Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Business Models for Success - How to survive in the European PCB Market
The number of PCB manufacturers in Europe declined from 700 in the nineties to 400 early this decade and is forecasted to shrink to the range of 100 by 2010. A share of these companies will not
.. read more
Investigations on Optical Coupler by Embedded Micro-Mirrors on Optical Wiring Boards
In order to cope with a rapid increase in information processing speed,additional technical developments of an
optical-electrical composite board are required. Generally speaking,it is more dif
.. read more
Printed Circuit Board Architecture for the Use of Optical Interconnection of Components
The concept revealed is a simple architecture for an optical printed circuit board,which permits manufacturing with the
materials normally used in printed circuit board fabrication. This concep
.. read more
Development of Cleanliness Specification for Single - Mode Connectors
This paper summarizes research performed by the NEMI (National Electronics Manufacturing Initiative) Fiber Optic Signal
Performance Project team. The project focused on the development of a cle
.. read more
NEMI Cost Analysis: Optical Versus Copper Backplanes
The 2002 International Electronics Manufacturing Initiative (iNEMI) Optoelectronics roadmap anticipated a cross-over in
cost-performance whereby a system using optical transmission of high spee
.. read more
Space Charge Measurement and Observation of Copper Ionic Migration in Insulation Layer by Pulsed Electroacoustic Method
Metal-base printed circuit boards (PCBs),multilayer PCBs and embedded PCBs are constructed with a thin insulation layer.
In these PCBs,particularly those used for Power Electronics,the insulati
.. read more
Test and Inspection as Part of the Lead-Free Manufacturing Process
The paper will address issues that will impact defect levels and defect spectrum during the transition to lead-free
manufacturing. Since there are exemptions of which product types are mandated
.. read more
Development of Standard Models for EMC Simulation
In this report,the group activity of developing and proposing standard EMC models for numerical EMC simulation is presented. Our group has developed some basic and standard EMC models which con
.. read more
Vibration Fatigue Evaluation on Solder Joints of Under-Filled BGA
A previously developed ball grid array (BGA) solder joint vibration fatigue life prediction model,which was experimentally
validated by Test Vehicle One (TV1) test data for the BGAs with and wi
.. read more
Development of High Density Wiring Technology and Interconnect Technology with Silicon Through-Hole
We have developed the copper high density wiring formation technology with Cu/photosensitive Benzocyclobutene (BCB) as
a dielectric material,and interconnect technology with Silicon through-hol
.. read more
Insulation Material for Next Generation Packaging Substrates
With the progress of miniaturizing electronic equipment with higher performance,packaging substrates for semiconductor
devices are required to cope with finer patterning and higher wiring densi
.. read more
Micro Bump Array Constructions on the Organic Substrates for the Non-Permanent Terminations
A series of electrical plating processes to build various kinds of micro bump arrays on the organic substrates has been developed for non-permanent connections. Copper bump arrays with nickel/h
.. read more
An Issue in Time to Delamination (T260) Testing for PCBs
It has been reported by several laboratories that the time to delamination or decomposition of a printed circuit board specimen
at 260°C decreases with the specimen thickness. A temperature gra
.. read more
Flexural Fatigue Life Evaluation for Flexible Printed Circuit Boards
We report test results of bending characteristics of flexible printed circuit board,which contributes to the development of
higher density and more sophisticated function of mobile devices and
.. read more
Interconnection Reliability of HDI Printed Wiring Boards
It is effective to use the stack-via-holes method (via-on-via structure),which stacks micro via-holes (MVH),in the
development of higher density circuits on build-up printed wiring boards. When
.. read more
New Product Introduction Process Integration
The world market is changing for the OEM,CEM,and electronic manufacturers. This changing market dictates that as a
global industry more focus is placed on reducing the time to market for “New P
.. read more
Behind Growth,New Chances and Challenges in China Printed Circuit Industry
After the world electronic circuit industry finally turned out from the unprecedented recession,the business management of
today’s printed circuit industry may possibly have a chance to take a
.. read more
Bridge Detection in the Solder Paste Print Process
This paper describes part of a research effort currently under way in the field of print defect detection. The techniques
described have proven to be robust and particularly well suited for det
.. read more
Application of Thermography and Holography to Thermal Stress Evaluation of Printed Circuit Board
