Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Material Declarations: Risky Business - Perspectives from your Supply Base
Component Material Declarations are a key building block for all OEMs (Original Equipment Manufacturer) and CMs (Contract Manufacturer) preparing a sound due diligence case for RoHS Compliance.
.. read more
Implementing a Successful Compliance Program for the EU's RoHS and WEEE Directives: Disclosure Levels,Roadblocks and Lessoned Learned
As the electronics industry prepares for the elimination of the six chemical substances banned by the European Union’s Restriction of the Use of Certain Hazardous Substances in Electrical and E
.. read more
Procedures for the Determination of Levels of Six Regulated Substances (Lead,Mercury,Cadmium,Hexavalent Chromium,Polybrominated Biphenyls,Polybrominated Biphenyl Ether) in Electrotechnical Products
The widespread use of electrotechnical products has drawn increased attention to their impact on the environment. In many countries all over the world this has resulted in the adaptation of reg
.. read more
Building an Effective Hazardous Materials Compliance System: Managing RoHS,WEEE and Other Regulations
In response to growing concerns about the effects of hazardous materials in the waste stream on the environment,the European Union (EU) passed a directive in 2002 entitled the Restriction of th
.. read more
On Solder Joints Reliability and Component Damage of Hand Soldered Lead-Free PTH and SMD Components
Due to the European legislations (RoHS and WEEE) consumer products need to be soldered with lead-free solders from the first of July 2006. Since several properties (physical,chemical,mechanical
.. read more
A Study of Implementing Lead free Soldering Process with Organic Solderability Preservative Coating In a High Volume Production Environment
As the global electronic industry marches toward the brave new world of environmentally conscious electronic manufacturing,lead free soldering has made some fundamental shifts in the processing
.. read more
Dynamics in Lead-Free Wave Soldering
The following report is fundamentally focused on how three popular lead-free alloys react in a wave solder application. The alloys were SAC305,SAC405 and a proprietary,low silver SAC alloy. In
.. read more
Microvia Reliability Concerns in the Lead Free Assembly Environment
Traditionally microvias have been considered to be the most reliable interconnect structure within a printed wiring board (PWB). With the advent of lead free assembly the vulnerability of high
.. read more
Overview of Embedded Technology
Last spring at EXPO,embedded passives came into its own by being escalated from a sub-committee with 4 task groups to a general committee with 4 sub-committees. Dave McGregor of Dupont now chai
.. read more
High Dielectric Constant Thin-Films for Embedded Passive Components
Pure and doped barium titanate thin films have been prepared by chemical solution deposition on 18 µm thick,industry standard copper foils. Films are approximately 0.6 µm thickness and exhibit
.. read more
A Simple and Innovative Method for the Manufacture of Discrete Capacitors within Multilayered PCB’s
This work initially started with some research into ink jet technology materials for legend printing. Our company in Hong Kong was working at the time with a Japanese company with the end goal
.. read more
A Low Cost Option to Laser Trimming of Resistors
This paper is the second concerning the use of existing electrical test equipment being programmed to first measure the values of plated additive resistors manufactured on circuit board inner l
.. read more
Simulation of Resonance Reduction in PCBs Utilizing Embedded Capacitance
The number of applications using Embedded capacitor technology on Printed Wiring Boards (PWBs) is increasing. One of the increasing applications using embedded capacitor is high-speed digital a
.. read more
Lessons Learned: Case Studies of Embedded Passives
Over the past six years Motorola has shipped over 47 million phones incorporating Embedded Passives (EP) technology. The EP modules shipped in phones have included small modules such as voltage
.. read more
Improved Reliability of Embedded Passives for Lead-Free Assembly
Embedded passive components are resistors,capacitors and inductors buried within a multilayer PCB. Embedded components pass standard reliability test methods,however,the higher temperatures req
.. read more
Characterization of the Thermal Stability of Electrical Laminates Suitable for Lead-Free Soldering
Lead-free soldering is expected to become the new standard in the future. Different legislations or draft directives target the restriction or the ban of the use of lead in the world. As an exa
.. read more
Benefits and Reliability of a Thin Dielectric in a Power Supply Printed Circuit Board
This paper presents the qualification of a new,very thin,printed circuit board (“PCB”) dielectric substrate (“core”) to meet Teradyne’s performance and reliability design goals for a power supp
.. read more
Low Cost Energy Based TDR Loss Method for PWB Manufacturers
While silicon density doubles approximately every 18 months,following Moore’s law,PWB electrical technology advances much more slowly,Up until now trace impedance has been a sufficient high spe
.. read more
Surface Tarnish and Creeping Corrosion on Pb-Free Circuit Board Surface Finishes
The deployment of non-Lead (Pb) surface finishes is well underway throughout the electronics industry. Printed circuit boards,which for many years had relied on Hot Air Solder Level (HASL) fini
.. read more
Further Analysis of the Alternate Finishes Task Group Report on Time,Temperature and Humidity Stress of Final Board Finish Solderability
The IPC study mentioned in the title looked at the effects of time,temperature and humidity on the solderability of true bare copper,immersion silver,immersion tin,organic soldering preservativ
.. read more
3-Dimensional Partitioning of Printed Circuit Design for High Speed Interconnections
When using standard approaches to PCB design and manufacture,there are a number of different elements that can impact
signal integrity at high data rates including: inconsistencies in dielectri
.. read more
Business Model A Concept for the Western PWB Hemisphere?
