Knowledge Hub

Your Gateway to Technical Knowledge Exchange for the Global Electronics Community

Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.

Solving the Metric Pitch BGA & Micro BGA Dilemma

Solving "Fine Pitch" Metric Pitch BGA routing is becoming increasingly challenging for PCB design layout. There are solutions but they are very hard to find. This presentation will cover common .. read more

Case Study on the Validation of SAC305 and SnCu Based Solders in SMT,Wave and Hand-soldering at the Contract Assembler Level

insure the same quality a customer has been accustomed to with a Sn63Pb37 process is achieved. The reflow,wave soldering and hand assembly processes must all be optimized carefully to insure go .. read more

Impact Evaluation of Solder Transfer Peak Temperatures on C4NP Lead Free Solder Bumps

C4NP (Controlled Collapsed Chip Connection-New Process) is a novel solder bumping technology developed by IBM and commercialized by Suss MicroTec. C4NP is a solder transfer technology where mol .. read more

Productivity and Cost Efficiency of Lead-Free Selective Soldering

With the advent of widespread lead-free soldering,the issue of copper erosion has surfaced as a major quality concern when soldering RoHS compliant through-hole devices. Many contract electroni .. read more

0.3mm W.L CSP Assembly

Due to the ever-aggressive miniaturization program that is rolling through the electronics industry,the next component that is fast approaching this horizon is the 0.3mm CSP • This paper will r .. read more

Mechanical Vibrations: Its Effect on Assembly Equipment and Methods of Characterization

As electronic packages keep shrinking in size,high-speed high-accuracy package assembly equipment are becoming more sensitive to mechanical vibrations. Alignment,positional and pick & place acc .. read more

Thermal Expansion of Silicones in Electronic Reliability

CTE mismatches during temperature cycling can cause significant movement of components and materials relative to one another,which in turn stresses solder joints and wirebonds. Silicones are of .. read more

Low Dielectric Fabrics

While glass fibers are commonly used to reinforce circuit board substrates,they have a high dielectric constant and loss. Cyclic olefin copolymer fibers have a lower dielectric constant and los .. read more

Low Temperature Characteristics of Silicones

Silicones are often used to protect electronic applications designed for cold environments. The low temperature flexibility of silicones is well recognized,but not as well understood. While the .. read more

Resin Options for Lead-Free Printed Circuit Boards

The regulation requiring lead-free solders for printed circuit boards (PCBs) has presented a number of challenges to our industry at virtually every stage of the process. For the brominated epo .. read more

More Robust Base Materials for Electronic Assemblies

The proposed revision of IPC-4101 - Specification for Base Materials for Rigid and Multilayer Printed Boards contains new slash sheets describing FR-4 base materials compatible with lead free a .. read more

A Comparison of Materials Testing Methods

Recent global environmental regulations affecting consumer electronics and electrical equipment,such as the European Union’s RoHS Directive,China ‘RoHS’ and others,have driven electronics manuf .. read more

OEM Guideline to Selecting PCB Suppliers

Many large Original Equipment Manufacturers (OEMs) have a detailed procedure and a significant capital investment in place for the selection of printed circuit board suppliers. This approval pr .. read more

Utilization of Buried Capacitance™:A Case Study

Embedding capacitive layers inside the Printed Circuit Board (PCB) have demonstrated the ability to reduce the number of Surface Mount Technology (SMT) chip decoupling capacitors on the PCB sur .. read more