The comparison of the thermal pattern and the deformation pattern both are obtained on the surface of Printed Circuit Board
(PCB) was done to understand how both patterns correspond to each oth
.. read more
Development of Ultrasonic Flip Chip Bonding for Flexible Printed Circuit
Small form factor and high density of printed circuit boards (PCB) have been already realized by flip chip (FC) bonding
technology. However,the requirement for finer pitch PCB is still increasi
.. read more
The Integration of Third-Party Boundary-Scan Products into Customer Preferred Test Platforms has Become and Attractive Cost Effective Test Solution
In today’s complex manufacturing test environments,it is becoming increasingly difficult to detect and diagnose structural
faults within highly complex multi-layer PCB designs that offer extrem
.. read more
High-Bandwidth Coaxial PWB Transmission Line Probe
The design and evaluation of a wide bandwidth (3 dB attenuation bandwidth > 20 GHz),50 S,coaxial probe for the
electrical characterization of printed wiring board (PWB) transmission lines is de
.. read more
Applying a New In-Circuit Probing Technique for High-Speed/High Density Printed Circuit Boards to a Real-Life Product
Design for test rules (DFT) for in circuit test (ICT) test pads are well known and have served the industry well for nearly two
decades. However,increasing PCB densities continually put pressur
.. read more
Real Life Applications of Nanotechnology in Electronics
Nanotechnology is receiving a lot of attention from companies,universities and governments. The US $3.8million National
Nanotechnology Initiative is matched by initiatives in Europe and Asia. B
.. read more
Polymer-Ceramic Nanocomposites Based on New Concepts for Embedded Capacitor
Polymer-ceramic nanocomposites based on new concepts were developed for embedded capacitor applications. The dielectric
constant was above 80 at 1 MHz and the specific capacitance was successfu
.. read more
Enabling Ultra-Fine Pitch Packages: Soldermask Patterning using Laser Ablation
The trend towards tighter pitch,smaller features,and shrinking pad sizes have put a strain on the standard photolithographic
processes for soldermask patterning on substrate packaging and rigid
.. read more
Loss Tangent and Dielectric Constant of Solder Mask Measured with Split-Post Dielectric Resonators
As PCB computing bus frequencies climb above 1GHz,measurement of the high-frequency properties of PCB materials
becomes critical for design modeling. Understanding these properties and their de
.. read more
The Executive Dashboard: Fact or Fiction
Information Technology has come a long way from the humble payroll accounting system to integrated suite of business
applications,ostensibly to assist corporations to manage their businesses mo
.. read more
Business Cycles in the Electronic Equipment Food Chain - Growth Comparisons and Forecasts for Process Consumables & Equipment,Passive Components,Semiconductors and...
Fluctuating demand for electronic equipment has led to repetitive “boom and bust” business cycles throughout the electronics
“food chain.” Double ordering,inventory building and component outag
.. read more
Reference Designs Leading PWB Fabricators to Future Technology
New Chip Packages for advanced electronics are striving for higher density of the printed wiring boards. However,in the
supply chain,the PWB fabricator is often the last link that will learn wh
.. read more
Business Models for Success - How to survive in the European PCB Market
The number of PCB manufacturers in Europe declined from 700 in the nineties to 400 early this decade and is forecasted to shrink to the range of 100 by 2010. A share of these companies will not
.. read more
Investigations on Optical Coupler by Embedded Micro-Mirrors on Optical Wiring Boards
In order to cope with a rapid increase in information processing speed,additional technical developments of an
optical-electrical composite board are required. Generally speaking,it is more dif
.. read more
Printed Circuit Board Architecture for the Use of Optical Interconnection of Components
The concept revealed is a simple architecture for an optical printed circuit board,which permits manufacturing with the
materials normally used in printed circuit board fabrication. This concep
.. read more
Development of Cleanliness Specification for Single - Mode Connectors
This paper summarizes research performed by the NEMI (National Electronics Manufacturing Initiative) Fiber Optic Signal
Performance Project team. The project focused on the development of a cle
.. read more
NEMI Cost Analysis: Optical Versus Copper Backplanes
The 2002 International Electronics Manufacturing Initiative (iNEMI) Optoelectronics roadmap anticipated a cross-over in
cost-performance whereby a system using optical transmission of high spee
.. read more
Space Charge Measurement and Observation of Copper Ionic Migration in Insulation Layer by Pulsed Electroacoustic Method
Metal-base printed circuit boards (PCBs),multilayer PCBs and embedded PCBs are constructed with a thin insulation layer.
