Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Solder Joint Reliability Qualification of Various Component Mounting Modification Configurations Using Thermal Cycle Testing
The selection and use of solder joint modification configurations for printed wiring assemblies has traditionally been a design
specific activity. The implementation and use of a standardized s
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Event
IPC APEX EXPO 2004
Characterization of PCB Plated-Thru-Hole Reliability using Statistical Analysis
Various test methods are used to characterize the PCB plated-thru-hole reliability. One such method is the Interconnect Stress
Test (IST). The results from this test are often used to qualify P
.. read more
Event
IPC APEX EXPO 2004
Lead Free and Other Process Effects on Conductive Anodic Filamentation Resistance of Glass Reinforced Epoxy Laminates
Conductive Anodic Filamentation is a subsurface failure mode for woven glass reinforced laminates (FR4) materials,where a
copper salt filament allows bridging between via walls or other copper
.. read more
Event
IPC APEX EXPO 2004
Lead-Free Soldering: DOE Study to Understand its Affect on Electronic Assembly Defluxing
Lead-free alloys under consideration have physical properties,which may directly impact industry standard electronic assembly
cleaning processes. The purpose of this study is to evaluate how th
.. read more
Event
IPC APEX EXPO 2004
Are Lead-free Assemblies Especially Endangered by Climatic Safety?
The ever-increasing use of high frequency in high density interconnect (HDI) assemblies,combined with the worldwide
move toward lead-free manufacturing,has initiated a closer scrutiny towards e
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Event
IPC APEX EXPO 2004
Lead Free Assembly of Chip Scale Packages
Chip scale packages (CSPs) are widely used in portable electronic products where there is also a growing trend to lead free
assembly. Many CSP designs will meet the thermal cycle or thermal sho
.. read more
Event
IPC APEX EXPO 2004
Reliability Assessment of CSP Underfill Methods
The miniaturization trend in electronics has proliferated the use of Chip Scale Packages (CSPs) in electronics assembly. CSPs
used in portable devices are subjected to harsh mechanical and ther
.. read more
Event
IPC APEX EXPO 2004
Mechanical Bending Technique for Determining CSP Design and Assembly Weaknesses
A cyclic board-bending technique has been developed to ensure a reproducible multiaxial stress state at the Chip
Size Package (CSP) solder fillet. Mechanically stressing the package serves as a
.. read more
Event
IPC APEX EXPO 2004
Non-Telecom Optoelectronics
When we think of optoelectronics in the USA,we automatically think of telecom applications. These fueled huge growth at
the turn of the millennium,and even after the bubble burst in 2001-2,tele
.. read more
Event
IPC APEX EXPO 2004
Is That Splice Really Good Enough? Improving Fiber Optic Splice Loss Measurement
Results from a National Electronics Manufacturing Initiative (NEMI) project,formed to improve aspects of fiber optic fusion
splicing,are reported. The focus of this paper is ultra low loss spli
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Event
IPC APEX EXPO 2004
Creating a New Optoelectronics Standard: Specifications for Process Carriers Used to Handle Optical Fibers in Manufacturing
The lack of consistency and compatibility in process carrier designs was cited as an early barrier to automation in the
nascent fiber-optics industry. Under the auspices of the National Electro
.. read more
Event
IPC APEX EXPO 2004
NEMI Cost Analysis: Optical Versus Copper Backplanes
The outlook for optical PCBs is unclear for mainly three reasons: 1) today's limits for copper boards can be stretched with
design and manufacturing improvements,2) the market demand for next g
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Event
IPC APEX EXPO 2004
Drawing Note Generator
