings 2003
Three-Dimensional System-in-Package (3D-SiP) in Japan: The Second Stage of Development
The adoption of three-dimensional System-in-Package (3D-SiP) is progressing rapidly,driven primarily my mobile electronic
applications such as mobile phones,PDAs,digital still cameras,and digit
.. read more
Event
IPC Fall Meetings 2003
3-D Packaging: Innovative Solutions for Multiple Die Applications
A vertically configured package technology developed by Tessera is proving to be a practical multi-die solution for any
number of single and multiple functional combinations. The enabling techn
.. read more
Event
IPC Fall Meetings 2003
A Novel Build-up PWB for Latest Mobile Phone
Event
IPC Fall Meetings 2003
Aerosol-Based Direct Writing of Interconnects
Optomec is developing an aerosol-based technology for high-precision,maskless deposition of a wide variety of
materials. The system functions by atomizing commercial inks and pastes,and then de
.. read more
Event
IPC Fall Meetings 2003
A Second Look At Injection Via Fill Process Capability,And Material Property Issues
In the United States,focus turns toward enabling technology for quick-turn printed circuit board and laminate package
manufacturing. The current corporate mandate is to develop advanced,enablin
.. read more
Event
IPC Fall Meetings 2003
The Effect of Via-in-Pad Via-Fill on Solder Joint Void Formation
Fabricators,and the copper plating process they choose,can have considerable influence on their customers' solder joint
reliability. In the case of high density assemblies,via-in-pad designs of
.. read more
Event
IPC Fall Meetings 2003
Establishing Component Traceability as an EMS Provider: A Mission Critical Service
As an EMS provider of high complexity backpanel assemblies,traceability of components with performance issues found at
system test,functional test and in the field was limited to the ability to
.. read more
Event
IPC Fall Meetings 2003
Effects of Lead-Free Surface Finishes on Press-Fit Connections
For decades,tin-lead has been used as the primary surface finish for compliant pins and plated through holes (PTH) of
printed circuit board (PCB) in press-fit connections. Therefore,most test r
.. read more
Event
IPC Fall Meetings 2003
Improving Oxide Resistance and Solderability of Electroplated Tin & Tin Alloy Coatings for Component Plating and Printed Circuit Board Final Finish Applications
Abstract
Electroplated tin and tin alloy coatings are used in electronics plating applications as a solderable and corrosion resistant
surface finish for components and printed circuit boards (
.. read more
Event
IPC Fall Meetings 2003
Design of Optimized High Speed Circuits
Designing a signal path to provide a particular impedance is thought to be a well understood science. The first issue which is
often overlooked is to analytically establish the need for specify
.. read more
Event
IPC Fall Meetings 2003
Propagation Delay Measurements with TDR in the Manufacturing Environment
This paper addresses the growing need in the Printed Wiring Board industry to measure and test propagation delay
parameters of board interconnects within the fabrication process. The state of c
.. read more
Event
IPC Fall Meetings 2003
High Frequency Dielectric Constant and Dissipation Factor Performance of Electronic PWB Substrates
Design of printed wiring boards allowing devices to function at increasing signal transmission rates is a difficult task. As
operating frequencies increase beyond one Gigahertz the availability
.. read more
Event
IPC Fall Meetings 2003
Cray X1: Extreme Performance Requires Extreme Reliability
The Cray X1™ system dramatically extends the capability of supercomputers with High efficiency and extreme
performance. Specifically designed to meet the needs of the high-end user,the Cray X1
.. read more
Event
IPC Fall Meetings 2003
Methodology for High Aspect Ratio Pulse Plating
Two years ago when IBM Endicott,now Endicott Interconnect (EI),was preparing to install a new Acid Copper
plating system,the Periodic Reverse Pulse (PRP) tanks installed at the end of the line
.. read more
Event
IPC Fall Meetings 2003
Copper Surface Treatment and Plating Reliability
Reliable copper interconnects are a primary requirement for most printed wiring board applications. A variety of
wet manufacturing processes play an important role in the formation of durable i
.. read more
Event
IPC Fall Meetings 2003
JPCA Standards of Optoelectronic Assembly Technology
JPCA has been developing standards necessary for adoption of optoelectronic technology especially for consumer
applications for years. The subjects being drafted are the technology that is fair
.. read more
Event
IPC Fall Meetings 2003
Imprinted Interconnects Technology (I2T),a Revolutionary Method for the Production of Very-High-Density Interconnects (VHDI)
Today’s HDI field of technology is coming under more and more pressure to increase wiring density and,even more
importantly,to decrease manufacturing costs. The current technological approach d
.. read more
Event
IPC Fall Meetings 2003
Micro Via Drilling Technology
Currently,PWB industry is striving for the cost down at the daily PWB manufacturing,and at the same time,they are
developing the higher density PWB for the future application.
