Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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PCB Design for Flipchip Components
The emerging technology known as ‘flipchips’ is poised to take over the world of the portable device. In an age when
more and more power and functionality is being offered in ever smaller packa
.. read more
A Comparison of PCB Adhesion Test Methods and Adhesion Promoters
Interest in the adhesive strength of PCBs has recently come to the forefront of the industry. This has been driven by the
advent of lead free soldering processes that severely stress the mechan
.. read more
The Importance of CTE in Multi-Layer Registration and Improved Measurement Methods
The current worldwide market for printed circuit boards is approximately $40 billion,with the multi-layer printed circuit
boards (MLB) comprising approximately 40% of the market. One of the mos
.. read more
Embedding Passive and Active Components in PCB - Solution For Miniaturization
The miniaturization of the electronics continues and requires the utilization of inner space of a PCB for component
placement. The embedding of the passive components inside the PCB has already
.. read more
Novel Substrate for Use as Embedded Capacitance: An Easy to Process Higher Dk Material
We have previously published our work on developing thin substrates for use as embedded capacitor layers. Both unfilled
and filled materials were characterized in regards to performance,reliabi
.. read more
Trimming Embedded Resistors Using Available PWB Equipment Technology
By using two existing pieces of common printed wiring board manufacturing equipment,embedded resistor manufacturers
can obtain laser trim results similar to the trimming obtained using a specia
.. read more
The Latest Technical Trend of Dry Film Photo Resist
This paper describes the performance of several types of the most advanced Dry Film photo Resist (DFR),for producing
high-density package substrates and chip on films (COF).
1) High resolution
.. read more
The Development of Dry Film Photoresist with 15um Lines and Spaces Resolution for Semi-Additive Processing
Next generation IC substrate designs will feature higher interconnect density and faster signal speed than current designs.
Circuitization of these substrates uses copper pattern plating follow
.. read more
High Yields and Low Costs Liquid Resists
In the multilayer PCB industry,the process of making the inner layer is the first step in a number of complex steps that
results in the production of a printed wiring board. This imaging manufa
.. read more
Practical Lead-Free Implementation
Environmental regulations are forcing the elimination of lead (Pb) from electronic equipment. 2005 will be the year that
many electronics assemblers will be transitioning their soldering proces
.. read more
Low Cost Lead Free Solution Evaluation for Electronic Consumer Applications
Lead products are no longer an option if you want to export to the EU market. RoHS regulations requiring the manufacture of
lead-free electronic products by July 2006 are pushing the industry t
.. read more
Lead-Free Product Transition: Impact on Printed Circuit Board Design and Material Selection
Electronic products are being stressed by increasing operating temperatures and higher assembly temperatures. Silicon and
product power consumption are increasing as the silicon densities and s
.. read more
A Study on Coplanar Structures for High Speed Transmission
Demand for higher speed digital signal processing is notable today in the electronics industry. To meet this demand,circuit
designs that employ coplanar structure,either for both single-end and
.. read more
Non-Classical Conductor Losses due to Copper Foil Roughness and Treatment
In high speed digital interconnects; signal attenuation is a result of both dielectric losses and conductor losses. Previous
works have showed in detail,the characterization and modeling effort
.. read more
High Power LED and Thermal Management
A high-power-SMD-LED (HL-LED) outline 3,3 x 2,9 mm² was developed,with chip-size up to 1 mm² and power dissipation
up to 1.500 mW (400 mA for UV-InGaN) in a corresponding thermal ambient. The t
.. read more
Advanced Filled Via Plating Methodology
This paper describes Advanced Filled Via Plating Methodology for stacked via technology. In this paper,via bottom crevice,
via bottom land etching and electroless copper plating coverage is foc
.. read more
Optimised Vertical Process for Microvia Filling and Through Hole Metallization Under Production-like Conditions
This article summarises how a copper metallization process for simultaneous via filling and through hole plating was
developed on a laboratory scale and the challenges encountered by scale-up t
.. read more
FVSS (Free Via Stacked up Structure)
The miniaturization of mobile electronic devices continues,market trends toward lighter and thinner printed circuit boards (PWB) have been accelerating. At the same time,the demand for increase
.. read more
Design for Manufacture – Ceramic Thick-Film Embedded Capacitors
Embedding discrete capacitors right into printed circuit boards (PWB),although not new,is part of a pivotal technology for
the PWB industry. For example,the ability to locate decoupling capacit
.. read more
