Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Round-Robin,Predictor Models for T-Cycle life
Solder joints tend to crack after extended thermal cycling,if the component and the circuit board are CTE mis-matched. Predicting t-cycle lifetime is a crucial first step in optimizing product
.. read more
Effect of Design Variables on the Reliability of Lead Free Area Array Connectors
As the use of area array connectors has become more widespread in electronic assemblies,the need to evaluate their reliability has increased. There is,however,limited information on how best to
.. read more
Failure Analysis of Eutectic and Pb-Free Solder Alloys after High Stress Exposure
Failure analysis was performed on fourteen thermally cycled or vibration tested PDIP components from the JCAA-JG-PP Lead-Free Joint Test Project. The components differed in component finish,sol
.. read more
Image Rotation to Mitigate the Fiberweave Effect its Impact on PCB Manufacturing
Typical PCB materials have inherent properties (the “Fiberweave Effect”) which can be detrimental to the Signal Integrity of the physical link. This presentation describes the effect and a mean
.. read more
Manufacture and Performance of a Z-interconnect HDI Circuit Card
More and more circuit board designs require signals paths that can handle multi-gigahertz frequencies. The challenges for organic circuit boards,in meeting these electrical requirements,include
.. read more
Towards a PCB Production Floor Metric for Go/No Go Testing of Lossy High Speed Transmission Lines
As designers strive to extract ever more performance from high speed transmission lines on FR4 substrates and their high speed derivatives,a requirement has arisen for a practical and robust “G
.. read more
A Study of Alternative Lead Free Wave Alloys: From Process Yield to Reliability
Recent industry trends have focused around alternatives for the commonly used SAC305 or SAC405 alloys for wave soldering and solder fountain rework processes. Industry consortia are currently f
.. read more
Comparison of Copper Erosion at Plated Through-Hole Knees in Motherboards Using SAC305 and an SnCuNiGe Alternative Alloy for Wave Soldering and Mini-pot Rework
Copper erosion from plated through holes (PTH) barrels in printed circuit boards (PCB) during both wave soldering and mini-pot rework can increase the risk of PTH reliability failures during fi
.. read more
Effect of Contact Time on Lead-Free Wave Soldering
The increasing use of lead-free solder has introduced a new set of process parameters when setting up wave solder equipment for effective soldering. Determining the proper flow characteristics
.. read more
New Reinforcement Material can Solve Heat and Co-Efficient of Thermal Expansion Challenges of the Printed Circuit Board and IC Substrate
Printed Circuit Boards (PCB) and IC Substrates are the essential building blocks of electronics. As the technology moves rapidly into the future,the electronics industry faces issues with hot s
.. read more
Thermoplastic Substrates: Performance of Materials to Meet WEEE
Following the implementation of WEEE legislation,there will be an increasing interest in adopting more sustainable manufacturing processes and materials as targets are increased,and must be ach
.. read more
Printable Nanocomposites for Electronic Packaging
Printing technologies provide a simple solution to build electronic circuits on low cost flexible substrates. Nanocomposites will play important role for developing advanced printable technolog
.. read more
Ionic Analysis of Common Beverages Spilled on Electronics
Electronics,especially mobile electronic items,are subjected to unintentional abuse by having various beverages spilled onto or into them. Ion Chromatography and emission spectroscopy were used
.. read more
The Path to Robust Electronics - Preventing Corrosion of PCB Assemblies
All things corrode,and the rate of corrosion among electronics devices is accelerating. Electronic devices are being used in more places than ever before. They are finding more uses,they're mor
.. read more
Contamination of Hydrocarbon Ceramic Dielectric
Various forms of contamination on the surface of hydrocarbon ceramic dielectric PWBs have been observed following component population. Although contamination is occasionally observed on PWBs f
.. read more
Printed Circuit Board Reliability and Integrity Characterization Using MAJIC
The recent need to develop lead-free electrical and electronic products has resulted in an increased demand to characterize
solder joint integrity. Many standards exist to evaluate the long ter
.. read more
Atmospheric Plasma – A New Surface Treatment Technology for Cleaning PCBs
Low-pressure plasmas have been used for many years to surface clean and functionalize substrates prior to downstream
converting operations; therefore,the benefits of plasma treatment are well r
.. read more
Engineered Cleaning Fluid and Mechanical Impingement Optimization Innovations
The complexity of the electronic assembly manufacturing environment increases with the miniaturization,low standoff components,and solder alloy advancements. Past history suggests that the clea
.. read more
Cleaning a No-Clean Flux on Contaminated Hardware as a Recovery Plan
There is a growing problem in the industry with no-clean flux technology and the after effects it can have on reliability. If the
fluxes are not fully complexed (not fully heat activated) there
.. read more
Defluxing of Eutectic and Lead-Free PCBs in a Single Cleaning Application
As the entire electronic manufacturing industry braced for the July 1,2006 deadline,it has been reevaluating the entire production process. Likewise,the precision cleaning industry must also
.. read more