The dramatic economic downturn of the PWB industry starting in the forth quarter of 2000,which resulted in a reduction of 1/3 of the demand and corresponding supply chain within one year,has ch
.. read more
Material Declarations: Risky Business - Perspectives from your Supply Base
Component Material Declarations are a key building block for all OEMs (Original Equipment Manufacturer) and CMs (Contract Manufacturer) preparing a sound due diligence case for RoHS Compliance.
.. read more
Implementing a Successful Compliance Program for the EU's RoHS and WEEE Directives: Disclosure Levels,Roadblocks and Lessoned Learned
As the electronics industry prepares for the elimination of the six chemical substances banned by the European Union’s Restriction of the Use of Certain Hazardous Substances in Electrical and E
.. read more
Procedures for the Determination of Levels of Six Regulated Substances (Lead,Mercury,Cadmium,Hexavalent Chromium,Polybrominated Biphenyls,Polybrominated Biphenyl Ether) in Electrotechnical Products
The widespread use of electrotechnical products has drawn increased attention to their impact on the environment. In many countries all over the world this has resulted in the adaptation of reg
.. read more
Building an Effective Hazardous Materials Compliance System: Managing RoHS,WEEE and Other Regulations
In response to growing concerns about the effects of hazardous materials in the waste stream on the environment,the European Union (EU) passed a directive in 2002 entitled the Restriction of th
.. read more
On Solder Joints Reliability and Component Damage of Hand Soldered Lead-Free PTH and SMD Components
Due to the European legislations (RoHS and WEEE) consumer products need to be soldered with lead-free solders from the first of July 2006. Since several properties (physical,chemical,mechanical
.. read more
A Study of Implementing Lead free Soldering Process with Organic Solderability Preservative Coating In a High Volume Production Environment
As the global electronic industry marches toward the brave new world of environmentally conscious electronic manufacturing,lead free soldering has made some fundamental shifts in the processing
.. read more
Dynamics in Lead-Free Wave Soldering
The following report is fundamentally focused on how three popular lead-free alloys react in a wave solder application. The alloys were SAC305,SAC405 and a proprietary,low silver SAC alloy. In
.. read more
Microvia Reliability Concerns in the Lead Free Assembly Environment
Traditionally microvias have been considered to be the most reliable interconnect structure within a printed wiring board (PWB). With the advent of lead free assembly the vulnerability of high
.. read more
Overview of Embedded Technology
Last spring at EXPO,embedded passives came into its own by being escalated from a sub-committee with 4 task groups to a general committee with 4 sub-committees. Dave McGregor of Dupont now chai
.. read more
High Dielectric Constant Thin-Films for Embedded Passive Components
Pure and doped barium titanate thin films have been prepared by chemical solution deposition on 18 µm thick,industry standard copper foils. Films are approximately 0.6 µm thickness and exhibit
.. read more
A Simple and Innovative Method for the Manufacture of Discrete Capacitors within Multilayered PCB’s
This work initially started with some research into ink jet technology materials for legend printing. Our company in Hong Kong was working at the time with a Japanese company with the end goal
.. read more
A Low Cost Option to Laser Trimming of Resistors
This paper is the second concerning the use of existing electrical test equipment being programmed to first measure the values of plated additive resistors manufactured on circuit board inner l
.. read more
Simulation of Resonance Reduction in PCBs Utilizing Embedded Capacitance
The number of applications using Embedded capacitor technology on Printed Wiring Boards (PWBs) is increasing. One of the increasing applications using embedded capacitor is high-speed digital a
.. read more
Lessons Learned: Case Studies of Embedded Passives
Over the past six years Motorola has shipped over 47 million phones incorporating Embedded Passives (EP) technology. The EP modules shipped in phones have included small modules such as voltage
.. read more
Improved Reliability of Embedded Passives for Lead-Free Assembly
Embedded passive components are resistors,capacitors and inductors buried within a multilayer PCB. Embedded components pass standard reliability test methods,however,the higher temperatures req
.. read more
Characterization of the Thermal Stability of Electrical Laminates Suitable for Lead-Free Soldering
Lead-free soldering is expected to become the new standard in the future. Different legislations or draft directives target the restriction or the ban of the use of lead in the world. As an exa
.. read more
Benefits and Reliability of a Thin Dielectric in a Power Supply Printed Circuit Board
This paper presents the qualification of a new,very thin,printed circuit board (“PCB”) dielectric substrate (“core”) to meet Teradyne’s performance and reliability design goals for a power supp
.. read more
Low Cost Energy Based TDR Loss Method for PWB Manufacturers
While silicon density doubles approximately every 18 months,following Moore’s law,PWB electrical technology advances much more slowly,Up until now trace impedance has been a sufficient high spe
.. read more
Surface Tarnish and Creeping Corrosion on Pb-Free Circuit Board Surface Finishes
The deployment of non-Lead (Pb) surface finishes is well underway throughout the electronics industry. Printed circuit boards,which for many years had relied on Hot Air Solder Level (HASL) fini
.. read more
Further Analysis of the Alternate Finishes Task Group Report on Time,Temperature and Humidity Stress of Final Board Finish Solderability
The IPC study mentioned in the title looked at the effects of time,temperature and humidity on the solderability of true bare copper,immersion silver,immersion tin,organic soldering preservativ
.. read more
3-Dimensional Partitioning of Printed Circuit Design for High Speed Interconnections
When using standard approaches to PCB design and manufacture,there are a number of different elements that can impact
signal integrity at high data rates including: inconsistencies in dielectri
.. read more
Business Model A Concept for the Western PWB Hemisphere?
The dramatic economic downturn of the PWB industry starting in the forth quarter of 2000,which resulted in a reduction of 1/3 of the demand and corresponding supply chain within one year,has ch
.. read more