Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
A New AOI Programming and Inspection Paradigm Based On Recent Studies in Neuroscience Reduces the Need for Human Intervention and Improves Program Stability and Quality
The hidden cost of optical inspection systems is often in the programming time. In this paper we discuss a new AOI programming and inspection paradigm reduces the need for human intervention an
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Improving SMT Yield with AOI and AXI Test Results Analysis
As printed circuit board assembly (PCBA) becomes more complex,Automatic Optical Inspection (AOI) and Automatic Xray Inspection (AXI) systems are becoming more widely used in electronics manufac
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The Utilization of X-ray to Effectively Test Quad Flat No-Lead Packages
The Quad Flat No-Lead or QFN packages are increasing in their utilization in the printed circuit board market. This is being driven largely by the shrinking size both in profile and footprint,h
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BGA Breakout Challenges
The routing of large pin-count and dense BGAs has a significant impact on the cost of the PCB,primarily in terms of layer count and via technology. This paper is the result of considerable rese
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How to use Simulation Kits to Accelerate High-Speed,High-Density Design
With design requirements becoming more stringent as implementation of new technology standards evolve,designers are faced with the challenge of front-loading more effort in the design cycle tha
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LOWERING LAYERS w/HDI for RoHS ROBUSTNESS
A perplexing challenge for RoHS compliance is adapting large,complex and thick,high-layer count multilayers to lead-free assembly. These are typically dense,complex assemblies with large BGAs a
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X-Ray Fluorescence Equipment and Materials Characterization for RoHS Compliances
Environmental compliance is becoming a global effort in the electrical and electronics industry. The Directive on “Restriction of Hazardous Substances” (RoHS) in Europe,is forcing the electroni
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Understanding of XRF Technology and Clarification of its Application for RoHS
RoHS directives require screening and quantification of certain elements and compounds used in electronics components and parts.
X-ray Fluorescence (XRF) technology has emerged as an effective
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Use of EDXRF for RoHS Compliance Screening in PCBA Manufacturing
With the enactment of the European Union (EU) ROHS Directive 2002/95/EC (Ref.1),certain electrical and electronic products that are manufactured in or exported to the European Union have restri
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Humidity-Dependent Loss in PCB Substrates
Increasing operating frequency of IO busses for computing has highlighted the importance of transmission line loss. For FR4 PCB mother boards computing at speeds above 1 GHz this is dominated b
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Bifunctional Low Molecular Weight Polyphenylene Ether Resins for PWB Base Materials
A new bifunctional low molecular weight polyphenylene ether (OPE oligophenylene ether) was obtained by the oxidative coupling of 2,2’,3,3’,5,5’-hexamethyl-[1,1’-biphenyl]-4,4’-diol (HMBP hexame
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AFFORDABLE MICROWAVE CIRCUIT BOARD SUBSTRATE MATERIAL
While glass fibers are commonly used to reinforce circuit board substrates,they have a high dielectric constant and loss. Cyclic olefin copolymer fibers have a lower dielectric constant and los
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Effect of OSP Chemistry on the Hole Fill Performance During Pb-free Wave Soldering
This paper analyzes the differences in plated through hole fill performance between the regular OSP and Pb-free OSP PCB surface finish chemistries in a Pb-free wave solder process. The variable
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Describing Key Coating and Process Characteristics of a Pb-Free OSP Process
Organic Solderability Preservatives (OSP) continue to attract significant attention as circuit board final finishes. They have evolved from simple and thin benzotriazole coatings to thicker and
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Yet More Analysis from the Alternate Finishes Task Group Report on Time,Temperature and Humidity Stress of Final Board Finish Solderability
The data from the IPC Alternate Finishes Task Group Report “Time,Temperature and Humidity Stress for Final Finish Board Solderability” has been analyzed in a greater depth than in the actual re
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Microwave Characteristics and Applications of Liquid Crystal Polymer Flex
We present the electrical characterization of our Liquid Crystal Polymer (LCP) at microwave and millimeter frequencies and the applications of LCP to circuit components. We use several methodol
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Lead Free Processing and other Thermal Challenges for Flexible Printed Circuits
In this paper,factors that influence the ability for a flex circuit,especially a multilayer flex circuit,to survive the lead-free soldering and other thermal processes during the circuit fabric
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Stacked Array Packaging A Flex Based IC Packaging Solution for Single and 3D Multiple Die Applications
The challenge manufactures face when competing in the world marketplace is to offer a product that will meet all performance and functionality expectations without increasing product size or co
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Intellectual Property Management: Maximizing the Value of Your Copyright Trademark,Patent,and Trade Secret
Copyright,like all other forms of intellectual property,is based on negative rights. A copyright registrant may exclude others from reproducing a given copyrighted work,composing a derivative w
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Transitioning to Offshore Sourcing Challenges
Transitioning to offshore sourcing has become a seductive argument for cost reduction. Most managers agree that the impact has been beneficial to the consumer and the trading conglomerates. Thi
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The Whisker Growth Investigation of IC Packaging on the PC Board Assembly
The whisker concern has been greatly affecting lead free RoHS conversion confidence in the lead frame packages,particularly for high end product conversion. Although plenty of related study in
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The Effects of Tin Whisker Testing on Solder Connections
The RoHS legislation in Europe has far reaching consequences,which necessitates a change in lead coating on component leads. Although some suppliers are using a tin finish,there is a tendency f
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Effects of Adhesion Promotion Treatment On Electrical Signal Attenuation
Oxide alternatives,as well as traditional and reduced oxide chemistries,are coatings or “adhesion promoters” used to enhance the bond between imaged and etched inner layer copper surfaces and t
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Bending,Forming and Flexing Printed Circuits
In the printed circuit board industry there are generally two main types of circuit boards; there are rigid printed circuit boards and flexible printed circuit boards. There is a tremendous var
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Precision Coating Deposition Techniques for Conformal Coating Applications
Precise control of coating deposition is critical to the application of conformal coatings to selected areas of printed circuit board assemblies. The coating must be applied in a defined patter
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