Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Round Robin Testing in Support of IPC J-STD-709: Combustion Sample Preparation Methods for Ion Chromatography Analysis of Br and Cl
This paper will present the results of a round robin study of sample combustion followed by ion chromatography (CIC) to measure the concentration of bromine and chlorine in electronic materials
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Effect of Board Clamping System on Solder Paste Print Quality
Stencil printing technology has come a long way since the early 80’s when SMT process gained importance in the electronics
packaging industry. In those early days,components were fairly large,m
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Stencil Design Considerations to Improve Drop Test Performance
Future handheld electronic products will be slimmer than today and deliver more functions,enabled by innovative electronics
packaging design using smaller components with greater I/Os assembled
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Fighting the Undesirable Effects of Thermal Cycling
Most electronic assemblies comprise a number of chips,packages and similar components that are attached to Printed Circuit Boards (PCBs) or similar substrates,usually using solder joints. Also
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Comparative Analysis of Solder Joint Degradation Using RF Impedance and Event Detectors
Under cycling loading conditions,solder joints are susceptible to fatigue cracking,which often initiates at the surface where the strain range is maximized. Event detectors have been widely use
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Poor Metrology: The Hidden Cost
Doing more with less has been the standard operating procedure in manufacturing over the past ten years. Everyone is looking for areas where they can cut corners,maintain quality,and improve pr
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Using DMAIC Methodology for MLP Reflow Process Optimization
The widely publicized and studied implementation of lead free solders has led to increased scrutiny on the solder joint formation for surface mount technology electronic components. During the
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Head-On-Pillow Defect – A Pain in the Neck or Head-On-Pillow BGA Solder Defect
The head on pillow defect is becoming more common. This paper describes one such occurrence for an OEM and explains how it was dealt with. In this particular case it was solved by application o
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A Novel Approach to Experimentally Create and Mitigate Head-in-Pillow Defects
One of the solder joint failures encountered frequently during Printed Circuit Board Assembly (PCBA) is due to Head-in-Pillow (HiP) defects. The primary cause of HiP defect is due to the warpag
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Challenges toward Implementing a Halogen-Free PCB Assembly Process
The electronics industry continues to strive to provide more environmentally friendly products. This movement is partly due to legislation from various countries,partly due to public outcry fro
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A Novel Halogen-Free Material for High Speed PCB
The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f
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Polyphenylene Ether Macromolecules. VI. Halogen Free Flame Retardant Epoxy Resins
An important criterion for dielectric materials used in the microelectronics industry is their flammability. Typically,flame
retardant epoxy resins use bromine-containing flame-retardants. In t
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Stencil Options for Printing Solder Paste for .3 Mm CSP’s and 01005 Chip Components
Printing solder paste for very small components like .3mm pitch CSP’s and 01005 Chip Components is a challenge for the printing process when other larger components like RF shields,SMT Connecto
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Effect of Squeegee Blade on Solder Paste Print Quality
The solder paste deposition process is viewed by many in the industry as the leading contributor of defects in the Surface Mount Technology (SMT) assembly process. As with all manufacturing pro
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Stencil Printing Transfer Efficiency of Circular vs. Square Apertures with the Same Solder Paste Volume
It is frequently noted in surface mount printed circuit board assembly that most solder defects can be traced back to the stencil printing process. In addition,continuous miniaturization trends
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Drop Test Performance of A Medium Complexity Lead-Free Board After Assembly and Rework
The mechanical behavior of printed circuit assemblies (PCA) at high strain rates is very important for the reliability of products used in harsh environments. The transition to Pb-free material
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Pad Cratering Evaluation of PCB
Pad cratering in the PCB is a new failure mode encountered in electronic assemblies,particularly in lead-free products. The
failure mechanisms and root causes are not yet fully understood,and l
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Effect of Environmental Stress and Bias Conditions on Reliability of Embedded Planar Capacitors
The reliability of an embedded planar capacitor laminate under a variety of environmental stress and bias conditions was investigated. The dielectric consisted of a composite of BaTiO3 particle
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Basic PCB Level Assembly Process Methodology for 3D Package-on-Package
The motivation for developing higher density IC packaging continues to be the market and the consumers’ expectation that
each new generation of products furnish greater functionality. The minia
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Throughput vs. Wet-Out Area Study for Package on Package (PoP) Underfill Dispensing
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure devi
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Reliability Evaluation of One-Pass and Two-Pass Techniques of Assembly for Package on Packages under Torsion Loads
Package on Packages (PoP) find use in applications that require high performance with increased memory density. One of the
greatest benefits of PoP technology is the elimination of the expensiv
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Progress in Developing Industry Standard Test Requirements for Pb-Free Solder Alloys
Recently,the industry has seen the development of a wide range of new Pb-free alloys. A significant element of uncertainty within the industry regarding these new alloys is the lack of defined
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Characterizing the Lead-Free Impact on PCB Pad Craters
Pad cratering in Printed Circuit Boards (PCBs) is typically associated with lead-free products. This paper addresses laminate materials and the failures associated with the higher Pb-Free reflo
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Challenges in Reflow Profiling Large and High Density Ball Grid Array (BGA) Packages Using Backward Compatible Assembly Processes
Backward Compatibility of Pb free SnAgCu (SAC) solders with conventional SnPb soldering has been a subject of considerable interest since the introduction of Pb free solders earlier in this dec
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Solder Creep-Fatigue Model Parameters for SAC & Snag Lead-Free Solder Joint Reliability Estimation
For many of the Pb-free solders required under the European RoHS directive,there is now sufficient information,primarily in the form of the results of accelerated thermal cycling of various lev
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