Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
What to Consider when Designing a Universal Test Strategy Tool
Selecting an optimal test strategy is a complex task today. There are many test inspection and test methods available. The
most common choices to find manufacturing defects on printed circuit b
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Concurrent Testing: Increasing Test Coverage without Affecting Cycle Time
Volume electronic manufacturing environments are constantly seeking solutions to bottlenecks at end-of-line test.
Bottlenecks are being seen increasingly on high volume automotive,telecomm & co
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Predicting Plated Through Hole Life at Assembly and in the Field from Thermal Stress Data
Over the past ten years,two new test methods: Interconnect Stress Test [1] and Highly Accelerated Thermal Shock [2] have
been developed to perform thermal cycling testing and in particular,to m
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IMC Growth Study on Ni-P/Pd/Au Film and Ni-P/Au Film Using Sn/Ag/Cu Lead Free Solder
The surface finishes Ni-P/Pd/Au (hereafter referred to ENEPIG) and Ni-P/Au (hereafter referred to ENIG) were
prepared on ball grid array (BGA) circuit boards by electroless/immersion plating me
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Thermal Stress Testing & Impact of High Thermal Excursion Pre-Conditioning on Cycles to Fail
Today both Interconnect Stress Test (IST) and Highly Accelerated Thermal Shock (HATS) test methods are used to measure
plated through hole via reliability. Both of these test methods have prove
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Measles in Advanced Technology
Continuous measling,or unidirectional crazing,was observed in a multi-layer polyimide printed wiring board following
assembly operations. Damage to the PWB preferentially followed the warp dire
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Electrodeposited Nanocrystalline Copper for Printed Wiring Board Applications
Nanocrystalline and ultra-fine grain copper can potentially offer increased reliability and functionality of printed wiring
boards due to expected enhancements in strength and achievable wiring
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The Effect of Plating Cell Configuration on the Quality of Copper Deposit for Printed Circuit Boards
This paper addresses the effect of pulse plating of electronic interconnects for advanced electronic modules. This paper
builds on earlier work by correlating plating cell and tank design issue
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Assessing the Reliability of New Connector Designs
With the combination of increased product complexity,increased frequencies and ever decreasing component sizes and
pitches designers are faced with the dilemma on how design their products in t
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Going Beyond - ACHIEVING HIGH Accuracy Placement in a Volume Application
The constant drive by designers to create more functionally unique products has challenged the assembly community for
some time. As a result,many processes have been developed under the “Necess
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Impact of Lead Contamination on Reliability of Lead Free Alloys
Meeting the RoHS directive will require the transition from the historical tin-lead based system of materials to one that
does not contain lead. This is of course is not straight forward as it
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New Lead Free Solder Composition and Physical Properties of Printed Wiring Board Laminate Material To Suppress Lift-Off and Improve Reliability
Lift-off (fillet-lifting) and land-lifting phenomena,which occur in wave soldering with Sn-Ag-Cu (SAC) solders,depend
on the physical properties of the solder and the laminate material used. A
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Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the
solder joint. The degree of wetting,the microstructure (in particular t
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In-Circuit Test Probe Contact on Lead Free Printed Circuit Board Assemblies
The in-circuit test (ICT) of printed circuit boards (PCBs) assembled with Lead Free solder was anticipated to be problematic
by industry test engineers,due to contact failures associated with t
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Process Qualification Using the IPC-B-52 Standard Test Assembly
Many professionals in the electronics manufacturing industry have,or eventually will,face the issue of determining
whether the materials of construction for printed wiring assemblies (PWAs) are
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Reliability Tests of Lead Free Solder Joints
Reliability of RoHS compliant products is investigated in this study. Emphasis is placed on the lead free solder joint
reliability. Solder is the electrical and mechanical “glue” of electronics
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RoHS Substance Thresholds,Facts and Friction
Meeting RoHS requirements is confusing at best. Currently,RoHS bans the presence of 6 substances,: Lead (Pb),Cadmium (Cd),Mercury (Hg),Hexavalent Chromium (Cr6+),Polybrominated biphenyl (PBB) a
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Utilizing 3D Package Technology for Complex SiP Applications - Innovative Solutions for System Level Integration and Miniaturization
Hand-held communication and entertainment products continue to dominate the consumer markets worldwide,and with each
generation,companies are offering more and more features and/or capability.
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Thermoplastic Injection Molding: New Packages and 3D Circuits
Thermoset epoxies,discovered nearly 80 years ago,remain the workhorse materials for electronic packaging and printed
circuit boards,but this may change with increasing technical,economic and re
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Flip Chip Assembly of Thinned Silicon Die on Flex Substrates
The assembly of thinned silicon die (25-100µm) onto flex substrates provides options for ultra thin,flexible electronics for
applications ranging from smart cards to space-based radars. For hig
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Higher Reliability “Oriented” Plastic Packages
Plastic IC Packages are generally considered to be not as reliable as their ceramic counterparts. One of the major reasons is
the question of hermeticity. Plastic materials generally allow mois
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Reliability of CCGA and PBGA Assemblies
Area Array Packages (AAPs) with 1.27 mm pitch have been the packages of choice for commercial applications; they are now
starting to be implemented for use in military and aerospace application
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Conductive Anodic Filament (CAF) Formation: An Historic Perspective
Conductive Anodic Filament (CAF) is a failure mode in printed wiring boards (PWBs) which occurs under high humidity and
high voltage gradient conditions. The filament,a copper salt,grows from a
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Chinese PCB Industry and the Association
The Chinese printed circuit industry has seen rapid growth in the past years,from barely nothing to more than 6.05 billion
USD production value in 2003. The association of the industry,CPCA,als
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