Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Solving the Metric Pitch BGA & Micro BGA Dilemma
Solving "Fine Pitch" Metric Pitch BGA routing is becoming increasingly challenging for PCB design layout. There are solutions but they are very hard to find. This presentation will cover common
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Case Study on the Validation of SAC305 and SnCu Based Solders in SMT,Wave and Hand-soldering at the Contract Assembler Level
insure the same quality a customer has been accustomed to with a Sn63Pb37 process is achieved. The reflow,wave soldering
and hand assembly processes must all be optimized carefully to insure go
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Impact Evaluation of Solder Transfer Peak Temperatures on C4NP Lead Free Solder Bumps
C4NP (Controlled Collapsed Chip Connection-New Process) is a novel solder bumping technology developed by IBM and
commercialized by Suss MicroTec. C4NP is a solder transfer technology where mol
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Productivity and Cost Efficiency of Lead-Free Selective Soldering
With the advent of widespread lead-free soldering,the issue of copper erosion has surfaced as a major quality concern when
soldering RoHS compliant through-hole devices. Many contract electroni
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0.3mm W.L CSP Assembly
Due to the ever-aggressive
miniaturization program that is rolling
through the electronics industry,the
next component that is fast approaching
this horizon is the 0.3mm CSP
• This paper will r
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Mechanical Vibrations: Its Effect on Assembly Equipment and Methods of Characterization
As electronic packages keep shrinking in size,high-speed high-accuracy package assembly equipment are becoming more
sensitive to mechanical vibrations. Alignment,positional and pick & place acc
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Thermal Expansion of Silicones in Electronic Reliability
CTE mismatches during temperature cycling can cause significant movement of components and materials relative to one
another,which in turn stresses solder joints and wirebonds. Silicones are of
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Low Dielectric Fabrics
While glass fibers are commonly used to reinforce circuit board substrates,they have a high dielectric constant and loss.
Cyclic olefin copolymer fibers have a lower dielectric constant and los
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Low Temperature Characteristics of Silicones
Silicones are often used to protect electronic applications designed for cold environments. The low temperature flexibility
of silicones is well recognized,but not as well understood. While the
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Resin Options for Lead-Free Printed Circuit Boards
The regulation requiring lead-free solders for printed circuit boards (PCBs) has presented a number of challenges to our industry at virtually every stage of the process. For the brominated epo
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More Robust Base Materials for Electronic Assemblies
The proposed revision of IPC-4101 - Specification for Base Materials for Rigid and Multilayer Printed Boards contains new
slash sheets describing FR-4 base materials compatible with lead free a
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A Comparison of Materials Testing Methods
Recent global environmental regulations affecting consumer electronics and electrical equipment,such as the European Union’s RoHS Directive,China ‘RoHS’ and others,have driven electronics manuf
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OEM Guideline to Selecting PCB Suppliers
Many large Original Equipment Manufacturers (OEMs) have a detailed procedure and a significant capital investment in
place for the selection of printed circuit board suppliers. This approval pr
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Utilization of Buried Capacitance™:A Case Study
Embedding capacitive layers inside the Printed Circuit Board (PCB) have demonstrated the ability to reduce the number of
Surface Mount Technology (SMT) chip decoupling capacitors on the PCB sur
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