The emerging 300
.. read more
Event
IPC Fall Meetings 2003
Lead-Free Wave Soldering – Tighter Process Windows Need Tighter Process Controls
Although wave soldering has not historically been considered a well-controlled process,its evolution over the past
decade makes it a prime candidate for effective control methods. These methods
.. read more
Event
IPC Printed Circuits Expo 2003
Characterization and Measurement of BGA Solder Joint Alloy Phase Solid State Thermal and Electromigration
A number of prior studies have established that solid state migration of solder alloy elemental phases will occur as a
function of temperature,time and voltage bias through the solder joint. Th
.. read more
Event
IPC Printed Circuits Expo 2003
Avoiding the Solder Void
Solder voiding is present in the majority solder joints and is generally accepted when the voids are small and the
total void content is minimal. X-ray methods are the predominate method for so
.. read more
Event
IPC APEX 2003
Printing and Profiling Fine Feature Devices
To characterize the paste printing process,both the individual aspects of the process and the interactions between the
aspects must be understood. The main aspects of the printing process are p
.. read more
Event
IPC APEX 2003
Board Level Manufacturability and Reliability Assessment of 0.5 mm Wafer Level CSP with Over-Sized Balls
The endless quest for increased performance in less space has recently manifested itself in 0.5mm pitch Chip Scale
Packages (CSP). The footprints of these packages are only about half the size
.. read more
Event
IPC APEX 2003
Capabilities of Tools Used to Measure Voids to Industry Standards
It is stated that some degree of voiding is acceptable and inevitable when soldering electronic components,and
specifically BGAs. There have been many publications which discuss this phenomena,
.. read more
Event
IPC APEX 2003
Use of Underfill to Enhance the Thermal Cycling Reliability of Small BGAs
In this work,we have evaluated the use of underfill to enhance the reliability of small BGAs in the automotive
thermal cycling environment. Best parameters for underfilling of BGAs were develop
.. read more
Event
IPC APEX 2003
Method for Determining the Adhesion of Reflow Encapsulant Attached Components
A simple and cost effective method has been developed in order to test adhesion of components to a circuit board
via a reflow encapsulant. Originally,a mechanical shock test similar to current
.. read more
Event
IPC APEX 2003
Key Application Issues for Implementing Package-Applied Underfill
Applying underfill materials to the bottom of components prior to shipping to the 2nd level end-user is very desirable
in that it would eliminate the underfill process from the end-users assemb
.. read more
Event
IPC APEX 2003
A Novel Epoxy Flux for Lead-Free Soldering
A novel liquid halide-free PK-002,epoxy flux,is reported for SnAgCu soldering,where the thermally cured flux
residue is designed to provide an interference-free service performance,in addition
.. read more
Event
IPC Fall Meetings 2003
Cleaning For Tomorrow
As technologies evolve with the onset of smaller and smaller components,different flux residues,and the no-lead
solders,manufacturing companies are asking questions regarding what they need to
.. read more
Event
IPC APEX 2003
Novel,VOC-Compliant Aqueous Cleaning Agents for Post-Solder Defluxing
To meet today’s environmental demands,new VOC-free and low-VOC cleaning agents have been formulated that exhibit
outstanding cleaning performance for a variety of flux residues. The new cleanin
.. read more
Event
IPC APEX 2003
Innovations using Ethyl Nonafluorobutyl Ether Provide Superior Solvent Properties for Defluxing No-Clean and Microelectronic Assemblies
The evaluation of a new solvent blend to clean printed wire boards is reported. Ethyl nonafluorobutyl ether (HFE-
7200) provides the fluid dynamics to build engineered cleaning fluids that exhi
.. read more
Event
IPC APEX 2003
Can One Effectively Clean Under Low Stand off Components (<4 MIL or 0.004 Inches)?
With the ban of CFC’s,various cleaning processes have emerged and have been established as viable
alternatives1,2,3. Several cleaning processes such as ultrasonic and spray in air batch and in-
.. read more
Event
IPC APEX 2003
OEM/EMS NPI Collaboration: Optimizing the Design and NPI Supply Chain to Improve Time-To-Volume Manufacturing
The outsourcing trend within the electronics industry continues to accelerate as OEMs focus their limited resources on core
competencies that enhance shareholder value. This outsourcing trend i
.. read more
Event
IPC APEX 2003
EMS/OEM Interaction: Maximizing Benefit by Optimizing Communication
The relationship between the OEM and the EMS provider (Electronic Manufacturing Services) has evolved with the
increase in outsourcing of manufacturing services. This has resulted in the conseq
.. read more
Event
IPC APEX 2003
Applying Automation to the NPI Process
With the increase in outsourcing activity throughout the electronics industry,OEM’s are turning to Electronic
Manufacturing Services (EMS) to provide quality quick turn prototypes and fast New
.. read more
Event
IPC APEX 2003
Integrated Forecasting Across Value Chain
The internet explosion of the 90’s created much hype around public exchanges that has never materialized. The
current business environment of a multi-company value chain,alliances and partnersh
.. read more
Event
IPC APEX 2003
Automated Design Verification using DFM/DFT
In a low-volume,high-mix electronics manufacturing environment,the ability to delineate design concerns before a
customer’s product goes to production is paramount. Design deficiencies or devia
.. read more
Event
IPC APEX 2003
AOI in EMS
As outsource to EMS,the requirement for Automated Optical Inspection (AOI) equipment changes as well. Due to
the diversity of the business,EMS providers require equipment that can handle a myri
.. read more
Event
IPC APEX 2003
A Simpler Approach to Cost-Effective Solder Paste Testing
The increasing demand for portable electronic
products has accelerated the quest for even greater
miniaturization. At the current state of electronic
production technology,volume and weight
red
.. read more
Event
IPC APEX 2003
Study of Assembly Processes for Solder Flip Chips on FR-4 Substrates
Flip chip assembly is a key capability to enable product miniaturization. Our previous studies have investigated several flip chip
interconnection types including anisotropic conductive film or
.. read more
Event
IPC APEX 2003