Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Constitutive and Failure Behavior of SnAgCu Solder Joints
Constitutive and failure descriptions of SnAgCu solder alloys are of great interest at the present. Commonly,constitutive models that have been successfully used in the past for Sn-Pb solders a
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Filling in the Gaps in Lead-Free Reliability Modeling and Testing
This presentation discusses critical material properties and test data that are often overlooked in the introduction of new lead-free solder alloys,but are critical to alloy comparison and the
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Suspect / Counterfeit Electronic Components and Risk Mitigation
In this presentation,numerous examples of counterfeited parts are provided along with the means of identification for the respective technique utilized in production.
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The Impact of Converting Flex Circuits From HASL to a RoHS Compliant Surface Finishes
This paper will explore the most common alternatives to hot air-leveled solder (HASL) as a finish for flex circuits and some of the issues one may want to be aware of when converting. Whether t
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Design Considerations for High Reliability PCB
- History & Importance of PCB - Environmental Initiatives - Reliability Consideration With High Temp Processing - Reliability Considerations for Materials to withstand Lead-Free Assembly
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Pb-Free Reflow,PCB Degradation,and the Influence of Moisture Absorption
Cracking and delamination defects in printed circuit boards (PCBs) during elevated thermal exposure have always been a concern for the electronics industry. However,with the increasing spread o
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Proposed Standardizations of Lead Free Alloy Testing
Although lead free assembly is now widely adopted the industry is still exploring a variety of options for lead free alloys. Attempts to standardize on a single alloy for either reflow or wave
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IPC Solder Products Value Council (SPVC) Lead-Free Technical Subcommittee Report: Take Action Limits (TAL) for SAC305 Lead Free Automated Soldering Processes
At present there are a large number of materials that have been proposed as replacements for lead containing solder for reflow and wave and selective soldering.
Unlike solder paste in a reflow
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Vibration and Mechanical Shock Testing
Little data has been generated on the performance of lead-free solders under vibration and mechanical shock. What data exists suggests that lead-free solders may be less reliable than eutectic
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Implementing Quality and Reliability on the Assembly Line
Many will look to IPC standards for advice or workmanship requirements for electronic assemblies. Some will find a copy of IPC-A-610 Acceptability of Electronic Assemblies and stop there. But I
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High Performance Work Teams in EMS The Critical Difference
This presentation attempts to convince the reader that while all the logistical,equipment,financial and process aspects of any business are important,the high performance work team is the criti
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Manufacturing Quality Issues from the EMS Perspective
As more electronic assembly moves from OEM to EMS providers,a number of key issues arise in the overall value stream of production. This presentation will provide a comprehensive look at qualit
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Microvia Reliability Failure Modes
Recent increases in assembly temperatures in response to removing lead from solder used in printed circuit boards (PCBs)
assembly has increase the strain and stress on interconnect structures.
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Bare Board Material Performance after Pb-free Reflow
This presentation will review the findings of a HDPUG consortia effort to evaluate 29 different bare board material and stack-up combinations and their associated performance after 6X Pb-free r
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Water Vapor Uptake and Release in Printed Boards
Excessive moisture entrapped/absorbed within printed board laminates can expand during soldering operations,causing delamination or other damage. While moisture absorption data is available for
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Why Electroless Palladium: Study on Impact of Electroless Palladium on Electroless Nickel Deposits
Electroless nickel immersion gold (ENIG) has captured the major share of the lead free final finish market globally even though it’s not the least expensive. ENIG not only provides a robust met
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A Study of Solder Optimization Development for Portable Electronic Device
With increasing use of portable appliances such as PDA and cellular phone,changing environment of application requires higher solder joint reliability. The Cu-OSP process has been widely used f
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The Role of the Interfacial Intermetallic in Lead-Free Solder
The formation during the soldering process of the layer of intermetallic compound Cu6Sn5 at the solder substrate interface
provides the essential evidence that a metallurgical bond that is the
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REACH,RoHS,TSCA,CPSC – What’s next?
Restrictions on the use of chemicals in began 30 years ago in the US with the passage of the Toxic Substances Control Act. Over the last five years we have seen a logarithmic increase in produc
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International Environmental Standards for the Electronics Industry
Industry associations,such as IPC,were quick to develop standards to help the electronics industry deal with emerging environmental regulations; however,for regulatory compliance,smooth interna
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Materials Declaration: Practical Tips for Cutting through the Paperwork
This presentation will examine materials declaration from a practical point of view,identify the role of materials declaration in the product lifecycle analysis and thus hone in on the practica
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High Frequency Circuit Materials used in the PCB Industry
Specialty high frequency circuit materials have been used in the PCB industry for decades and for many different reasons. There are several attributes of these materials that are very unique wh
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A Closer Look at why Cleaning prior to Conformal Coating becomes Key in Aspects of Climatic Reliability?
The ever-increasing use of high frequency in high density interconnect (HDI) assemblies,combined with the worldwide move towards lead-free manufacturing,has initiated a closer assessment of eff
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