Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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A Symphony of Synergy: How Certification to the IECQ HSPM Specification
The IPC's Lead Free program addresses one of the 6 Hazardous Substances regulated by the RoHS directive. Certification to the QC 080000,the IECQ HSPM Specification,addresses the other 5 Hazardo
.. read more
An Update of the Regulatory,Environment,and Performance Status of Tetrabromobisphenol-A in Printed Wiring Boards
Tetrabromobisphenol-A (TBBPA) is a commercial flame retardant used in rigid FR-4 printed wiring boards (PWB). It is the single largest volume brominated flame retardant in the world. In this ap
.. read more
Death,Taxes,and Environmental Compliance: Things you can count on
The European Union passed two directives in 2003 addressing the increasing amount of waste from electric and electronic equipment: (1) Directives 2002/96/ECi – Waste Electrical and Electronic E
.. read more
Performance of Photoimageable Solder Masks – A Study on Thermal Stress
The continuous temperature resistance of electrically insulating materials can be judged by examining the effect of thermal stress loads on the electrical properties,such as moisture and insula
.. read more
Black Pad and Revisiting Methodologies
Society today relies on electronic devices that influence every aspect of our lives,such as communication,transportation,computing,home appliances,and recreation. The reliability of any electro
.. read more
Micro Drill Bit Design on the Basis of the Combination of Theoretical Analysis,Numerical Simulation and Experimental Verification
To improve the design efficiency of a micro drill bit,a method on the basis of the combination of theoretical analysis,numerical simulation and experimental verifications is presented. As examp
.. read more
Hybrid Drying Technology for In-line Aqueous
boards in the in-line aqueous cleaning process. As lead-free circuit boards become more complex and component spacing
decreases,the effectiveness of direct blow-off drying is greatly diminished
.. read more
Critical Cleaning of Highly Densed Electronic Assemblies in the Lead Free
An important development in high reliability electronics is the convergence of circuit board and advanced packaging technologies. This combination enhances the best attributes of each technolog
.. read more
A New AOI Programming and Inspection Paradigm Based On Recent Studies in Neuroscience Reduces the Need for Human Intervention and...
The hidden cost of optical inspection systems is often in the programming time. In this paper we discuss a new AOI programming and inspection paradigm reduces the need for human intervention an
.. read more
Improving SMT Yield with AOI and AXI Test Results Analysis
As printed circuit board assembly (PCBA) becomes more complex,Automatic Optical Inspection (AOI) and Automatic Xray Inspection (AXI) systems are becoming more widely used in electronics manufac
.. read more
The Utilization of X-ray to Effectively Test Quad Flat No-Lead Packages
The Quad Flat No-Lead or QFN packages are increasing in their utilization in the printed circuit board market. This is being driven largely by the shrinking size both in profile and footprint,h
.. read more
BGA Breakout Challenges
The routing of large pin-count and dense BGAs has a significant impact on the cost of the PCB,primarily in terms of layer count and via technology. This paper is the result of considerable rese
.. read more
How to use Simulation Kits to Accelerate High-Speed,High-Density Design
With design requirements becoming more stringent as implementation of new technology standards evolve,designers are faced with the challenge of front-loading more effort in the design cycle tha
.. read more
LOWERING LAYERS w/HDI for RoHS ROBUSTNESS
A perplexing challenge for RoHS compliance is adapting large,complex and thick,high-layer count multilayers to lead-free assembly. These are typically dense,complex assemblies with large BGAs a
.. read more
X-Ray Fluorescence Equipment and Materials Characterization for RoHS Compliances
Environmental compliance is becoming a global effort in the electrical and electronics industry. The Directive on “Restriction of Hazardous Substances” (RoHS) in Europe,is forcing the electroni
.. read more
Understanding of XRF Technology and Clarification of its Application for RoHS
RoHS directives require screening and quantification of certain elements and compounds used in electronics components and parts.