This paper will describe the method used to automate drawing note creation at Lockheed Martin. It will discuss the reasons
for the automation and some of the decisions that needed to be made be
.. read more
Event
IPC APEX EXPO 2004
Via in Pad Study Evaluating the Impact on Circuit Design,Board Layout,Manufacturing,Emissions Compliance and Product Reliability
Driving factors for the use of via in pad technology include the growing trend towards more dense and complex printed
circuit board designs as well as the need to minimize parasitic capacitance
.. read more
Event
IPC APEX EXPO 2004
Reliability of High Density,High Layer Count,Multilayer Backplanes
This paper discusses the work and testing performed to obtain extreme high reliability performance from high layer count,
large panel format multilayer printed wiring boards that are used for b
.. read more
Event
IPC APEX EXPO 2004
Designing Embedded Resistors and Capacitors
Embedded passives,i.e.,resistors and capacitors built right into the printed circuit board substrate,is a rapidly emerging and
pivotal technology for the PCB industry preceded only by the plate
.. read more
Event
IPC APEX EXPO 2004
Design Considerations for Thin-Film Embedded Resistor and Capacitor Technologies
Embedded passives technologies can provide benefits of size,performance,cost,and reliability to high density,highspeed
designs. A number of embedded passive technology solutions are available t
.. read more
Event
IPC APEX EXPO 2004
Embedded Passives in High Layer Count High Reliability Printed Wiring Boards
This paper will discuss the use of thin film buried resistors and thin core plane pairs in high layer count high reliability
printed wiring boards used in single and double sided surface mount
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Event
IPC APEX EXPO 2004
“Built-In-Trace” Resistors
The newly developed Ohmega-Ply “Resistor-Built-in-Trace” technology uses low-ohmic resistive materials for embedded
resistors congruent to the circuitry in a multilayer PCB or HDI substrate. Hi
.. read more
Event
IPC APEX EXPO 2004
Performance of Polymeric Ultra-thin Substrates for Use as Embedded Capacitors: Comparison of Unfilled and Filled Systems with Ferroelectric Particles
We have previously published our work on developing thin substrates for use as embedded capacitor layers. Based on this
work we have continued to characterize the performance and reliability of
.. read more
Event
IPC APEX EXPO 2004
Decoupling with Anodized Ta
Novel configurations of decoupling capacitors were formed by anodizing Ta,resulting in Ta2O5 films 2000 Å thick and k =
23,giving about 110 nF/cm2. Since the dielectric is very thin,the parasit
.. read more
Event
IPC APEX EXPO 2004
New Developments in Polymer Thick Film Resistor Technology
Motorola has been using embedded polymer thick film resistors on immersion silver-plated copper terminations in products
for four years,and in the past year other firms have begun using this te
.. read more
Event
IPC APEX EXPO 2004
Printed Circuit Board Reliability in High Temperature
This paper will demonstrate the effect high reflow temperatures in lead free processes will have on the reliability of printed
circuit boards from a broad range of laminate materials for both t
.. read more
Event
IPC APEX EXPO 2004
Lead-Free Implementation: Drop-In Manufacturing
The Lead-free electronics manufacturing has become a reality. As of this writing,a few manufacturers have rightfully
reported their total completion to Lead-free production across all facilitie
.. read more
Event
IPC APEX EXPO 2004
Lead Free Process Transition Solder Paste Characteristic Assessment
The migration to Lead Free raw materials in the Electronics Industry will happen faster than the date proposed in the original
draft of the legislation. A true Pb-free solution for product such
.. read more
Event
IPC APEX EXPO 2004
Design Technology,What Does the Roadmap Say?
