Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Reliable Solder Identification by X-ray Fluorescence Spectroscopy
High reliability applications in the military and aerospace industry require reliable solder finish
identification on components within the supply system of DoD,NASA,and many other organization
.. read more
Design for Reliability: The Next Generation
As margins on electronics technology have continued to erode,an increasing number of organizations have implemented design for reliability practices to ensure device performance while meeting t
.. read more
Die Attach Solder Materials and Application Technology
Advancing technology frequently requires an accompanying advancement in materials technology. Recently,these advances are also driven by changes in environmental legislation as well. Specifical
.. read more
Integrating Cleaning Equipment and Cleaning Agent for Maximum Performance
The growing complexity of electronic assemblies increases the cleaning challenge due to miniaturization,lower component gaps,and improved flux designs. The need to remove ionizable contaminants
.. read more
An Investigation into Hand Sanitizers and Hand Lotions and Potential Risks to High Performance Electronics
As people become more concerned about the global outbreaks of various strains of influenza,more precautions are being taken with respect to personal hygiene. A common precaution involves the us
.. read more
Understanding Cleanliness and Methods of Determination
Several methods exist to determine cleanliness of printed wiring assemblies. This presentation will describe the common methods used for determining cleanliness of printed wiring assemblies. Th
.. read more
Production of Flexible Circuits in Reel to Reel Horizontal Production Systems
Reel to reel production of flexible circuits where the substrate consists of a continuous roll is a technique commonly used in mass production. This method is an obvious solution for efficient
.. read more
A New System for Automatically Registering and Exposing Solder Mask and Other Photopolymeric Materials Requiring High Energy Lamp Sources
An overview of previous work regarding light enegine development is provided,proceeded by an in-depth overview of new technology available for solder mask imaging.
.. read more
Toughened Laminates for Printed Circuit Boards: Correlation of Drillability to Material Properties
With the miniaturization of electronic devices1,the need for more versatile materials to make these devices increases. Coupled with the gradual removal of lead-based solders2,thermal stability
.. read more
Lead-Free Flux Technology and Influence on Cleaning
Lead-free flux technology for electronic industry is mainly driven by high soldering temperature,high alloy surface tension, miniaturization,air soldering due to low cost consideration,and envi
.. read more
Selecting Cleaning Processes for Electronics Defluxing: Total Cost of Ownership
Electronics manufacturing process engineers are faced with significant challenges when selecting a cleaning system as a
consequence of the wide ranges of cleaning processes and equipment. Curre
.. read more
Validity of the IPC R.O.S.E. Method 2.3.25 Researched
Miniaturization and higher functionality in electronics packaging require the use of advanced packages and small components. This trend has translated into the use of new package types such as
.. read more
The Use of Inkjet Printing Technology for Fabricating Electronic Circuits – The Promise and the Practical
Manufacturers of electronic devices are always searching for new technologies that can improve processes,extend capabilities and lower costs. These drivers,along with the needs of new markets l
.. read more
Industrial PCB Development using Embedded Passive & Active Discrete Chips Focused on Process and DfR
For several years,3D-integration approaches have been explored to keep pace with the continuous trends towards electronics
miniaturization and densification. Numerous technologies issued from v
.. read more
A Novel Primer Coating on Organic Substrate for Reliable Inkjet Printed Circuit
Even though ink jet printed circuit has many advantages over typical subtractive PWB technology such as fewer processes,less waste and labor,it has some problems. A major problem is weak adhesi
.. read more
PCB Design and Assembly for Flip-Chip and Die Size CSP
As new generations of electronic products emerge they often surpass the capability of existing packaging and interconnection technology and the infrastructure needed to support newer technologi
.. read more
The Universal PCB Design Grid System
Mixing PCB Design Layout units will compromise perfection every time. PCB Design perfection starts with building CAD
library parts and quickly moves to part placement,via fanout and trace routi
.. read more
A Strategy for Via Connections in Embedded Sheet Capacitance Designs
Predicting the electrical performance of embedded capacitor PCB designs has been a major stumbling block for the technology. In particular,one of the key questions has been how quickly can char
.. read more
Filling in the Gaps in Lead-Free Reliability Modeling and Testing
This presentation discusses critical material properties and test data that are often overlooked in the introduction of new lead-free solder alloys,but are critical to alloy comparison and the
.. read more
Solder Creep-Fatigue Model Parameters for SAC & SnAg Lead-Free Solder Joint Reliability Estimation
For many of the Pb-free solders required under the European RoHS directive,there is now sufficient information,primarily in the form of the results of accelerated thermal cycling of various lev
.. read more
Nanotechnology for Lead-Free PWB Final Finishes with Organic Metal
The use of an Organic Metal finish only a few nano-meters deposited onto copper pads of printed circuit boards provides effective protection against oxidation and preserves solderability. The N
.. read more
Comparison of the Electrochemical and Physical Properties of Nanocrystalline Copper Deposition in the Fabrication of Printed Wiring Boards
Typical electrodeposition of conventional metals produces deposits that are polycrystalline in nature,comprised of many crystal grains separated by grain boundaries. Adding grain refiners to a
.. read more
Chemical “Kick Start” for the Autocatalytic Formaldehyde-Free Electroless Copper Plating Process
The present work describes the use of additives in formaldehyde-free copper solutions to improve the start reaction of
electroless copper deposition.