X-ray Fluorescence (XRF) technology has emerged as an effective
.. read more
Use of EDXRF for RoHS Compliance Screening in PCBA Manufacturing
With the enactment of the European Union (EU) ROHS Directive 2002/95/EC (Ref.1),certain electrical and electronic products that are manufactured in or exported to the European Union have restri
.. read more
Humidity-Dependent Loss in PCB Substrates
Increasing operating frequency of IO busses for computing has highlighted the importance of transmission line loss. For FR4 PCB mother boards computing at speeds above 1 GHz this is dominated b
.. read more
Bifunctional Low Molecular Weight Polyphenylene Ether Resins for PWB Base Materials
A new bifunctional low molecular weight polyphenylene ether (OPE oligophenylene ether) was obtained by the oxidative coupling of 2,2’,3,3’,5,5’-hexamethyl-[1,1’-biphenyl]-4,4’-diol (HMBP hexame
.. read more
AFFORDABLE MICROWAVE CIRCUIT BOARD SUBSTRATE MATERIAL
While glass fibers are commonly used to reinforce circuit board substrates,they have a high dielectric constant and loss. Cyclic olefin copolymer fibers have a lower dielectric constant and los
.. read more
Effect of OSP Chemistry on the Hole Fill Performance During Pb-free Wave Soldering
This paper analyzes the differences in plated through hole fill performance between the regular OSP and Pb-free OSP PCB surface finish chemistries in a Pb-free wave solder process. The variable
.. read more
Describing Key Coating and Process Characteristics of a Pb-Free OSP Process
Organic Solderability Preservatives (OSP) continue to attract significant attention as circuit board final finishes. They have evolved from simple and thin benzotriazole coatings to thicker and
.. read more
Yet More Analysis from the Alternate Finishes Task Group Report on Time,Temperature and Humidity Stress of Final Board Finish Solderability
The data from the IPC Alternate Finishes Task Group Report “Time,Temperature and Humidity Stress for Final Finish Board Solderability” has been analyzed in a greater depth than in the actual re
.. read more
Microwave Characteristics and Applications of Liquid Crystal Polymer Flex
We present the electrical characterization of our Liquid Crystal Polymer (LCP) at microwave and millimeter frequencies and the applications of LCP to circuit components. We use several methodol
.. read more
Lead Free Processing and other Thermal Challenges for Flexible Printed Circuits
In this paper,factors that influence the ability for a flex circuit,especially a multilayer flex circuit,to survive the lead-free soldering and other thermal processes during the circuit fabric
.. read more
Stacked Array Packaging A Flex Based IC Packaging Solution for Single and 3D Multiple Die Applications
The challenge manufactures face when competing in the world marketplace is to offer a product that will meet all performance and functionality expectations without increasing product size or co
.. read more
Intellectual Property Management: Maximizing the Value of Your Copyright Trademark,Patent,and Trade Secret
Copyright,like all other forms of intellectual property,is based on negative rights. A copyright registrant may exclude others from reproducing a given copyrighted work,composing a derivative w
.. read more
Transitioning to Offshore Sourcing Challenges
Transitioning to offshore sourcing has become a seductive argument for cost reduction. Most managers agree that the impact has been beneficial to the consumer and the trading conglomerates. Thi
.. read more
A Symphony of Synergy: How Certification to the IECQ HSPM Specification
The IPC's Lead Free program addresses one of the 6 Hazardous Substances regulated by the RoHS directive. Certification to the QC 080000,the IECQ HSPM Specification,addresses the other 5 Hazardo
.. read more
An Update of the Regulatory,Environment,and Performance Status of Tetrabromobisphenol-A in Printed Wiring Boards
Tetrabromobisphenol-A (TBBPA) is a commercial flame retardant used in rigid FR-4 printed wiring boards (PWB). It is the single largest volume brominated flame retardant in the world. In this ap
.. read more
Death,Taxes,and Environmental Compliance: Things you can count on
The European Union passed two directives in 2003 addressing the increasing amount of waste from electric and electronic equipment: (1) Directives 2002/96/ECi – Waste Electrical and Electronic E
.. read more
Performance of Photoimageable Solder Masks – A Study on Thermal Stress
The continuous temperature resistance of electrically insulating materials can be judged by examining the effect of thermal stress loads on the electrical properties,such as moisture and insula
.. read more
Black Pad and Revisiting Methodologies
Society today relies on electronic devices that influence every aspect of our lives,such as communication,transportation,computing,home appliances,and recreation. The reliability of any electro
.. read more
Micro Drill Bit Design on the Basis of the Combination of Theoretical Analysis,Numerical Simulation and Experimental Verification
To improve the design efficiency of a micro drill bit,a method on the basis of the combination of theoretical analysis,numerical simulation and experimental verifications is presented. As examp
.. read more
Hybrid Drying Technology for In-line Aqueous
boards in the in-line aqueous cleaning process. As lead-free circuit boards become more complex and component spacing
decreases,the effectiveness of direct blow-off drying is greatly diminished
.. read more
Critical Cleaning of Highly Densed Electronic Assemblies in the Lead Free
An important development in high reliability electronics is the convergence of circuit board and advanced packaging technologies. This combination enhances the best attributes of each technolog
.. read more
A New AOI Programming and Inspection Paradigm Based On Recent Studies in Neuroscience Reduces the Need for Human Intervention and...