In these PCBs,particularly those used for Power Electronics,the insulati
.. read more
Test and Inspection as Part of the Lead-Free Manufacturing Process
The paper will address issues that will impact defect levels and defect spectrum during the transition to lead-free
manufacturing. Since there are exemptions of which product types are mandated
.. read more
Development of Standard Models for EMC Simulation
In this report,the group activity of developing and proposing standard EMC models for numerical EMC simulation is presented. Our group has developed some basic and standard EMC models which con
.. read more
Vibration Fatigue Evaluation on Solder Joints of Under-Filled BGA
A previously developed ball grid array (BGA) solder joint vibration fatigue life prediction model,which was experimentally
validated by Test Vehicle One (TV1) test data for the BGAs with and wi
.. read more
Development of High Density Wiring Technology and Interconnect Technology with Silicon Through-Hole
We have developed the copper high density wiring formation technology with Cu/photosensitive Benzocyclobutene (BCB) as
a dielectric material,and interconnect technology with Silicon through-hol
.. read more
Insulation Material for Next Generation Packaging Substrates
With the progress of miniaturizing electronic equipment with higher performance,packaging substrates for semiconductor
devices are required to cope with finer patterning and higher wiring densi
.. read more
Micro Bump Array Constructions on the Organic Substrates for the Non-Permanent Terminations
A series of electrical plating processes to build various kinds of micro bump arrays on the organic substrates has been developed for non-permanent connections. Copper bump arrays with nickel/h
.. read more
An Issue in Time to Delamination (T260) Testing for PCBs
It has been reported by several laboratories that the time to delamination or decomposition of a printed circuit board specimen
at 260°C decreases with the specimen thickness. A temperature gra
.. read more
Flexural Fatigue Life Evaluation for Flexible Printed Circuit Boards
We report test results of bending characteristics of flexible printed circuit board,which contributes to the development of
higher density and more sophisticated function of mobile devices and
.. read more
Interconnection Reliability of HDI Printed Wiring Boards
It is effective to use the stack-via-holes method (via-on-via structure),which stacks micro via-holes (MVH),in the
development of higher density circuits on build-up printed wiring boards. When
.. read more
New Product Introduction Process Integration
The world market is changing for the OEM,CEM,and electronic manufacturers. This changing market dictates that as a
global industry more focus is placed on reducing the time to market for “New P
.. read more
Behind Growth,New Chances and Challenges in China Printed Circuit Industry
After the world electronic circuit industry finally turned out from the unprecedented recession,the business management of
today’s printed circuit industry may possibly have a chance to take a
.. read more
Bridge Detection in the Solder Paste Print Process
This paper describes part of a research effort currently under way in the field of print defect detection. The techniques
described have proven to be robust and particularly well suited for det
.. read more
Application of Thermography and Holography to Thermal Stress Evaluation of Printed Circuit Board
The comparison of the thermal pattern and the deformation pattern both are obtained on the surface of Printed Circuit Board
(PCB) was done to understand how both patterns correspond to each oth
.. read more
Development of Ultrasonic Flip Chip Bonding for Flexible Printed Circuit
Small form factor and high density of printed circuit boards (PCB) have been already realized by flip chip (FC) bonding
technology. However,the requirement for finer pitch PCB is still increasi
.. read more
The Integration of Third-Party Boundary-Scan Products into Customer Preferred Test Platforms has Become and Attractive Cost Effective Test Solution
In today’s complex manufacturing test environments,it is becoming increasingly difficult to detect and diagnose structural
faults within highly complex multi-layer PCB designs that offer extrem
.. read more
High-Bandwidth Coaxial PWB Transmission Line Probe
The design and evaluation of a wide bandwidth (3 dB attenuation bandwidth > 20 GHz),50 S,coaxial probe for the
electrical characterization of printed wiring board (PWB) transmission lines is de
.. read more
Applying a New In-Circuit Probing Technique for High-Speed/High Density Printed Circuit Boards to a Real-Life Product
Design for test rules (DFT) for in circuit test (ICT) test pads are well known and have served the industry well for nearly two
decades. However,increasing PCB densities continually put pressur
.. read more
Real Life Applications of Nanotechnology in Electronics
Nanotechnology is receiving a lot of attention from companies,universities and governments. The US $3.8million National
Nanotechnology Initiative is matched by initiatives in Europe and Asia. B
.. read more
Polymer-Ceramic Nanocomposites Based on New Concepts for Embedded Capacitor
Polymer-ceramic nanocomposites based on new concepts were developed for embedded capacitor applications. The dielectric
constant was above 80 at 1 MHz and the specific capacitance was successfu
.. read more
Enabling Ultra-Fine Pitch Packages: Soldermask Patterning using Laser Ablation
The trend towards tighter pitch,smaller features,and shrinking pad sizes have put a strain on the standard photolithographic
processes for soldermask patterning on substrate packaging and rigid
.. read more
Loss Tangent and Dielectric Constant of Solder Mask Measured with Split-Post Dielectric Resonators
As PCB computing bus frequencies climb above 1GHz,measurement of the high-frequency properties of PCB materials
becomes critical for design modeling. Understanding these properties and their de
.. read more
The Executive Dashboard: Fact or Fiction
Information Technology has come a long way from the humble payroll accounting system to integrated suite of business
applications,ostensibly to assist corporations to manage their businesses mo
.. read more
Business Cycles in the Electronic Equipment Food Chain - Growth Comparisons and Forecasts for Process Consumables & Equipment,Passive Components,Semiconductors and...
Fluctuating demand for electronic equipment has led to repetitive “boom and bust” business cycles throughout the electronics
“food chain.” Double ordering,inventory building and component outag
.. read more
Reference Designs Leading PWB Fabricators to Future Technology
New Chip Packages for advanced electronics are striving for higher density of the printed wiring boards. However,in the
supply chain,the PWB fabricator is often the last link that will learn wh
.. read more