Electrical Behavior of Thin Film Embedded Decoupling Capacitor in Printed Circuit Boards
In this study,we developed the thin film embedded decoupling capacitors and experimentally investigated its electrical
behavior in terms of power-ground impedance and simultaneous switching noi
.. read more
Materials for Capacitor Embedding in PWBs
We have developed a new resin-coated-foil (RCF) material named MCF-HD-45 to be embedded in PWBs to constitute
capacitors. The material is composed of a thermosetting resin and a high dielectric
.. read more
Removal of Palladium Residue in Semi-Additive Process for Enhanced Reliability in
In order to satisfy the ever-increasing demand for smaller and lighter electronic devices,a drastic miniaturization is making
rapid progresses for even circuit features on printed wiring boards
.. read more
Wiring Process by Electrophotography and Electroless Plating
For the purpose of mask-less manufacturing for Printed Circuit Board (PCB),a new process using electrophotography
technology,principle of copy machines,has been proposed and evaluated. Wiring p
.. read more
Oxidation and Topography of Powder in Pb-free Solder Paste
There are compelling reasons to study the relationship between oxidation and the topography of solder powder; these
include the following:
?? Customer requirements to reflow SAC-based (SnAgCu)
.. read more
The Effect of Ni on the Microstructure and Behaviour of the Sn-Cu Eutectic Lead-free Solder
While the Ni-stabilized Sn-0.7Cu alloy is now well established as a viable lead-free solder in large scale commercial printed
circuit board assembly the effect of Ni is not yet fully understood
.. read more
Lead Free Flip Chip and Chip Scale Package Inspection: New Challenges Will Require New Inspection Technologies
Lead free implementation will present new challenges for PCB manufacturers from a design,soldering process,and QC
standpoint. The higher reflow process temperatures will cause greater thermal s
.. read more
OEE,the New Gauge on the Dashboard for the PCB Assembly Industry
OEE (Overall Equipment Effectiveness) is commonly used in a wide range of businesses when it comes to measuring and
monitoring manufacturing performance. Even though OEE has been applied in var
.. read more
An Open Standards Based Approach to the Exchange of Data in an Automated Electronics Assembly Operation
A tier one supplier to the automotive industry has determined that a key to staying competitive in the electronics
manufacturing industry is to adopt open standards for the exchange of data. Sp
.. read more
Optimizing Production Cost with Electronic Manufacturing Simulation
Factory simulation has been used extensively to optimize and reduce costs across many manufacturing disciplines.
Unfortunately,general purpose factory simulators do not effectively model the sp
.. read more
Filling Pastes in PCB Production – Fields of Application,Possibilities and Limitations
In the past the use of filling pastes in PCB production was largely limited to via hole fillers. These materials with a solids
content of 100% are still successfully employed today to close via
.. read more
PCB Design for Flipchip Components
The emerging technology known as ‘flipchips’ is poised to take over the world of the portable device. In an age when
more and more power and functionality is being offered in ever smaller packa
.. read more
A Comparison of PCB Adhesion Test Methods and Adhesion Promoters
Interest in the adhesive strength of PCBs has recently come to the forefront of the industry. This has been driven by the
advent of lead free soldering processes that severely stress the mechan
.. read more
The Importance of CTE in Multi-Layer Registration and Improved Measurement Methods
The current worldwide market for printed circuit boards is approximately $40 billion,with the multi-layer printed circuit
boards (MLB) comprising approximately 40% of the market. One of the mos
.. read more
Embedding Passive and Active Components in PCB - Solution For Miniaturization
The miniaturization of the electronics continues and requires the utilization of inner space of a PCB for component
placement. The embedding of the passive components inside the PCB has already
.. read more
Novel Substrate for Use as Embedded Capacitance: An Easy to Process Higher Dk Material
We have previously published our work on developing thin substrates for use as embedded capacitor layers. Both unfilled
and filled materials were characterized in regards to performance,reliabi
.. read more
Trimming Embedded Resistors Using Available PWB Equipment Technology
By using two existing pieces of common printed wiring board manufacturing equipment,embedded resistor manufacturers
can obtain laser trim results similar to the trimming obtained using a specia
.. read more
The Latest Technical Trend of Dry Film Photo Resist
This paper describes the performance of several types of the most advanced Dry Film photo Resist (DFR),for producing
high-density package substrates and chip on films (COF).
1) High resolution
.. read more
The Development of Dry Film Photoresist with 15um Lines and Spaces Resolution for Semi-Additive Processing
Next generation IC substrate designs will feature higher interconnect density and faster signal speed than current designs.