Conventional electroless copper plating sol
.. read more
OA Flux Cleaning Studies on Highly Dense Advanced Packages Parameters
Cleaning flux residues post soldering has been a high reliability criterion practiced by assemblers of military,aerospace,automotive,medical devices and other value offerings. Highly dense adva
.. read more
Case Study – “Limitations of DI-Water Cleaning Processes”
While most cleaning processes in the global electronics manufacturing industry still rely on cleaning with DI-water only (for OA flux removal),recent studies suggest that water is beginning to
.. read more
Cleanliness of Stencils and Cleaned Misprinted Circuit Boards
The effectiveness of cleaning stencils and misprinted/dirty printed circuit boards can be effectively monitored. This can be done by washing known clean circuit boards and then checking to see
.. read more
Robust Automated Void Detection in Solder Balls and Joints
Accuracy in solder balls and joint void detection is very important. If voids are incorrectly identified,board yield will be affected by incorrect scrapping and rework. Voids are difficult to d
.. read more
Advances in Automatic Monitoring of Stencil Printing Processes
The electronics assembly industry has long wished for and made great advancements toward developing a true,closed-loop automatic print verification and process monitoring technology. While sign
.. read more
Zoom Fixtures for ATE
This paper details a break-through technology for automatic test equipment (ATE) fixtures. These new fixtures address the current market needs of - "faster,cheaper,and smaller". The new fixture
.. read more
Reliable Solder Identification by X-ray Fluorescence Spectroscopy
High reliability applications in the military and aerospace industry require reliable solder finish
identification on components within the supply system of DoD,NASA,and many other organization
.. read more
Design for Reliability: The Next Generation
As margins on electronics technology have continued to erode,an increasing number of organizations have implemented design for reliability practices to ensure device performance while meeting t
.. read more
Die Attach Solder Materials and Application Technology
Advancing technology frequently requires an accompanying advancement in materials technology. Recently,these advances are also driven by changes in environmental legislation as well. Specifical
.. read more
Integrating Cleaning Equipment and Cleaning Agent for Maximum Performance
The growing complexity of electronic assemblies increases the cleaning challenge due to miniaturization,lower component gaps,and improved flux designs. The need to remove ionizable contaminants
.. read more
An Investigation into Hand Sanitizers and Hand Lotions and Potential Risks to High Performance Electronics
As people become more concerned about the global outbreaks of various strains of influenza,more precautions are being taken with respect to personal hygiene. A common precaution involves the us
.. read more
Understanding Cleanliness and Methods of Determination
Several methods exist to determine cleanliness of printed wiring assemblies. This presentation will describe the common methods used for determining cleanliness of printed wiring assemblies. Th
.. read more
Production of Flexible Circuits in Reel to Reel Horizontal Production Systems
Reel to reel production of flexible circuits where the substrate consists of a continuous roll is a technique commonly used in mass production. This method is an obvious solution for efficient
.. read more
A New System for Automatically Registering and Exposing Solder Mask and Other Photopolymeric Materials Requiring High Energy Lamp Sources
An overview of previous work regarding light enegine development is provided,proceeded by an in-depth overview of new technology available for solder mask imaging.