The hidden cost of optical inspection systems is often in the programming time. In this paper we discuss a new AOI programming and inspection paradigm reduces the need for human intervention an
.. read more
Improving SMT Yield with AOI and AXI Test Results Analysis
As printed circuit board assembly (PCBA) becomes more complex,Automatic Optical Inspection (AOI) and Automatic Xray Inspection (AXI) systems are becoming more widely used in electronics manufac
.. read more
The Utilization of X-ray to Effectively Test Quad Flat No-Lead Packages
The Quad Flat No-Lead or QFN packages are increasing in their utilization in the printed circuit board market. This is being driven largely by the shrinking size both in profile and footprint,h
.. read more
BGA Breakout Challenges
The routing of large pin-count and dense BGAs has a significant impact on the cost of the PCB,primarily in terms of layer count and via technology. This paper is the result of considerable rese
.. read more
How to use Simulation Kits to Accelerate High-Speed,High-Density Design
With design requirements becoming more stringent as implementation of new technology standards evolve,designers are faced with the challenge of front-loading more effort in the design cycle tha
.. read more
LOWERING LAYERS w/HDI for RoHS ROBUSTNESS
A perplexing challenge for RoHS compliance is adapting large,complex and thick,high-layer count multilayers to lead-free assembly. These are typically dense,complex assemblies with large BGAs a
.. read more
X-Ray Fluorescence Equipment and Materials Characterization for RoHS Compliances
Environmental compliance is becoming a global effort in the electrical and electronics industry. The Directive on “Restriction of Hazardous Substances” (RoHS) in Europe,is forcing the electroni
.. read more
Understanding of XRF Technology and Clarification of its Application for RoHS
RoHS directives require screening and quantification of certain elements and compounds used in electronics components and parts.
X-ray Fluorescence (XRF) technology has emerged as an effective
.. read more
Use of EDXRF for RoHS Compliance Screening in PCBA Manufacturing
With the enactment of the European Union (EU) ROHS Directive 2002/95/EC (Ref.1),certain electrical and electronic products that are manufactured in or exported to the European Union have restri
.. read more
Humidity-Dependent Loss in PCB Substrates
Increasing operating frequency of IO busses for computing has highlighted the importance of transmission line loss. For FR4 PCB mother boards computing at speeds above 1 GHz this is dominated b
.. read more
Bifunctional Low Molecular Weight Polyphenylene Ether Resins for PWB Base Materials
A new bifunctional low molecular weight polyphenylene ether (OPE oligophenylene ether) was obtained by the oxidative coupling of 2,2’,3,3’,5,5’-hexamethyl-[1,1’-biphenyl]-4,4’-diol (HMBP hexame
.. read more
AFFORDABLE MICROWAVE CIRCUIT BOARD SUBSTRATE MATERIAL
While glass fibers are commonly used to reinforce circuit board substrates,they have a high dielectric constant and loss. Cyclic olefin copolymer fibers have a lower dielectric constant and los
.. read more
Effect of OSP Chemistry on the Hole Fill Performance During Pb-free Wave Soldering
This paper analyzes the differences in plated through hole fill performance between the regular OSP and Pb-free OSP PCB surface finish chemistries in a Pb-free wave solder process. The variable
.. read more
Describing Key Coating and Process Characteristics of a Pb-Free OSP Process
Organic Solderability Preservatives (OSP) continue to attract significant attention as circuit board final finishes. They have evolved from simple and thin benzotriazole coatings to thicker and
.. read more
Yet More Analysis from the Alternate Finishes Task Group Report on Time,Temperature and Humidity Stress of Final Board Finish Solderability
The data from the IPC Alternate Finishes Task Group Report “Time,Temperature and Humidity Stress for Final Finish Board Solderability” has been analyzed in a greater depth than in the actual re
.. read more
Microwave Characteristics and Applications of Liquid Crystal Polymer Flex
We present the electrical characterization of our Liquid Crystal Polymer (LCP) at microwave and millimeter frequencies and the applications of LCP to circuit components. We use several methodol
.. read more
Lead Free Processing and other Thermal Challenges for Flexible Printed Circuits
In this paper,factors that influence the ability for a flex circuit,especially a multilayer flex circuit,to survive the lead-free soldering and other thermal processes during the circuit fabric
.. read more
Stacked Array Packaging A Flex Based IC Packaging Solution for Single and 3D Multiple Die Applications
The challenge manufactures face when competing in the world marketplace is to offer a product that will meet all performance and functionality expectations without increasing product size or co
.. read more
Intellectual Property Management: Maximizing the Value of Your Copyright Trademark,Patent,and Trade Secret
Copyright,like all other forms of intellectual property,is based on negative rights. A copyright registrant may exclude others from reproducing a given copyrighted work,composing a derivative w
.. read more
Transitioning to Offshore Sourcing Challenges
Transitioning to offshore sourcing has become a seductive argument for cost reduction. Most managers agree that the impact has been beneficial to the consumer and the trading conglomerates. Thi
.. read more