Event
IPC Fall Meetings 2004
IPC 2610 - Documentation Package
With the advent of CAD and CAM tools,the need arose for a more complete method of data transfer. As layer count
increased,the number of files increased. As trace size and spacing began to decre
.. read more
Event
IPC Fall Meetings 2004
Principles of Land Pattern Design
Event
IPC Fall Meetings 2004
Principles for Implementing BGA and CSP Technology
As IC technology advances,electronic packaging for the ICs has had to advance as well. The package methodology has become technically more sophisticated and physically more complex. For many IC
.. read more
Event
IPC Fall Meetings 2004
Barriers to Implementation of High Performance Embedded Capacitance Laminates
Event
IPC Fall Meetings 2004
Designing Resistors to Embed
Embedding resistors right into the printed circuit board substrate is not new,but it is gaining momentum as a rapidly
emerging and pivotal technology for the PCB industry,perhaps preceded only
.. read more
Event
IPC Fall Meetings 2004
PWB Design: Beyond Copper Interconnects
Two emerging board technologies,embedded passives and embedded optical waveguides,have the potential to change the way that printed wiring boards operate. No longer will interconnects be relega
.. read more
Event
IPC Fall Meetings 2004
Materials Information for Flex Designers and Fabricators
A flexible circuit is more than just thin materials made into an interconnecting device. Understanding the characteristics of the materials and their properties versus circuit design type and r
.. read more
Event
IPC Fall Meetings 2004
CSP Requirements Being Addressed by IPC Flexible Circuits Standards
Event
IPC Fall Meetings 2004
Developments to Improve the Process Window and Pin Testability of Lead Free Solder Pastes
Event
IPC Fall Meetings 2004
Performance and Printing of Pb-Free Solder Paste for 100-micron Pitch Geometries
Recent advances in chip technologies have prompted a rapid increase in the density of solder joints in electronic components. Further reductions in pitch are likely,leading to joint structures
.. read more
Event
IPC Fall Meetings 2004
Flex Based 3D Package Innovations for Enabling Low Cost System Level Integration and Miniaturization
Hand-held communication and entertainment products continue to dominate the consumer markets worldwide and,with each generation,offering more and more features and/or capability. And even thoug
.. read more
Event
IPC Fall Meetings 2004
How to Design with Flex in Mind
Event
IPC Fall Meetings 2004
Flexible Printed Boards
This paper describes flexible printed circuit boards,used as “Product Boards” or “Interposers”,chip mounting structures. Traditionally,flexible circuit boards are made with polyimide dielectric
.. read more
Event
IPC Fall Meetings 2004
Flip Chip Processing Solutions as used in System in Package Applications
Dramatic changes are underway in the computer,telecommunication,automotive,and consumer electronics
industries. Changes that demand common and pervasive requirements for active assemblies such
.. read more
Event
IPC Printed Circuits Expo 2003
Cost-Effective Placement Machine Capability Analysis and Process Control
New component packaging formats create the need for greater production process stability,reproducibility and
precision. This leads to a growing demand for process control solutions.
As manufact
.. read more
Event
IPC Fall Meetings 2003
Optimized System Design Through Industry Benchmarking of Fabrication Tolerances and Material Properties
Benchmarking of industry fabrication capability,feature tolerances and material property variation is essential to
aligning product requirements and industry capability. Statistical based chara
.. read more
Event
IPC Fall Meetings 2003
A Case Study of an OEM's Program to Assess Supplier Capabilities,Technology Availability,and Reliability for Advanced Printed Circuit Boards
Teradyne,Inc. has been involved with Conductor Analysis Technologies,Inc. (CAT Inc.) for over 4 years and the
IPC D-36 Subcommittee for over 2 years. This paper describes the initial motivation
.. read more
Event
IPC Fall Meetings 2003
AOI for NPI and Process Control
Event
IPC Fall Meetings 2003
Design for manufacture and inspection
Event
IPC Fall Meetings 2003
Integration of AOI in a Total Quality Management Program
Event
IPC Fall Meetings 2003
Laser-Based 3D AOI for SMT Assembly Processes
Event
IPC Fall Meetings 2003
Challenges in Bare Die Mounting
Traditionally,the evolution of advanced IC assemblies has been due to defense and aerospace applications,where
reliability,size and weight were at a premium,and cost was a secondary considerati
.. read more
Event
IPC Fall Meetings 2003
Galvanic Compatibility of Immersion Gold and Immersion Silver Printed Wiring Board Finishes with Aluminum
Numerous industry studies have been performed examining the compatibility between new plating finishes and other metals
used in printed wiring assemblies. The transition to the new printed wiri
.. read more
Event
IPC Fall Meetings 2003