.. read more
Toughened Laminates for Printed Circuit Boards: Correlation of Drillability to Material Properties
With the miniaturization of electronic devices1,the need for more versatile materials to make these devices increases. Coupled with the gradual removal of lead-based solders2,thermal stability
.. read more
Lead-Free Flux Technology and Influence on Cleaning
Lead-free flux technology for electronic industry is mainly driven by high soldering temperature,high alloy surface tension, miniaturization,air soldering due to low cost consideration,and envi
.. read more
Selecting Cleaning Processes for Electronics Defluxing: Total Cost of Ownership
Electronics manufacturing process engineers are faced with significant challenges when selecting a cleaning system as a
consequence of the wide ranges of cleaning processes and equipment. Curre
.. read more
Validity of the IPC R.O.S.E. Method 2.3.25 Researched
Miniaturization and higher functionality in electronics packaging require the use of advanced packages and small components. This trend has translated into the use of new package types such as
.. read more
The Use of Inkjet Printing Technology for Fabricating Electronic Circuits – The Promise and the Practical
Manufacturers of electronic devices are always searching for new technologies that can improve processes,extend capabilities and lower costs. These drivers,along with the needs of new markets l
.. read more
Industrial PCB Development using Embedded Passive & Active Discrete Chips Focused on Process and DfR
For several years,3D-integration approaches have been explored to keep pace with the continuous trends towards electronics
miniaturization and densification. Numerous technologies issued from v
.. read more
A Novel Primer Coating on Organic Substrate for Reliable Inkjet Printed Circuit
Even though ink jet printed circuit has many advantages over typical subtractive PWB technology such as fewer processes,less waste and labor,it has some problems. A major problem is weak adhesi
.. read more
PCB Design and Assembly for Flip-Chip and Die Size CSP
As new generations of electronic products emerge they often surpass the capability of existing packaging and interconnection technology and the infrastructure needed to support newer technologi
.. read more
The Universal PCB Design Grid System
Mixing PCB Design Layout units will compromise perfection every time. PCB Design perfection starts with building CAD
library parts and quickly moves to part placement,via fanout and trace routi
.. read more
A Strategy for Via Connections in Embedded Sheet Capacitance Designs
Predicting the electrical performance of embedded capacitor PCB designs has been a major stumbling block for the technology. In particular,one of the key questions has been how quickly can char
.. read more
Filling in the Gaps in Lead-Free Reliability Modeling and Testing
This presentation discusses critical material properties and test data that are often overlooked in the introduction of new lead-free solder alloys,but are critical to alloy comparison and the
.. read more
Solder Creep-Fatigue Model Parameters for SAC & SnAg Lead-Free Solder Joint Reliability Estimation
For many of the Pb-free solders required under the European RoHS directive,there is now sufficient information,primarily in the form of the results of accelerated thermal cycling of various lev
.. read more
Nanotechnology for Lead-Free PWB Final Finishes with Organic Metal
The use of an Organic Metal finish only a few nano-meters deposited onto copper pads of printed circuit boards provides effective protection against oxidation and preserves solderability. The N
.. read more
Comparison of the Electrochemical and Physical Properties of Nanocrystalline Copper Deposition in the Fabrication of Printed Wiring Boards
Typical electrodeposition of conventional metals produces deposits that are polycrystalline in nature,comprised of many crystal grains separated by grain boundaries. Adding grain refiners to a
.. read more
Chemical “Kick Start” for the Autocatalytic Formaldehyde-Free Electroless Copper Plating Process
The present work describes the use of additives in formaldehyde-free copper solutions to improve the start reaction of
electroless copper deposition.
Conventional electroless copper plating sol
.. read more
OA Flux Cleaning Studies on Highly Dense Advanced Packages Parameters
Cleaning flux residues post soldering has been a high reliability criterion practiced by assemblers of military,aerospace,automotive,medical devices and other value offerings. Highly dense adva
.. read more
Case Study – “Limitations of DI-Water Cleaning Processes”
While most cleaning processes in the global electronics manufacturing industry still rely on cleaning with DI-water only (for OA flux removal),recent studies suggest that water is beginning to
.. read more
Cleanliness of Stencils and Cleaned Misprinted Circuit Boards
The effectiveness of cleaning stencils and misprinted/dirty printed circuit boards can be effectively monitored. This can be done by washing known clean circuit boards and then checking to see
.. read more
Robust Automated Void Detection in Solder Balls and Joints
Accuracy in solder balls and joint void detection is very important. If voids are incorrectly identified,board yield will be affected by incorrect scrapping and rework. Voids are difficult to d
.. read more
Advances in Automatic Monitoring of Stencil Printing Processes
The electronics assembly industry has long wished for and made great advancements toward developing a true,closed-loop automatic print verification and process monitoring technology. While sign
.. read more
Zoom Fixtures for ATE
This paper details a break-through technology for automatic test equipment (ATE) fixtures. These new fixtures address the current market needs of - "faster,cheaper,and smaller". The new fixture
.. read more