Circuitization of these substrates uses copper pattern plating follow
.. read more
High Yields and Low Costs Liquid Resists
In the multilayer PCB industry,the process of making the inner layer is the first step in a number of complex steps that
results in the production of a printed wiring board. This imaging manufa
.. read more
Practical Lead-Free Implementation
Environmental regulations are forcing the elimination of lead (Pb) from electronic equipment. 2005 will be the year that
many electronics assemblers will be transitioning their soldering proces
.. read more
Low Cost Lead Free Solution Evaluation for Electronic Consumer Applications
Lead products are no longer an option if you want to export to the EU market. RoHS regulations requiring the manufacture of
lead-free electronic products by July 2006 are pushing the industry t
.. read more
Lead-Free Product Transition: Impact on Printed Circuit Board Design and Material Selection
Electronic products are being stressed by increasing operating temperatures and higher assembly temperatures. Silicon and
product power consumption are increasing as the silicon densities and s
.. read more
A Study on Coplanar Structures for High Speed Transmission
Demand for higher speed digital signal processing is notable today in the electronics industry. To meet this demand,circuit
designs that employ coplanar structure,either for both single-end and
.. read more
Non-Classical Conductor Losses due to Copper Foil Roughness and Treatment
In high speed digital interconnects; signal attenuation is a result of both dielectric losses and conductor losses. Previous
works have showed in detail,the characterization and modeling effort
.. read more
High Power LED and Thermal Management
A high-power-SMD-LED (HL-LED) outline 3,3 x 2,9 mm² was developed,with chip-size up to 1 mm² and power dissipation
up to 1.500 mW (400 mA for UV-InGaN) in a corresponding thermal ambient. The t
.. read more
Advanced Filled Via Plating Methodology
This paper describes Advanced Filled Via Plating Methodology for stacked via technology. In this paper,via bottom crevice,
via bottom land etching and electroless copper plating coverage is foc
.. read more
Optimised Vertical Process for Microvia Filling and Through Hole Metallization Under Production-like Conditions
This article summarises how a copper metallization process for simultaneous via filling and through hole plating was
developed on a laboratory scale and the challenges encountered by scale-up t
.. read more
FVSS (Free Via Stacked up Structure)
The miniaturization of mobile electronic devices continues,market trends toward lighter and thinner printed circuit boards (PWB) have been accelerating. At the same time,the demand for increase
.. read more
Design for Manufacture – Ceramic Thick-Film Embedded Capacitors
Embedding discrete capacitors right into printed circuit boards (PWB),although not new,is part of a pivotal technology for
the PWB industry. For example,the ability to locate decoupling capacit
.. read more
Electrical Behavior of Thin Film Embedded Decoupling Capacitor in Printed Circuit Boards
In this study,we developed the thin film embedded decoupling capacitors and experimentally investigated its electrical
behavior in terms of power-ground impedance and simultaneous switching noi
.. read more
Materials for Capacitor Embedding in PWBs
We have developed a new resin-coated-foil (RCF) material named MCF-HD-45 to be embedded in PWBs to constitute
capacitors. The material is composed of a thermosetting resin and a high dielectric
.. read more
Removal of Palladium Residue in Semi-Additive Process for Enhanced Reliability in
In order to satisfy the ever-increasing demand for smaller and lighter electronic devices,a drastic miniaturization is making
rapid progresses for even circuit features on printed wiring boards
.. read more
Wiring Process by Electrophotography and Electroless Plating
For the purpose of mask-less manufacturing for Printed Circuit Board (PCB),a new process using electrophotography
technology,principle of copy machines,has been proposed and evaluated. Wiring p
.. read more
Oxidation and Topography of Powder in Pb-free Solder Paste
There are compelling reasons to study the relationship between oxidation and the topography of solder powder; these
include the following:
?? Customer requirements to reflow SAC-based (SnAgCu)
.. read more
The Effect of Ni on the Microstructure and Behaviour of the Sn-Cu Eutectic Lead-free Solder
While the Ni-stabilized Sn-0.7Cu alloy is now well established as a viable lead-free solder in large scale commercial printed
circuit board assembly the effect of Ni is not yet fully understood
.. read more
Lead Free Flip Chip and Chip Scale Package Inspection: New Challenges Will Require New Inspection Technologies
Lead free implementation will present new challenges for PCB manufacturers from a design,soldering process,and QC
standpoint. The higher reflow process temperatures will cause greater thermal s
.. read more
OEE,the New Gauge on the Dashboard for the PCB Assembly Industry
OEE (Overall Equipment Effectiveness) is commonly used in a wide range of businesses when it comes to measuring and
monitoring manufacturing performance. Even though OEE has been applied in var
.. read more
An Open Standards Based Approach to the Exchange of Data in an Automated Electronics Assembly Operation
A tier one supplier to the automotive industry has determined that a key to staying competitive in the electronics
manufacturing industry is to adopt open standards for the exchange of data. Sp
.. read more
Optimizing Production Cost with Electronic Manufacturing Simulation
Factory simulation has been used extensively to optimize and reduce costs across many manufacturing disciplines.
Unfortunately,general purpose factory simulators do not effectively model the sp
.. read more
Filling Pastes in PCB Production – Fields of Application,Possibilities and Limitations
In the past the use of filling pastes in PCB production was largely limited to via hole fillers. These materials with a solids
content of 100% are still successfully employed today to close via
.. read more