Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Productivity and Cost Efficiency of Lead-Free Selective Soldering
With the advent of widespread lead-free soldering,the issue of copper erosion has surfaced as a major quality concern when
soldering RoHS compliant through-hole devices. Many contract electroni
.. read more
0.3mm W.L CSP Assembly
Due to the ever-aggressive
miniaturization program that is rolling
through the electronics industry,the
next component that is fast approaching
this horizon is the 0.3mm CSP
• This paper will r
.. read more
Mechanical Vibrations: Its Effect on Assembly Equipment and Methods of Characterization
As electronic packages keep shrinking in size,high-speed high-accuracy package assembly equipment are becoming more
sensitive to mechanical vibrations. Alignment,positional and pick & place acc
.. read more
Thermal Expansion of Silicones in Electronic Reliability
CTE mismatches during temperature cycling can cause significant movement of components and materials relative to one
another,which in turn stresses solder joints and wirebonds. Silicones are of
.. read more
Low Dielectric Fabrics
While glass fibers are commonly used to reinforce circuit board substrates,they have a high dielectric constant and loss.
Cyclic olefin copolymer fibers have a lower dielectric constant and los
.. read more
Low Temperature Characteristics of Silicones
Silicones are often used to protect electronic applications designed for cold environments. The low temperature flexibility
of silicones is well recognized,but not as well understood. While the
.. read more
Resin Options for Lead-Free Printed Circuit Boards
The regulation requiring lead-free solders for printed circuit boards (PCBs) has presented a number of challenges to our industry at virtually every stage of the process. For the brominated epo
.. read more
More Robust Base Materials for Electronic Assemblies
The proposed revision of IPC-4101 - Specification for Base Materials for Rigid and Multilayer Printed Boards contains new
slash sheets describing FR-4 base materials compatible with lead free a
.. read more
A Comparison of Materials Testing Methods
Recent global environmental regulations affecting consumer electronics and electrical equipment,such as the European Union’s RoHS Directive,China ‘RoHS’ and others,have driven electronics manuf
.. read more
OEM Guideline to Selecting PCB Suppliers
Many large Original Equipment Manufacturers (OEMs) have a detailed procedure and a significant capital investment in
place for the selection of printed circuit board suppliers. This approval pr
.. read more
Utilization of Buried Capacitance™:A Case Study
Embedding capacitive layers inside the Printed Circuit Board (PCB) have demonstrated the ability to reduce the number of
Surface Mount Technology (SMT) chip decoupling capacitors on the PCB sur
.. read more
North American Environmental Compliance Attitudes Towards Electronics
More and more countries are beginning eco-compliance legislation for electronics products. Where does the USA stand? The
rest of North America? This paper will discuss the following areas and a
.. read more
Material Declaration Reporting - Going Proactive
Focus: Benefits of switching from a reactive to proactive ECR system Even with the RoHS deadline come and gone,most the ECR systems employed by suppliers follow the “reactive” model. Many suppl
.. read more
Designing a Data Storage System for Environmental Compliance (Focusing on RoHS-type Legislation)
As more governments pass,implement,and enforce environmental compliance initiatives covering electronics,small to
medium sized businesses continue to struggle with what data should be tracked,h
.. read more
QFN Rework Challenges in a Lead Free World IPC Midwest - Sept. 2007
It is clear that the future belongs to the ever shrinking component. Micro Lead Frame (MLF) components,and specifically the Quad Flat No-lead (QFN) packages have gained wide scale acceptance.
.. read more
Productivity and Cost Efficiency of Lead-Free Selective Soldering
With the advent of widespread lead-free soldering,the issue of copper erosion has surfaced as a major quality concern when
soldering RoHS compliant through-hole devices. Many contract electroni
.. read more
0.3mm W.L CSP Assembly
Due to the ever-aggressive
miniaturization program that is rolling
through the electronics industry,the
next component that is fast approaching
this horizon is the 0.3mm CSP
• This paper will r
.. read more
Mechanical Vibrations: Its Effect on Assembly Equipment and Methods of Characterization
As electronic packages keep shrinking in size,high-speed high-accuracy package assembly equipment are becoming more
sensitive to mechanical vibrations. Alignment,positional and pick & place acc
.. read more
Thermal Expansion of Silicones in Electronic Reliability
CTE mismatches during temperature cycling can cause significant movement of components and materials relative to one
another,which in turn stresses solder joints and wirebonds. Silicones are of
.. read more
Low Dielectric Fabrics
While glass fibers are commonly used to reinforce circuit board substrates,they have a high dielectric constant and loss.
Cyclic olefin copolymer fibers have a lower dielectric constant and los
.. read more
Low Temperature Characteristics of Silicones
Silicones are often used to protect electronic applications designed for cold environments. The low temperature flexibility
of silicones is well recognized,but not as well understood. While the
.. read more
Resin Options for Lead-Free Printed Circuit Boards
The regulation requiring lead-free solders for printed circuit boards (PCBs) has presented a number of challenges to our industry at virtually every stage of the process. For the brominated epo
.. read more
More Robust Base Materials for Electronic Assemblies
The proposed revision of IPC-4101 - Specification for Base Materials for Rigid and Multilayer Printed Boards contains new
slash sheets describing FR-4 base materials compatible with lead free a
.. read more
A Comparison of Materials Testing Methods
Recent global environmental regulations affecting consumer electronics and electrical equipment,such as the European Union’s RoHS Directive,China ‘RoHS’ and others,have driven electronics manuf
.. read more
OEM Guideline to Selecting PCB Suppliers
Many large Original Equipment Manufacturers (OEMs) have a detailed procedure and a significant capital investment in
place for the selection of printed circuit board suppliers. This approval pr
.. read more
Utilization of Buried Capacitance™:A Case Study
Embedding capacitive layers inside the Printed Circuit Board (PCB) have demonstrated the ability to reduce the number of
Surface Mount Technology (SMT) chip decoupling capacitors on the PCB sur
.. read more
North American Environmental Compliance Attitudes Towards Electronics
More and more countries are beginning eco-compliance legislation for electronics products. Where does the USA stand? The
rest of North America? This paper will discuss the following areas and a
.. read more
Material Declaration Reporting - Going Proactive
Focus: Benefits of switching from a reactive to proactive ECR system Even with the RoHS deadline come and gone,most the ECR systems employed by suppliers follow the “reactive” model. Many suppl
.. read more
Designing a Data Storage System for Environmental Compliance (Focusing on RoHS-type Legislation)
As more governments pass,implement,and enforce environmental compliance initiatives covering electronics,small to
medium sized businesses continue to struggle with what data should be tracked,h
.. read more
QFN Rework Challenges in a Lead Free World IPC Midwest - Sept. 2007
It is clear that the future belongs to the ever shrinking component. Micro Lead Frame (MLF) components,and specifically the Quad Flat No-lead (QFN) packages have gained wide scale acceptance.
.. read more